Manufacturing tool for wafer level package and method of placing dies

Abstract

A tool of wafer level package comprises a first base, an elastic material and a second base. The elastic material is coated on the first base, and the elastic material has viscosity in common state to adhere a plurality of dies. The second base is coated by adhesive material to adhere the dies. The plurality of dies are departed from the elastic material by a special environment after adhering.

1 . A tool for wafer level package, comprising: 
 a first base;    an elastic material on said first base, said elastic material having viscosity in a first condition to adhere a die; and    a second base having adhesive material to adhere said die, said die could be departed from said elastic material in a second condition.    
     
     
         2 . The tool in  claim 1 , wherein material of said first base is silicon, glass, quartz or ceramic.  
     
     
         3 . The tool in  claim 1 , wherein material of said second base is silicon, glass, quartz, ceramic, or PCB.  
     
     
         4 . The tool in  claim 1 , wherein said second base is lead-frame.  
     
     
         5 . The tool in  claim 1 , wherein material of said elastic material is silicon resin, elastic PU, porous PU, acrylic rubber or die sawing tape (Blue tape/UV tape).  
     
     
         6 . The tool in  claim 1 , wherein said elastic material is formed on the surface of said first base by spin coating, printing or adhering.  
     
     
         7 . The tool in  claim 1 , wherein said adhesive material is formed on the surface of said second base by spin coating or printing.  
     
     
         8 . The tool in  claim 1 , wherein said plurality of dice are back upwardly fixed on said elastic material, and said dice back adhered to said adhesive material.  
     
     
         9 . The tool in  claim 1 , wherein said second condition comprises DI water, solvent, or UV light.  
     
     
         10 . The tool in  claim 1 , further comprising a step of performing UV curing or heat curing after adhering .  
     
     
         11 . A placing method of die for wafer level package, comprising: 
 placing a plurality of dice on an elastic material, said elastic material formed on a first base, said elastic material having viscosity in a first condition to adhere said plurality of dice;    forming an adhesive material on a second base;    adhering said plurality of dice on said adhesive material of said second base; and    stripping said plurality of dies from said elastic material in a second condition.    
     
     
         12 . The method in  claim 11 , wherein said placing a plurality of dice on an elastic material is performed by using a pick and place system.  
     
     
         13 . The method in  claim 11 , wherein the material of said first base is silicon, glass, quartz or ceramic.  
     
     
         14 . The method in  claim 11 , wherein the material of said second base is silicon, glass, quartz, ceramic or PCB.  
     
     
         15 . The method in  claim 11 , wherein said second base is lead frame.  
     
     
         16 . The method in  claim 11 , wherein material of said elastic material is silicon resin, elastic PU, porous PU, acrylic rubber or die sawing tape (Blue tape/UV tape).  
     
     
         17 . The method in  claim 11 , wherein said elastic material is formed on surface of said first base by spin coating, printing or adhering.  
     
     
         18 . The method in  claim 11 , wherein said adhesive material is formed on the surface of said second base by spin coating or printing.  
     
     
         19 . The method in  claim 11 , wherein said plurality of dice are back upwardly fixed on said elastic material, and said die's back adhering to said adhesive material.  
     
     
         20 . The method in  claim 11 , wherein said first condition comprises DI water, solvent, or UV light.  
     
     
         21 . The method in  claim 11 , further comprising a step of UV curing or heat curing after adhering.