Multi-chip module

Abstract

A package and packaging method that incorporates multiple surface-mounted devices mounted to the package, which in turn can be mounted onto a circuit board. The package generally includes a pair of laminate substrates that together form a chip carrier and input/output (I/O) interface structure for the devices. The devices are mounted to opposite surfaces of a first of the substrates. The second substrate is attached to the first substrate, and has an interior opening therethrough. The first and second substrates are attached to each other such that devices mounted on one surface of the first substrate are disposed within the interior opening of the second laminate substrate. A mold compound can be applied to underfill and encapsulate the devices mounted to the surfaces of the first substrate.

1 . A multi-chip module comprising: 
 a first laminate circuit board having a first conductor pattern on a first surface thereof and a second conductor pattern on an oppositely-disposed second surface thereof;    a second laminate circuit board attached to the first laminate circuit board, the second laminate circuit board having an interior opening therethrough and a frame portion surrounding the interior opening, the frame portion having a first surface facing the first laminate circuit board and an oppositely-disposed second surface on which solder terminals are present, the solder terminals of the second laminate circuit board being electrically interconnected with the first and second conductor patterns of the first laminate circuit board through metallized vias through the frame portion of the second laminate circuit board;    first and second slots in the first surface of the second laminate circuit board so as to define first and second lateral openings between the first and second laminate circuit boards, the first and second lateral openings interconnecting the interior opening of the second laminate circuit board with an outer perimeter of the second laminate circuit board;    at least a first flip-chip device on the first surface of the first laminate circuit board and electrically connected to the first conductor pattern with solder connections;    at least a second flip-chip device on the second surface of the first laminate circuit board and electrically connected to the second conductor pattern with solder connections, the first and second laminate circuit boards being attached so that the second flip-chip device is disposed within the interior opening of the second laminate circuit board; and    a molding compound within the interior opening of the second laminate circuit board and both underfilling and encapsulating the second flip-chip device and the solder connections thereof and filling the first and second lateral openings between the first and second laminate circuit boards.    
   
   
       2 . (canceled)  
   
   
       3 . (cancelled)  
   
   
       4 . A multi-chip module according to  claim 1 , wherein the second laminate circuit board and the interior opening therein have rectangular shapes, the first lateral opening interconnects a first corner of the interior opening and an adjacent first corner of the second laminate circuit board, and the second lateral opening interconnects a second corner of the interior opening and an adjacent second corner of the second laminate circuit board, the first corners of the interior opening and the second laminate circuit board being diagonally-opposite the second corners of the interior opening and the second laminate circuit board.  
   
   
       5 . A multi-chip module according to  claim 1 , further comprising a molding compound that encapsulates the first flip-chip device.