US2005227411A1PendingUtilityA1

Methods for fabricating electronic components to include supports for conductive structures

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Individually held — no corporate assignee on recordPriority: Jun 8, 2000Filed: Jun 6, 2005Published: Oct 13, 2005
Est. expiryJun 8, 2020(expired)· nominal 20-yr term from priority
Inventors:Ford B. Grigg
B33Y 30/00B33Y 80/00H05K 2201/10977H10W 90/701H10W 72/9415H10W 72/07236H10W 72/01261H10W 72/952H10W 72/0711H10W 72/283H10W 72/252H10W 72/251H10W 72/90H10W 72/20H10W 72/012H10W 70/687H10D 64/011H05K 3/3436Y02P70/50
43
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Claims

Abstract

A method for fabricating an electronic component, such as a semiconductor device, carrier, or other semiconductor device component, includes providing a support around at least a portion of a contact of the electronic component. The support is configured to receive at least a portion of a conductive structure that is to be secured to the contact. The support may also be configured to define a shape of at least a portion of the conductive structure. The support may be preformed, then placed on the electronic component, or formed on the electronic component. A programmed material consolidation process may be used to form the support.

Claims

exact text as granted — not AI-modified
1 . A method for fabricating an electronic component, comprising: 
 providing the electronic component with at least one contact exposed at a surface thereof; and    disposing at least one support around at least a portion of the at least one contact, the at least one support being configured to support and define a shape of at least a base portion of a conductive structure to be secured to the at least one contact pad.    
     
     
         2 . The method of  claim 1 , wherein disposing comprises disposing the at least one support such that at least a portion of the at least one contact is exposed through the at least one support.  
     
     
         3 . The method of  claim 2 , wherein disposing comprises disposing at least one support which is configured to contact at least the base portion of the conductive structure.  
     
     
         4 . The method of  claim 2 , further comprising: 
 forming a conductive structure on the at least one contact through the at least one support.    
     
     
         5 . The method of  claim 1 , wherein disposing comprises fabricating the at least one support on the surface.  
     
     
         6 . The method of  claim 5 , wherein fabricating comprises selectively consolidating previously unconsolidated material.  
     
     
         7 . The method of  claim 6 , wherein selectively consolidating comprises sequentially forming a plurality of adjacent, mutually adhered regions.  
     
     
         8 . The method of  claim 1 , wherein providing comprises providing at least one semiconductor wafer carrying a plurality of semiconductor devices.  
     
     
         9 . The method of  claim 1 , wherein providing comprises providing at least one carrier substrate.  
     
     
         10 . The method of  claim 1 , wherein disposing comprises adhering at least one preformed support to the surface.  
     
     
         11 . A method for fabricating an electronic component, comprising: 
 providing the electronic component with at least one contact exposed at a surface thereof; and    sequentially forming a plurality of adjacent, mutually adhered regions of at least one support at least partially around the at least one contact, the at least one support being configured to laterally support at least a portion of a conductive structure securable to the at least one contact.    
     
     
         12 . The method of  claim 11 , wherein providing the electronic component comprises providing at least one wafer carrying a plurality of semiconductor devices.  
     
     
         13 . The method of  claim 11 , wherein providing the electric component comprises providing at least one carrier substrate.  
     
     
         14 . The method of  claim 11 , further comprising: 
 forming the conductive structure on the at least one contact following at least a portion of sequentially forming.    
     
     
         15 . The method of  claim 11 , wherein sequentially forming is effected in accordance with a program.  
     
     
         16 . The method of  claim 11 , wherein sequentially forming comprises selectively consolidating a previously unconsolidated material.  
     
     
         17 . A method for fabricating an electronic component, comprising: 
 selectively consolidating material to form at least one support at least partially around or on at least a portion of at least one contact on a surface of a substrate of the electronic component, the at least one support being configured to laterally support at least a portion of a conductive structure securable to the at least one contact.    
     
     
         18 . The method of  claim 17 , wherein selectively consolidating is effected in accordance with a program.  
     
     
         19 . The method of  claim 17 , further comprising: 
 recognizing a location and orientation of the at least one electronic component or a feature thereof.    
     
     
         20 . The method of  claim 19 , wherein recognizing comprises recognizing a location or orientation of the at least one contact.  
     
     
         21 . The method of  claim 19 , further comprising: 
 storing data including at least one physical parameter of the at least one electronic component or a feature thereof in computer memory and using the stored data in conjunction with a machine vision system to recognize a location and orientation of the at least one contact pad.    
     
     
         22 . The method of  claim 21 , wherein storing data includes storing data of the at least one contact around or on which the at least one support is to be fabricated.  
     
     
         23 . The method of  claim 21 , further comprising: 
 using the stored data, in conjunction with the machine vision system, to effect the selectively consolidating.

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