Plating apparatus and method

Abstract

The present invention comprises a metal plating apparatus and method, particularly suitable for autocatalytic (i.e., electroless) plating, comprising a pressurized sealable vessel for disposing a substrate to be plated and for the circulation of plating solutions wherein temperatures and pressure are highly controllable.

1 . A plating apparatus comprising: 
 a pressurized, sealable vessel;    a controllable plating fluid source linked to said vessel;    a holding apparatus to secure a substrate within said vessel during plating of the substrate and until the plating of the substrate is complete; and    at least one opening through which one or more plating fluids pass in and out of said vessel.    
     
     
         2 . The apparatus of  claim 1  wherein the plating of the substrate comprises autocatalytic plating.  
     
     
         3 . The apparatus of  claim 1  wherein the substrate comprises a semiconductor wafer.  
     
     
         4 . The apparatus of  claim 1  wherein said linked controllable source and vessel comprise a closed system.  
     
     
         5 . The apparatus of  claim 1  further comprising a pressure control system to control a pressure of said plating fluid within said vessel to control isostatic pressure.  
     
     
         6 . The apparatus of  claim 1  wherein said controllable source comprises a system for the discreet, sequential introduction and removal of said plating fluids into and from said vessel.  
     
     
         7 . The apparatus of  claim 6  wherein said system comprises a plurality of nozzles and conduits.  
     
     
         8 . The apparatus of  claim 7  wherein said system comprises a sequentially rotating nozzle system.  
     
     
         9 . The apparatus of  claim 1  further comprising a temperature control system.  
     
     
         10 . The apparatus of  claim 9  wherein said temperature control system controls a temperature to within approximately ±1° C.  
     
     
         11 . The apparatus of  claim 9  wherein said temperature control system heats or cools said plating fluid at a rate faster than approximately 0.5° C. per second.  
     
     
         12 . The apparatus of  claim 11  wherein said temperature control system heats or cools said plating fluid at a rate faster than approximately 1.0° C. per second.  
     
     
         13 . The apparatus of  claim 12  wherein said temperature control system heats or cools said plating fluid at a rate faster than approximately 2.5° C. per second.  
     
     
         14 . The apparatus of  claim 9  wherein said temperature control system is disposed outside of said vessel to affect a temperature of said plating fluid prior to said plating fluid entering said vessel.  
     
     
         15 . The apparatus of  claim 9  wherein said temperature control system is disposed over said vessel.  
     
     
         16 . The apparatus of  claim 9  wherein said temperature control system is disposed in said vessel.  
     
     
         17 . The apparatus of  claim 16  wherein said temperature control system is disposed in at least one wall of said vessel.  
     
     
         18 . The apparatus of  claim 1  wherein said vessel comprises a volume of less than approximately 5 liters.  
     
     
         19 . The apparatus of  claim 18  wherein said vessel comprises a volume of less than approximately 3 liters.  
     
     
         20 . The apparatus of  claim 19  wherein said vessel comprises a volume of less than approximately 2 liters.  
     
     
         21 . The apparatus of  claim 20  wherein a cell of said vessel comprises a volume of less than approximately 1 liter.  
     
     
         22 . The apparatus of  claim 21  wherein said vessel comprises a volume of less than approximately 0.5 liter.  
     
     
         23 . The apparatus of  claim 1  further comprising a baffle system disposed within said vessel.  
     
     
         24 . The apparatus of  claim 1  further comprising a cathode disposed in said vessel.  
     
     
         25 . The apparatus of  claim 1  wherein said vessel comprises: 
 a base plate; and    a cover removably disposed on said base plate.    
     
     
         26 . The apparatus of  claim 1  wherein said holding apparatus comprises a vacuum chuck.  
     
     
         27 . The apparatus of  claim 26  wherein said vacuum chuck comprises: 
 a base; and    at least one vacuum cavity in said base.    
     
     
         28 . The apparatus of  claim 27  further comprising at least one membrane disposed over said at least one cavity.  
     
     
         29 . The apparatus of  claim 28  wherein said membrane comprises a membrane that is deformable in response to a vacuum.  
     
     
         30 . The apparatus of  claim 29  wherein said membrane comprises an elastomeric material.  
     
     
         31 . The apparatus of  claim 27 , said vacuum chuck further comprising a center shuttle disposed in said base.  
     
     
         32 . The apparatus of  claim 27  further comprising an edge seal boot disposed on said base.  
     
     
         33 . The apparatus of  claim 32  wherein said edge seal boot comprises an edge skirt to contact the substrate and seal a portion of the substrate.  
     
     
         34 . The apparatus of  claim 33  further comprising an electric bridge contact disposed in said edge skirt.  
     
     
         35 . The apparatus of  claim 34  wherein said electric bridge contact comprises an array of contacts.  
     
     
         36 . A method for depositing metal on a substrate comprising the steps of: 
 providing a pressurized, sealable vessel;    securing the substrate within the vessel;    introducing one or more plating fluids into the vessel;    removing the one or more plating fluids from the vessel; and    removing the substrate from the vessel after the metal has been deposited on the substrate.    
     
     
         37 . The method of  claim 36  further comprising; 
 introducing the plating fluids discreetly and sequentially; and    removing the plating fluids discreetly and sequentially.    
     
     
         38 . The method of  claim 36  further comprising controlling an isostatic pressure within the vessel.  
     
     
         39 . The method of  claim 36  further comprising the steps of: 
 disposing a cathode in the vessel; and    sending an electrical current to the cathode.    
     
     
         40 . The method of  claim 36  further comprising controlling a temperature of at least one of the plating fluids.  
     
     
         41 . The method of  claim 40  comprising controlling the temperature to within approximately ±1° C.  
     
     
         42 . The method of  claim 40  comprising heating or cooling at least one of the plating fluids at a rate faster than approximately 0.5° C. per second.  
     
     
         43 . The method of  claim 42  comprising heating or cooling at least one of the plating fluids at a rate faster than approximately 1.0° C. per second.  
     
     
         44 . The method of  claim 43  comprising heating or cooling at least one of the plating fluids at a rate faster than approximately 2.5° C. per second.  
     
     
         45 . The method of  claim 40  further comprising affecting the temperature of the at least one fluid before introducing it into the vessel.  
     
     
         46 . The method of  claim 40  further comprising affecting the temperature of the at least one fluid inside the vessel.  
     
     
         47 . The method of  claim 36  further comprising the steps of: 
 providing a baffle system; and    affecting the flow of the at least one fluid within the vessel using the baffle system.    
     
     
         48 . The method of  claim 36  further comprising the steps of: 
 providing a holding apparatus; and    disposing the holding apparatus in the vessel; and    wherein the holding apparatus secures the substrate within the vessel.    
     
     
         49 . The method of  claim 48  wherein the holding system comprises a vacuum chuck comprising at least one vacuum cavity.  
     
     
         50 . The method of  claim 49  further comprising the steps of: 
 disposing a deformable membrane on the at least one cavity; and    disposing the substrate on the membrane.    
     
     
         51 . The method of  claim 50  further comprising applying a vacuum to secure the substrate to the vacuum chuck.  
     
     
         52 . The method of  claim 49  further comprising the steps of: 
 providing a boot comprising an edge skirt; and    disposing the boot on the vacuum chuck.    
     
     
         53 . The method of  claim 52  further comprising the steps of: 
 disposing an electrical bridge contact in the boot; and    sending an electrical current through the bridge contact.