Method And Apparatus For Mounting Semiconductor Chips

Abstract

A method for mounting semiconductor chips onto a substrate with which substrate places are arranged in columns, whereby the semiconductor chips adhering to a foil are presented on a wafer table, whereby the detachment of a semiconductor chip from the foil is supported by means of a die ejector and whereby a pick and place device picks the semiconductor chip presented above the die ejector and deposits it onto the substrate comprises: Forward feeding the substrate along a transport direction designated as x direction, Equipping a predetermined number of columns with semiconductor chips in accordance with the steps: Moving the pick and place device to an x position corresponding to the column to be equipped, Moving the die ejector to this x position, and Equipping the substrate places of the column.

1 . An apparatus for mounting semiconductor chips onto a substrate, the apparatus comprising
 a rigidly arranged substrate table with a support surface for supporting a substrate,   a transport device for transporting the substrate along a predetermined transport direction,   a wafer table for presenting a semiconductor chip,   a die ejector for supporting detachment of the semiconductor chip from the wafer table,   a Pick and Place device with a bondhead for picking the semiconductor chip presented above the die ejector and placing the picked semiconductor chip onto the substrate, wherein the die ejector is moveable by a predetermined distance d 0  parallel to the transport direction of the substrate by means of a drive and wherein the wafer table is moveable by a predetermined distance D W =P+d 0  parallel to the transport direction, whereby P designates a diameter of a largest wafer for the accommodation of which the wafer table is designed.