Semiconductor component handling device having a performance film

Abstract

The present invention relates generally to a system and method for including a thin protective containment thermopolymer film ( 10 ), such as PEEK, in the molding process for handlers, transporters, carriers, trays and like devices utilized in the semiconductor processing industry. The thermoplastic film ( 10 ) of predetermined size and shape is selectively placed along a shaping surface ( 26 ) in a mold cavity ( 22 ) for alignment with a desired target surface of a moldable material. The film is permanently adhered to the moldable material. As a result, a compatible polymer film ( 10 ) can be selectively bonded only to those target surfaces where performance characteristics such as abrasion resistance, heat resistance, chemical resistance, outgassing containment, rigidity enhancement, hardness, creep reduction, fluid absorption containment, and the like is needed.

1 . A semiconductor wafer handling device, comprising: 
 at least one substantially rigid thermoplastic component structure making up a part of the wafer handling device; and    at least one protective thermoplastic film bonded to a portion of the at least one thermoplastic component structure using an insert molding process to introduce containment characteristics to the semiconductor wafer handling device;    
   
   
       2 . The device of  claim 1 , wherein the at least one protective thermoplastic film includes a film having containment characteristics selected from a group consisting of: abrasion resistance, chemical resistance, heat resistance, ultraviolet protection, fluid absorption barrier characteristics, and outgassing barrier characteristic.  
   
   
       3 . The device of  claim 2 , wherein the at least one protective thermoplastic film is a film laminate having at least two film layers such that at least one of the at least two film layers is the protective film.  
   
   
       4 . The device of  claim 3 , wherein the at least two film layers each have different containment characteristics.  
   
   
       5 . The device of  claim 3 , wherein at least one of the at least two film layers is an intermediate tie layer for improving the bond strength between the protective film and the at least one thermoplastic component structure.  
   
   
       6 . The device of  claim 1 , wherein the at least one thermoplastic component structure is a support structure having a plurality of spaced support shelves adapted to receive semiconductor wafers.  
   
   
       7 . The device of  claim 1 , wherein the at least one thermoplastic component structure is a kinematic coupling adapted for mechanical communication with semiconductor processing equipment.  
   
   
       8 . The device of  claim 1 , wherein the at least one thermoplastic component structure is a handling flange adapted for selective engageable communication with a robotic device.  
   
   
       9 . The device of  claim 1 , wherein the at least one thermoplastic component structure is a body shell portion of the wafer handling device.  
   
   
       10 . The device of  claim 1 , wherein the at least one protective thermoplastic film is substantially translucent.  
   
   
       11 . The device of  claim 1 , wherein the at least one protective film is constructed substantially of a material selected from the group consisting of: polyester, polyimide, polyether imide, polyetheretherketone, perfluoroalkoxy resin, fluorinated ethylene propylene copolymer, polyvinylidene fluoride, polymethyl methacrylate, polyether sulfone, polystyrene, and polyphenylene sulfide.  
   
   
       12 . The device of  claim 1 , wherein the at least one protective film is constructed substantially of polyetheretherketone.  
   
   
       13 . A device for handling semiconductor components, comprising: 
 a first substantially rigid thermoplastic portion of the handling device; and    at least one thermoplastic containment film bonded to at least a portion of the first thermoplastic component by way of a film insert molding process, wherein the thermoplastic containment film provides protection for the sensitive semiconductor components during semiconductor component processing.    
   
   
       14 . The device of  claim 13 , wherein the first thermoplastic portion is a portion of a semiconductor wafer handling device, the wafer handling device including a body shell, and a wafer support structure for receiving semiconductor wafers.  
   
   
       15 . The device of  claim 14 , wherein the at least one thermoplastic containment film is bonded to at least a portion of the wafer support structure to minimize the dispersement of damaging particulates into the air.  
   
   
       16 . The device of  claim 13 , wherein the first thermoplastic portion is a portion of a semiconductor chip handling tray, the tray including a plurality of recesses adapted to receive semiconductor chips, and a plurality of peripheral side wall sections.  
   
   
       17 . The device of  claim 16 , wherein at least one of the peripheral side wall sections is adapted for matable stackable engagement with a separate semiconductor chip handling device.  
   
   
       18 . The device of  claim 17 , wherein the at least one containment film is bonded to a plurality of the recesses and to the at least one of the peripheral side wall sections to minimize the dispersement of damaging particulates into the air.  
   
   
       19 . The device of  claim 13 , wherein the at least one containment film is a film laminate comprising a plurality of film layers, wherein at least one of the film layers is the containment film.  
   
   
       20 . The device of  claim 19 , wherein each of the film layers of the film laminate have distinct protective characteristics.  
   
   
       21 . The device of  claim 20 , wherein each of the film layers of the film laminate have distinct protective characteristics, each selected from the group consisting of: abrasion resistance, chemical resistance, heat resistance, ultraviolet protection, fluid absorption barrier characteristics, and outgassing barrier characteristic.  
   
   
       22 . The device of  claim 13 , wherein the at least one containment film has a protective characteristic selected from the group consisting of: abrasion resistance, chemical resistance, heat resistance, ultraviolet protection, fluid absorption barrier characteristics, and outgassing barrier characteristic.  
   
   
       23 . The device of  claim 13 , wherein the at least one containment film is constructed substantially of a material selected from the group consisting of: polyester, polyimide, polyether imide, polyetheretherketone, perfluoroalkoxy resin, fluorinated ethylene propylene copolymer, polyvinylidene fluoride, polymethyl methacrylate, polyether sulfone, polystyrene, and polyphenylene sulfide.  
   
   
       24 . The device of  claim 13 , wherein the at least one containment film is constructed substantially of polyetheretherketone.  
   
   
       25 . A method of film insert molding an semiconductor handling device component through meltably bonding of at least one containment thermoplastic film to at least a portion of a thermoplastic material, comprising the steps of: 
 forming at least one containment thermoplastic film;    accessing a molding unit having a mold cavity, the mold cavity including at least one shaping surface;    positioning the at least one formed containment thermoplastic film within the cavity of the molding unit along at least a portion of the at least one shaping surface;    injecting a substantially molten thermoplastic material into the cavity of the molding unit to conform to the shape of the at least one shaping surface;    waiting a cooling period wherein the thermoplastic material substantially solidifies to matably bond with the at least one containment thermoplastic film to generate a protective containment surface on the semiconductor handling device component; and    ejecting the semiconductor handling device component from the molding unit.    
   
   
       26 . The method of  claim 25 , wherein the molding of the semiconductor handling device component forms a component part of a semiconductor wafer handling device.  
   
   
       27 . The method of  claim 26 , wherein the molding of the semiconductor handling device component forms a support structure of the semiconductor wafer handling device, the support structure having a plurality of spaced support shelves, wherein the at least one containment thermoplastic film is bonded to a portion of the spaced support shelves.  
   
   
       28 . The method of  claim 25 , wherein the molding of the semiconductor handling device component forms a component part of a semiconductor chip handling tray having a plurality of chip receiving recesses, wherein the at least one containment thermoplastic film is bonded to the plurality of chip receiving recesses to minimize the release of particulates into the air during use.  
   
   
       29 . The method of  claim 25 , wherein the molding of the semiconductor handling device component forms a component part of a semiconductor chip handling tray having a plurality of chip receiving recesses and peripheral side walls, wherein the at least one containment thermoplastic film is bonded to at least a portion of the peripheral side walls to minimize the release of particulates into the air during use.  
   
   
       30 . The method of  claim 25 , wherein forming the at least one containment thermoplastic film includes thermoforming a multi-layer film laminate wherein at least one of the film layers is a containment thermoplastic film.  
   
   
       31 . The method of  claim 30 , wherein the multi-layer film laminate includes at least two film layers, wherein a first one of the at least two film layers has a containment characteristic different than a second one of the at least two film layers.  
   
   
       32 . The method of  claim 25 , wherein forming the at least one containment thermoplastic film includes forming a substantially translucent at least one containment thermoplastic film.  
   
   
       33 . The method of  claim 25 , wherein the at least one containment film has a protective characteristic selected from the group consisting of: abrasion resistance, chemical resistance, heat resistance, ultraviolet protection, fluid absorption barrier characteristics, and outgassing barrier characteristic.  
   
   
       34 . The method of  claim 25 , wherein forming the at least one containment thermoplastic film includes forming the at least one containment film substantially constructed of a material selected from the group consisting of: polyester, polyimide, polyether imide, polyetheretherketone, perfluoroalkoxy resin, fluorinated ethylene propylene copolymer, polyvinylidene fluoride, polymethyl methacrylate, polyether sulfone, polystyrene, and polyphenylene sulfide.  
   
   
       35 . The method of  claim 25 , wherein forming the at least one containment thermoplastic film includes forming the at least one containment film substantially constructed of a polyetheretherketone material.  
   
   
       36 . A semiconductor chip handling tray, comprising: 
 a plurality of recessed portions capable of receiving semiconductor components;    an outside perimeter wall portion adapted to promote stackability with other semiconductor chip handling trays; and    at least one containment thermoplastic film adheringly bonded with an insert molding process to a plurality of the recessed portions to provide surface protection during use.    
   
   
       37 . The chip handling tray of  claim 36 , wherein the at least one containment thermoplastic film is further molded to at least a portion of the outside perimeter wall portion of the chip handling tray to minimize release of particulates into the air during use.  
   
   
       38 . The chip handling tray of  claim 36 , wherein the at least one containment film has a protective characteristic selected from the group consisting of: abrasion resistance, chemical resistance, heat resistance, ultraviolet protection, fluid absorption barrier characteristics, and outgassing barrier characteristic.  
   
   
       39 . The chip handling tray of  claim 36 , wherein the at least one containment film is substantially translucent.  
   
   
       40 . The chip handling tray of  claim 36 , wherein the at least one containment film is constructed substantially of a material selected from the group consisting of: polyester, polyimide, polyether imide, polyetheretherketone, perfluoroalkoxy resin, fluorinated ethylene propylene copolymer, polyvinylidene fluoride, polymethyl methacrylate, polyether sulfone, polystyrene, and polyphenylene sulfide.  
   
   
       41 . The chip handling tray of  claim 36 , wherein the at least one containment film is constructed substantially of polyetheretherketone.  
   
   
       42 . A film insert molding system for molding at least a portion of a semiconductor component handling device with at least one containment film, comprising: 
 a quantity of substantially molten thermoplastic material for shaping at least a portion of the semiconductor handling device;    a molding unit having a molding cavity and at least one shaping surface, the molding cavity and the at least one shaping surface adapted to receive the quantity of substantially molten thermoplastic material; and    at least one containment film insertable within the molding cavity along at least a portion of the at least one shaping surface for permanent bonding to the quantity of substantially molten thermoplastic material during the molding process.    
   
   
       43 . The system of  claim 42 , wherein the at least one containment film has a protective characteristic selected from the group consisting of: abrasion resistance, chemical resistance, heat resistance, ultraviolet protection, fluid absorption barrier characteristics, and outgassing barrier characteristics.  
   
   
       44 . The system of  claim 42 , wherein the at least one containment film is substantially translucent.  
   
   
       45 . The system of  claim 42 , wherein the at least one containment film is constructed substantially of a material selected from the group consisting of: polyester, polyimide, polyether imide, polyetheretherketone, perfluoroalkoxy resin, fluorinated ethylene propylene copolymer, polyvinylidene fluoride, polymethyl methacrylate, polyether sulfone, polystyrene, and polyphenylene sulfide.  
   
   
       46 . The system of  claim 42 , wherein the at least one containment film is constructed substantially of polyetheretherketone.  
   
   
       47 . A device for handling semiconductor components, comprising: 
 a first thermoplastic portion of the handling device; and    at least one thermoplastic dimensionally stabilizing film bonded to at least a portion of the first thermoplastic component by way of a film insert molding process.    
   
   
       48 . The device of  claim 47 , wherein the at least one thermoplastic dimensionally stabilizing film reduces creep for the at least a portion of the first thermoplastic portion.  
   
   
       49 . The device of  claim 47 , wherein the at least one thermoplastic dimensionally stabilizing film provides increased rigidity benefits for the at least a portion of the first thermoplastic portion.  
   
   
       50 . The device of  claim 47 , wherein the at least one thermoplastic dimensionally stabilizing film provides increased hardness benefits for the at least a portion of the first thermoplastic portion.  
   
   
       51 . The device of  claim 47 , wherein the at least one dimensionally stabilizing film is constructed substantially of a material selected from the group consisting of: polyester, polyimide, polyether imide, polyetheretherketone, perfluoroalkoxy resin, fluorinated ethylene propylene copolymer, polyvinylidene fluoride, polymethyl methacrylate, polyether sulfone, polystyrene, and polyphenylene sulfide.  
   
   
       52 . The device of  claim 47 , wherein the at least one dimensionally stabilizing film is constructed substantially of polyetheretherketone.