US2005064626A1PendingUtilityA1

Connection components with anistropic conductive material interconnector

40
Priority: May 9, 2001Filed: Nov 22, 2004Published: Mar 24, 2005
Est. expiryMay 9, 2021(expired)· nominal 20-yr term from priority
Inventors:David LightPaula Lagattuta TostadoMichael Warner
H10W 90/701H10W 70/635H01R 43/007H01R 13/2414
40
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

A connection component for a microelectronic element includes a body of dielectric material having opposing first and second surfaces. A plurality of elongated leads extend through the body between the first and second surfaces. The leads have a first end accessible at the first surface and a second end accessible at the second surface. A layer of anisotropic conductive material overlies the first ends and the first surface of the body for electrical connection of the leads to a microelectronic element.

Claims

exact text as granted — not AI-modified
1 . A method of making a connection component for a microelectronic element, said method comprising providing a body of dielectric material having opposing first and second surfaces and a plurality of elongated leads extending therethrough between said first and second surfaces, said leads having a first end accessible at said first surface and a second end accessible at said second surface, and 
 providing a layer of anisotropic conductive material overlying said first ends and said first surface of said body for electrical connection to a microelectronic element.    
   
   
       2 . The method of  claim 1 , wherein said dielectric material is flexible.  
   
   
       3 . The method of  claim 1 , wherein said dielectric material is rigid.  
   
   
       4 . The method of  claim 1 , further including forming said plurality of leads whereby said first and second ends are offset from each other.  
   
   
       5 . The method of  claim 1 , wherein said anisotropic conductive material is provided in the form of a paste.  
   
   
       6 . The method of  claim 1 , wherein said anisotropic conductive material is provided in the form of a preformed sheet.  
   
   
       7 . The method of  claim 1 , wherein said anisotropic conductive material is an adhesive material.  
   
   
       8 . The method of  claim 1 , further including providing said layer of said anisotropic conductive material on said first surface of said body.  
   
   
       9 . The method of  claim 8 , further including providing said layer of said anisotropic conductive material on said second surface of said body.  
   
   
       10 . The method of  claim 1 , further including forming a plurality of contacts on said first surface in electrical contact with said first ends of said leads.  
   
   
       11 . The method of  claim 10 , further including providing a layer of dielectric material on said second surface of said body.  
   
   
       12 . The method of  claim 11 , further including providing a plurality of conductors extending through said layer of dielectric material in electrical contact with said second ends of said leads.  
   
   
       13 . The method of  claim 12 , wherein said plurality of conductors comprise lined vias.  
   
   
       14 . A method of making a microelectronic package, said method comprising: 
 providing a first microelectronic element having a front face including a plurality of first contact terminals,    forming a body of dielectric material having opposing first and second surfaces and a plurality of elongated leads extending therethrough between said first and second surfaces, said leads having a first end accessible at said first surface and a second end accessible at said second surface,    arranging said first surface of said body opposing said front face of said first microelectronic element,    providing a layer of anisotropic conductive material between said front face of said microelectronic element and said first surface of said body, and    adhering said first microelectronic element to said body whereby said anisotropic conductive material provides electrical continuity between said plurality of contact terminals and said leads.    
   
   
       15 . The method of  claim 14 , further including forming a plurality of contacts on said first surface in electrical contact with said first ends of said leads, said plurality of contacts arranged in alignment with said plurality of contact terminals.  
   
   
       16 . The method of  claim 14 , wherein said anisotropic conductive material is an adhesive material.  
   
   
       17 . The method of  claim 14 , wherein said dielectric material is flexible.  
   
   
       18 . The method of  claim 14 , wherein said dielectric material is rigid.  
   
   
       19 . The method of  claim 14 , further including forming said plurality of leads whereby said first and second ends are offset from each other.  
   
   
       20 . The method of  claim 14 , wherein said anisotropic conductive material is provided in the form of a paste.  
   
   
       21 . The method of  claim 14 , wherein said anisotropic conductive material is provided in the form of a preformed sheet.  
   
   
       22 . The method of  claim 14 , wherein said layer of anisotropic conductive material is applied to said first surface of said body.  
   
   
       23 . The method of  claim 14 , wherein said layer of anisotropic conductive material is applied to said front face of said first microelectronic element.  
   
   
       24 . The method of  claim 14 , wherein said anisotropic conductive material is further applied to said second surface of said body.  
   
   
       25 . The method of  claim 14 , further including providing a layer of dielectric material on said second surface of said body.  
   
   
       26 . The method of  claim 25 , further including providing a plurality of conductors extending through said layer of dielectric material in electrical contact with said second ends of said leads.  
   
   
       27 . The method of  claim 14 , wherein said layer of anisotropic conductive material is rigid.  
   
   
       28 . The method of  claim 14 , wherein said first microelectronic element comprises a semiconductor chip.  
   
   
       29 . The method of  claim 14 , further including a second microelectronic element disposed on said second surface of said body.  
   
   
       30 . The method of  claim 29 , wherein said second microelectronic element includes a plurality of second contact terminals connected to said second ends of said leads.  
   
   
       31 . The method of  claim 30 , further including a layer of anisotropic conductive material on said second surface for electrically connecting said second ends of said leads to said plurality of second contact terminals.  
   
   
       32 . The method of  claim 14 , further including a plurality of contacts integrally formed as a portion of said first ends of said leads adjacent said first surface.  
   
   
       33 . A connector component for a microelectronic element made in accordance with the method of  claim 1 .  
   
   
       34 . A microelectronic package made in accordance with the method of  claim 14.

Join the waitlist — get patent alerts

Track US2005064626A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.