Method for producing wedge-wedge wire connection

Abstract

A Ball-Wire Bonder can be used for the production of a wedge-wedge wire connection between first and second connection points when the tearing off of the wire takes place after production of the second wedge connection so that the piece of wire protruding out of the capillary points in the direction of the next wire connection to be made. The following steps are carried out in order to complete the wedge-wedge wire connection by tearing off the wire and to prepare the piece of wire protruding out of the capillary for producing the next wedge-wedge wire connection to be made: calculating a two-dimensional vector v lying in a horizontal plane that points from the desired impact point of the capillary on the first connection point of the next wedge-wedge wire connection to be made towards the desired impact point of the capillary on the second connection point of the next wedge-wedge wire connection to be made, and after attaching the wire to the second connection point, moving the capillary along a travel path that lies in a plane formed by the vector v and the vertical whereby the wire tears off on reaching the end of the travel path.

1 . Method for producing wedge-wedge wire connections each between a first connection point and a second connection point by means of a Wire Bonder, wherein the wire is guided by a capillary that is secured to a horn, whereby a bondhead enables movements of the horn characterized by a total of three degrees of freedom and wherein the following steps are carried out in order to complete the wedge-wedge wire connection by means of tearing off the wire and to prepare the piece of wire protruding out of the capillary for producing a next wedge-wedge wire connection to be made: 
 calculating a two-dimensional vector v lying in a horizontal plane that points from a desired impact point of the capillary on the first connection point of the next wedge-wedge wire connection to be made towards a desired impact point of the capillary on the second connection point of the next wedge-wedge wire connection to be made, and    after attaching the wire to the second connection point, moving the capillary along a travel path that lies in a plane formed by the vector v and the vertical.    
     
     
         2 . Method for producing a wire connection between a first connection point and a second connection point by means of a Wire Bonder, whereby the wire is guided by a capillary that is secured to a horn and whereby the bondhead enables movements of the horn characterized by a total of three degrees of freedom comprising the following steps: 
 melting the piece of wire protruding out of the capillary into a ball,    calculating a two-dimensional vector v lying in a horizontal plane that points from a desired impact point of the capillary on the first connection point towards a desired impact point of the capillary on the second connection point,    formation of a bump on the first connection point by    attaching the ball to the first connection point, and    moving the capillary along a travel path that lies in a plane formed by the vector v and the vertical in order to align and then tear off the wire in the direction of the vector v,    moving the capillary back over the bump that has just been produced,    attaching the piece of wire protruding out of the capillary to the bump,    pulling the wire out to the required length and attaching the wire to the second connection point.