Assignee
UNAXIS INT TRADING LTD
CH·10 granted patents·4 pending applications·54 citations·filing 2004–2008
Top patents by PatentIndex Score
14 records- 0183US7238593B2Method for detaching a semiconductor chip from a foil and device for mounting semiconductor chipsUNAXIS INT TRADING LTD·Filed 2005·Granted Jul 3, 2007·14 cites·6 claims
- 0279US7415759B2Method and apparatus for mounting semiconductor chipsUNAXIS INT TRADING LTD·Filed 2005·Granted Aug 26, 2008·8 cites·2 claims
- 0364US7066373B2Method for aligning the bondhead of a Die BonderUNAXIS INT TRADING LTD·Filed 2004·Granted Jun 27, 2006·12 cites·2 claims
- 0462US7719125B2Method for detaching a semiconductor chip from a foil and device for mounting semiconductor chipsUNAXIS INT TRADING LTD·Filed 2007·Granted May 18, 2010·2 cites·14 claims
- 0560US7396005B2Clamping device and transport mechanism for transporting substratesUNAXIS INT TRADING LTD·Filed 2005·Granted Jul 8, 2008·5 cites·2 claims
- 0657US7353976B2Wire bonderUNAXIS INT TRADING LTD·Filed 2005·Granted Apr 8, 2008·2 cites·8 claims
- 0749US2008301931A1Method And Apparatus For Mounting Semiconductor ChipsUNAXIS INT TRADING LTD·Filed 2008·Application pending·0 cites
- 0841US7134589B2Wire bonder with a downholder for pressing the fingers of a system carrier onto a heating plateUNAXIS INT TRADING LTD·Filed 2004·Granted Nov 14, 2006·7 cites·1 claims
- 0939US7287317B2Apparatus for mounting semiconductor chipsUNAXIS INT TRADING LTD·Filed 2004·Granted Oct 30, 2007·1 cites·1 claims
- 1039US7193727B2Apparatus and method for mounting or wiring semiconductor chipsUNAXIS INT TRADING LTD·Filed 2004·Granted Mar 20, 2007·1 cites·6 claims
- 1138US2005167473A1Method for producing wedge-wedge wire connectionUNAXIS INT TRADING LTD·Filed 2005·Application pending·0 cites
- 1234US2006003096A1Apparatus and method for applying adhesive to a substrateUNAXIS INT TRADING LTD·Filed 2005·Application pending·0 cites
- 1332US2006213956A1Method for producing a wire connectionUNAXIS INT TRADING LTD·Filed 2006·Application pending·0 cites
- 1431US7184909B2Method for calibrating a bondheadUNAXIS INT TRADING LTD·Filed 2004·Granted Feb 27, 2007·2 cites·1 claims
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