Thick-film dielectric and conductive compositions

Abstract

Conductive powder and paste compositions are formed having desirable electrical and physical properties. The conductive powder and paste compositions may be used in combination with dielectric powder and thick-film paste compositions, which are formed having high dielectric constants, low loss tangents, and other desirable electrical and physical properties, to form capacitors and other fired-on-foil passive circuit components.

1 . A copper-based electrode powder, comprising: 
 copper powder;    cuprous oxide powder; and    lead germanate glass powder.    
     
     
         2 . The electrode powder of  claim 1 , wherein the electrode powder comprises 84-100% by weight of the copper powder.  
     
     
         3 . The copper-based electrode powder of  claim 2 , further comprising: 
 nickel powder in an amount of up to 1% by weight of the copper powder.    
     
     
         4 . The electrode powder of  claim 1 , wherein the electrode powder comprises less than 10% by weight of the cuprous oxide powder.  
     
     
         5 . The electrode powder of  claim 1 , wherein the electrode powder comprises less than 5% by weight of the lead germanate glass powder.  
     
     
         6 . The electrode powder of  claim 1 , comprising: 
 at least one of barium, strontium, calcium, magnesium, manganese and zinc.    
     
     
         7 . The electrode powder of  claim 1 , comprising: 
 at least one of silicon, zirconium, tin or titanium.    
     
     
         8 . A screen-printing copper electrode composition, comprising: 
 the powder compositions of any of claims  1  through  7  dispersed in an organic vehicle.