Assignee
BORLAND WILLIAM J
US·5 granted patents·8 pending applications·38 citations·filing 2004–2011
Top patents by PatentIndex Score
13 records- 0191US8840701B2Multi-element metal powders for silicon solar cellsBORLAND WILLIAM J·Filed 2009·Granted Sep 23, 2014·25 cites·10 claims
- 0289US8697476B2Processes and compositions for forming photovoltaic devices with base metal buss barsBORLAND WILLIAM J·Filed 2011·Granted Apr 15, 2014·8 cites·12 claims
- 0365US8183108B2Glass flux assisted sintering of chemical solution deposited thin dielectric filmsBORLAND WILLIAM J·Filed 2006·Granted May 22, 2012·2 cites·10 claims
- 0464US8294024B2Processes for forming photovoltaic devicesBORLAND WILLIAM J·Filed 2009·Granted Oct 23, 2012·2 cites·17 claims
- 0557US8710355B2Compositions and processes for forming photovoltaic devicesBORLAND WILLIAM J·Filed 2009·Granted Apr 29, 2014·1 cites·17 claims
- 0649US2006287188A1Manganese doped barium titanate thin film compositions, capacitors, and methods of making thereofBORLAND WILLIAM J·Filed 2005·Application pending·0 cites
- 0746US2006254812A1Printed circuit boards having embedded thick film capacitorsBORLAND WILLIAM J·Filed 2006·Application pending·0 cites
- 0843US2008037198A1Methods of forming individual formed-on-foil thin capacitors for embedding inside printed wiring boards and semiconductor packagesBORLAND WILLIAM J·Filed 2006·Application pending·0 cites
- 0941US2008010798A1Thin film dielectrics with co-fired electrodes for capacitors and methods of making thereofBORLAND WILLIAM J·Filed 2006·Application pending·0 cites
- 1041US2007236859A1Organic encapsulant compositions for protection of electronic componentsBORLAND WILLIAM J·Filed 2006·Application pending·0 cites
- 1139US2006120015A1Thick-film capacitors, embedding thick-film capacitors inside printed circuit boards, and methods of forming such capacitors and printed circuit boardsBORLAND WILLIAM J·Filed 2004·Application pending·0 cites
- 1238US2006141225A1Oxygen doped firing of barium titanate on copper foilBORLAND WILLIAM J·Filed 2004·Application pending·0 cites
- 1331US2005204864A1Thick-film dielectric and conductive compositionsBORLAND WILLIAM J·Filed 2004·Application pending·0 cites
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