Inventor · disambiguated record
Michael Warner
Also filed as: WARNER MICHAEL · WARNER MICHAEL E
19 granted patents·14 pending applications·1,083 citations·filing 1995–2007
97Inventor score
Top patents by PatentIndex Score
33 records- 0198US7176506B2High frequency chip packages with connecting elementsTESSERA INC·Filed 2003·Granted Feb 13, 2007·320 cites·18 claims
- 0295US6856007B2High-frequency chip packagesTESSERA INC·Filed 2002·Granted Feb 15, 2005·107 cites·18 claims
- 0392US7268426B2High-frequency chip packagesTESSERA INC·Filed 2004·Granted Sep 11, 2007·56 cites·18 claims
- 0492US7224056B2Back-face and edge interconnects for lidded packageTESSERA INC·Filed 2004·Granted May 29, 2007·53 cites·24 claims
- 0592US7149095B2Stacked microelectronic assembliesTESSERA INC·Filed 2002·Granted Dec 12, 2006·65 cites·35 claims
- 0692US6885106B1Stacked microelectronic assemblies and methods of making sameTESSERA INC·Filed 2002·Granted Apr 26, 2005·78 cites·60 claims
- 0791US7012323B2Microelectronic assemblies incorporating inductorsTESSERA INC·Filed 2003·Granted Mar 14, 2006·47 cites·20 claims
- 0890US7061122B2Components, methods and assemblies for multi-chip packagesTESSERA INC·Filed 2003·Granted Jun 13, 2006·44 cites·27 claims
- 0989US7534652B2Microelectronic elements with compliant terminal mountings and methods for making the sameTESSERA INC·Filed 2005·Granted May 19, 2009·19 cites·19 claims
- 1086US7566955B2High-frequency chip packagesTESSERA INC·Filed 2002·Granted Jul 28, 2009·33 cites·21 claims
- 1186US6825552B2Connection components with anisotropic conductive material interconnectionTESSERA INC·Filed 2002·Granted Nov 30, 2004·55 cites·51 claims
- 1281US6873039B2Methods of making microelectronic packages including electrically and/or thermally conductive elementTESSERA INC·Filed 2003·Granted Mar 29, 2005·29 cites·7 claims
- 1379US5512914AAdjustable beam tilt antennaORION INDUSTRIES·Filed 1995·Granted Apr 30, 1996·69 cites·17 claims
- 1476US6608597B1Dual-band glass-mounted antennaALLEN TELECOM INC·Filed 2001·Granted Aug 19, 2003·37 cites·15 claims
- 1571US6081035AMicroelectronic bond ribbon designTESSERA INC·Filed 1996·Granted Jun 27, 2000·42 cites·30 claims
- 1669US6959489B2Methods of making microelectronic packagesTESSERA INC·Filed 2001·Granted Nov 1, 2005·12 cites·22 claims
- 1764US8269319B2Collective and synergistic MRAM shieldsHONER KENNETH ALLEN·Filed 2007·Granted Sep 18, 2012·4 cites·27 claims
- 1856USD472234SVehicle mounted antennaALLEN TELECOM INC·Filed 2002·Granted Mar 25, 2003·9 cites·1 claims
- 1951US7098074B2Microelectronic assemblies having low profile connectionsTESSERA INC·Filed 2003·Granted Aug 29, 2006·4 cites·40 claims
- 2051US2007096295A1Back-face and edge interconnects for lidded packageTESSERA INC·Filed 2006·Application pending·0 cites
- 2151US2007096160A1High frequency chip packages with connecting elementsTESSERA INC·Filed 2006·Application pending·0 cites
- 2250US2006113645A1Microelectronic assemblies incorporating inductorsTESSERA INC·Filed 2006·Application pending·0 cites
- 2349US2007166876A1Components, methods and assemblies for multi-chip packagesTESSERA INC·Filed 2006·Application pending·0 cites
- 2446US2006275951A1Microelectronic assemblies having low profile connectionsTESSERA INC·Filed 2006·Application pending·0 cites
- 2544US2005167814A1Method of making microelectronic packages including electrically and/or thermally conductive elementTESSERA INC·Filed 2005·Application pending·0 cites
- 2643US2005189622A1Packaged acoustic and electromagnetic transducer chipsTESSERA INC·Filed 2005·Application pending·0 cites
- 2743US2005189635A1Packaged acoustic and electromagnetic transducer chipsTESSERA INC·Filed 2005·Application pending·0 cites
- 2841US2007138612A1Stackable electronic device assembly and high G-force test fixtureTESSERA INC·Filed 2006·Application pending·0 cites
- 2940US2005064626A1Connection components with anistropic conductive material interconnectorFiled 2004·Application pending·0 cites
- 3040US2008105963A1Stackable electronic device assemblyTESSERA INC·Filed 2007·Application pending·0 cites
- 3139US2005280134A1Multi-frequency noise suppression capacitor setTESSERA INC·Filed 2005·Application pending·0 cites
- 3239US2006108698A1Microelectronic assemblies and methods of making microelectronic assembliesBEROZ MASUD·Filed 2005·Application pending·0 cites
- 3336US2003048624A1Low-height multi-component assembliesTESSERA INC·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →