Inventor · disambiguated record
Martin Bleck
Also filed as: BLECK MARTIN · BLECK MARTIN C
14 granted patents·9 pending applications·666 citations·filing 1995–2006
95Inventor score
Files withSEMITOOL INC12HANSEN ERIC4SCP GLOBAL TECHNOLOGIES INC2APPLIED MATERIALS INC1SURFECT TECHNOLOGIES INC1
Top patents by PatentIndex Score
23 records- 0194US6342137B1Lift and rotate assembly for use in a workpiece processing station and a method of attaching the sameSEMITOOL INC·Filed 2000·Granted Jan 29, 2002·66 cites·9 claims
- 0294US5985126ASemiconductor plating system workpiece support having workpiece engaging electrodes with distal contact part and dielectric coverSEMITOOL INC·Filed 1997·Granted Nov 16, 1999·121 cites·28 claims
- 0392US6168695B1Lift and rotate assembly for use in a workpiece processing station and a method of attaching the sameFiled 1999·Granted Jan 2, 2001·97 cites·19 claims
- 0492US5762751ASemiconductor processor with wafer face protectionSEMITOOL INC·Filed 1995·Granted Jun 9, 1998·120 cites·41 claims
- 0591US6726848B2Apparatus and method for single substrate processingSCP GLOBAL TECHNOLOGIES INC·Filed 2001·Granted Apr 27, 2004·56 cites·120 claims
- 0690US6322677B1Lift and rotate assembly for use in a workpiece processing station and a method of attaching the sameSEMITOOL INC·Filed 2000·Granted Nov 27, 2001·40 cites·7 claims
- 0787US5980706AElectrode semiconductor workpiece holderSEMITOOL INC·Filed 1996·Granted Nov 9, 1999·73 cites·21 claims
- 0876US6746565B1Semiconductor processor with wafer face protectionSEMITOOL INC·Filed 2000·Granted Jun 8, 2004·19 cites·7 claims
- 0975US6358388B1Plating system workpiece support having workpiece-engaging electrodes with distal contact-part and dielectric coverSEMITOOL INC·Filed 1999·Granted Mar 19, 2002·35 cites·33 claims
- 1072US6663762B2Plating system workpiece support having workpiece engaging electrodeSEMITOOL INC·Filed 2002·Granted Dec 16, 2003·11 cites·35 claims
- 1162US6274013B1Electrode semiconductor workpiece holderSEMITOOL INC·Filed 1999·Granted Aug 14, 2001·21 cites·10 claims
- 1249US2007119544A1Apparatus and method for single substrate processing using megasonic-assisted dryingHANSEN ERIC·Filed 2006·Application pending·0 cites
- 1347US2005230260A1Plating apparatus and methodSURFECT TECHNOLOGIES INC·Filed 2005·Application pending·0 cites
- 1443US2005061675A1Semiconductor plating system workpiece support having workpiece-engaging electrodes with distal contact part and dielectric coverFiled 2003·Application pending·0 cites
- 1541US6022484ASemiconductor processor with wafer face protectionSEMITOOL INC·Filed 1998·Granted Feb 8, 2000·7 cites·23 claims
- 1641US2009029560A1Apparatus and method for single substrate processingAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 1741US2004198051A1Apparatus and method for single substrate processingFiled 2004·Application pending·0 cites
- 1840US6733649B2Electrochemical processing methodSEMITOOL INC·Filed 2001·Granted May 11, 2004·0 cites·9 claims
- 1938US2007272657A1Apparatus and method for single substrate processingHANSEN ERIC·Filed 2006·Application pending·0 cites
- 2038US2006148267A1Apparatus and method for single-or double-substrate processingHANSEN ERIC·Filed 2002·Application pending·0 cites
- 2138US2008000495A1Apparatus and method for single substrate processingHANSEN ERIC·Filed 2006·Application pending·0 cites
- 2237US2004178065A1Electrode semiconductor workpiece holder and processing methodsSEMITOOL INC·Filed 2004·Application pending·0 cites
- 2336US6843859B1Dump doorSCP GLOBAL TECHNOLOGIES INC·Filed 2002·Granted Jan 18, 2005·0 cites·26 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →