Tape automated bonding with strip carrier frame assembly

Abstract

In one embodiment of the invention, a die is bonded on a strip carrier frame having a carrier alignment landmark. A tape automated bonding (TAB) strip having a TAB alignment landmark is aligned with the strip carrier frame. The TAB strip is bonded to the strip carrier frame to form a bonded unit.

1 . A method comprising: 
 bonding a die on a strip carrier frame, the strip carrier frame having a carrier alignment landmark;    aligning a tape automated bonding (TAB) strip with the strip carrier frame, the TAB strip having a TAB alignment landmark; and    bonding the TAB strip to the strip carrier frame to form a bonded unit.    
   
   
       2 . The method of  claim 1  further comprises: 
 isolating the bonded unit from the strip carrier frame.    
   
   
       3 . The method of  claim 1  wherein bonding the die on the strip carrier frame comprises: 
 attaching the die to a die area on the strip carrier frame using a first adhesive to form a bonded die; and    curing the bonded die.    
   
   
       4 . The method of  claim 1  wherein aligning comprises: 
 positioning the carrier alignment landmark to correspond to the TAB alignment landmark.    
   
   
       5 . The method of  claim 1  wherein bonding the TAB strip to the strip carrier frame comprises: 
 attaching a first portion of the TAB strip to the strip carrier frame using a second adhesive at a peripheral area, the first portion having a first inner lead;    curing the attached first portion of the TAB strip; and    forming a first inner lead bond (ILB) between the first inner lead to the die at a first ILB pad using a single point inner lead bonder, the first ILB corresponding to a fan-out trace.    
   
   
       6 . The method of  claim 5  further comprising: 
 attaching a second portion of the TAB strip to the die using a third adhesive at the die area, the second portion having a second inner lead;    curing the attached second portion of the TAB strip; and    forming a second ILB between the second inner lead to the die at one of the first ILB pad and a second ILB pad using the single point inner lead bonder, the second ILB corresponding to a fan-in trace.    
   
   
       7 . The method of  claim 1  further comprising: 
 attaching a plurality of solder bumps to the TAB strip to provide interconnections.    
   
   
       8 . The method of  claim 7  further comprising: 
 attaching a layer having to the plurality of solder bumps, the layer having an element electrically connected to the die via the solder bumps.    
   
   
       9 . The method of  claim 2  wherein isolating comprises: 
 punching out the bonded unit using one of a pouching mold and a dicing tool.    
   
   
       10 - 21 . (canceled)