Control device having improved testing properties

Abstract

The invention relates to a drive electronics for driving a display with a matrix 101 of picture elements. The drive circuit 102 x and 102 y for generating signals for driving the pixels via control lines 103 is provided with signals at the input terminals 110 via contact areas 104 . In addition to the contact areas used for the generation of arbitrary pictures, there exist contact areas 105 used within the framework of a testing method. These contact areas for the testing method are also connected with the input terminals 110 of the drive circuit and are used for generating a test pattern.

1 - 29 . (canceled)  
   
   
       30 . A drive electronics for driving an optoelectronic device with a matrix of picture elements, having a drive circuit ( 102   x ), wherein 
 the drive circuit has input terminals ( 110 ) and output terminals ( 112 );    a first arrangement of contact areas ( 104 ) connected with the input terminals of the drive circuit ( 102   x ); and    a second arrangement of contact areas ( 105 ) connected with the input terminals of the drive circuit ( 102   x ), wherein the contact areas ( 105 ) of the second arrangement of contact areas are larger than the contact areas ( 104 ) of the first arrangement of contact areas.    
   
   
       31 . The drive electronics according to claim  1 , wherein: 
 the number of input terminals of the drive circuit ( 102   x ) by which the drive circuit is connected with the second arrangement of contact areas ( 105 ) is at most 5% of the number of output terminals of the drive circuit by which the drive circuit is connected with the control lines ( 103   x ) of the matrix of picture elements.    
   
   
       32 . The drive electronics according to claim  1 , wherein: 
 the first arrangement of contact areas ( 104 ) serves for picture generation during normal operation; and    the second arrangement of contact areas ( 105 ) serves for pattern generation during test mode.    
   
   
       33 . The drive electronics according to claim  1 , wherein: 
 the second arrangement of contact areas ( 105 ) is connected with the drive circuit ( 102   x ) via the first arrangement of contact areas ( 104 ).    
   
   
       34 . The drive electronics according to claim  4 , wherein: 
 the second arrangement of contact areas ( 105 ) is connected with the drive circuit ( 102   x ) via the first arrangement of contact areas ( 104 ) by means of switching elements or components.    
   
   
       35 . The drive electronics according to claim  4 , wherein: 
 the second arrangement of contact areas ( 105 ) is directly connected with the drive circuit ( 102   x ) via the first arrangement of contact areas ( 104 ).    
   
   
       36 . The drive electronics according to any of claim  1 , wherein: 
 the second arrangement of contact areas ( 105 ) is connected with the drive circuit ( 102   x ) via a test electronics ( 202   x ).    
   
   
       37 . The drive electronics according to any of claim  1 , wherein: 
 the second arrangement of contact areas ( 105 ) is directly connected with the drive circuit.    
   
   
       38 . The drive electronics according to claim  8 , wherein: 
 test circuits are integrated into the drive circuit.    
   
   
       39 . The drive electronics according to claim  1 , wherein 
 the number of second pads ( 105   b ) of the second arrangement of contact areas ( 105 ) is at most 90% of the number of first pads ( 104   b ) of the first arrangement of contact areas ( 104 ), preferably at most 50%, more preferably at most 20%.    
   
   
       40 . The drive electronics according to claim  1 , wherein 
 the second pads ( 105   b ) of the second arrangement of contact areas are larger than the first pads ( 104   b ) of the first arrangement of contact areas.    
   
   
       41 . The drive electronics according to claim  1 , wherein 
 the second pads ( 105   b ) of the second arrangement of contact areas have a dimension of at least 100 μm, preferably a dimension of 0.5 mm, and more preferably a dimension of 2 mm.    
   
   
       42 . An arrangement of test contact areas for providing signals for generating a test pattern to an optoelectronic device comprising a matrix of picture elements, having: 
 at least one pad ( 105   b );    at least one connection ( 105   a ) of the at least on pad with a drive circuit ( 102   x ), which is provided with signals via an arrangement of operational contact areas ( 104 ) during normal operation;    wherein the contact areas ( 105 ) of the second arrangement of contact areas are larger than the contact areas ( 104 ) of the first arrangement of contact areas.    
   
   
       43 . The arrangement according to claim  13 , wherein: 
 the drive circuit has input terminals ( 110 ) and output terminals ( 112 ), and wherein the at least one connection ( 105   a ) is connected with at least one of the input terminals ( 110 ).    
   
   
       44 . The arrangement according to claim  13 , wherein: 
 the at least one pad of the arrangement of contact areas has a dimension of at least 100 μm, preferably a dimension of 0.5 mm, and more preferably a dimension of 2 mm.    
   
   
       45 . The arrangement according to claim  13 , wherein: 
 the number of pads ( 105   b ) of the arrangement of test contact areas ( 105 ) is at most 90% of the number of pads ( 104   b ) of the arrangement of operational contact areas ( 104 ), preferably at most 50%, and more preferably at most 20%.    
   
   
       46 . The arrangement according to claim  13 , wherein: 
 the arrangement of test contact areas ( 105 ) is connected with the drive circuit ( 102   x ) via the arrangement of operational contact areas ( 104 ).    
   
   
       47 . The arrangement according to claim  13 , wherein: 
 the arrangement of test contact areas is connected with the drive circuit ( 102   x ) via a test electronics ( 202   x ).    
   
   
       48 . The arrangement according to claim  13 , wherein: 
 the arrangement of test contact areas is directly connected with the drive circuit ( 102   x ).    
   
   
       49 . An optoelectronic device having 
 a matrix of picture elements ( 101 );    a drive electronics according to any of claim  1 .    
   
   
       50 . A method for testing an optoelectronic device, comprising the steps of: 
 a) contact is made between an external control and an arrangement of test contact areas which are larger than operational contact areas;    b) an input terminal of a drive circuit is provided with input signals via the arrangement of test contact areas to generate a test pattern on a matrix of picture elements; and    c) the picture elements of the matrix of picture elements are tested.    
   
   
       51 . The testing method according to claim  21 , wherein 
 the input signals generate a periodic test pattern.    
   
   
       52 . The testing method according to claim  21 , wherein 
 the input signals generate a vertically, horizontally or diagonally periodic test pattern.    
   
   
       53 . The testing method according to claim  21 , wherein: 
 the picture elements are tested with a beam of charged particles or laser radiation.    
   
   
       54 . The testing method according to claim  21 , comprising the further step of: 
 a vacuum is generated in the vicinity of the optoelectronic device to be tested.    
   
   
       55 . The testing method according to claim  21 , wherein step c) comprises the following steps: 
 c1) the picture elements in a portion of the matrix of picture elements are tested;    c2) the optoelectronic device is shifted; and    c3) the picture elements in a further portion of the matrix of picture elements are tested.    
   
   
       56 . A method for manufacturing a drive electronics of an optoelectronic device having a matrix of picture elements, comprising the steps 
 a) a drive circuit is provided;    b) control lines of the matrix of picture elements are connected with output terminals of the drive circuit;    c) a first arrangement of contact areas is provided;    d) the first arrangement of contact areas is connected with input terminals of the drive circuit;    e) a second arrangement of contact areas is provided, said contact areas being larger than the contact areas of said first arrangement of contact areas; and    f) the second arrangement of contact areas is connected with input terminals of the drive circuit.    
   
   
       57 . An optoelectronic device, which has been tested by a testing method according to claim  21  or by an apparatus according to claim  1 .