Inventor · disambiguated record
Shih-Li Chen
Also filed as: CHEN SHIH LI
12 granted patents·2 pending applications·369 citations·filing 1997–2008
93Inventor score
Top patents by PatentIndex Score
14 records- 0198US7667318B2Fan out type wafer level package structure and method of the sameADVANCED CHIP ENG TECH INC·Filed 2008·Granted Feb 23, 2010·56 cites·12 claims
- 0298US7196408B2Fan out type wafer level package structure and method of the sameYANG WEN-KUN·Filed 2005·Granted Mar 27, 2007·84 cites·6 claims
- 0397US7262081B2Fan out type wafer level package structure and method of the sameYANG WEN-KUN·Filed 2005·Granted Aug 28, 2007·55 cites·11 claims
- 0494US7557437B2Fan out type wafer level package structure and method of the sameADVANCED CHIP ENG TECH INC·Filed 2007·Granted Jul 7, 2009·25 cites·18 claims
- 0592US7459781B2Fan out type wafer level package structure and method of the sameYANG WEN-KUN·Filed 2003·Granted Dec 2, 2008·52 cites·18 claims
- 0675US5851337AMethod of connecting TEHS on PBGA and modified connecting structureCAESAR TECHNOLOGY INC·Filed 1997·Granted Dec 22, 1998·49 cites·20 claims
- 0759US6087586AChip scale packageCAESAR TECHNOLOGY INC·Filed 1998·Granted Jul 11, 2000·26 cites·7 claims
- 0857US7224061B2Package structureADVANCED CHIP ENG TECH INC·Filed 2004·Granted May 29, 2007·8 cites·14 claims
- 0951US2007059866A1Fan out type wafer level package structure and method of the sameADVANCED CHIP ENG TECH INC·Filed 2006·Application pending·0 cites
- 1050US7985626B2Manufacturing tool for wafer level package and method of placing diesADVANCED CHIP ENG TECH INC·Filed 2005·Granted Jul 26, 2011·0 cites·9 claims
- 1142US2005249945A1Manufacturing tool for wafer level package and method of placing diesYANG WEN KUN·Filed 2004·Application pending·0 cites
- 1235US6096250AProcess for releasing a runner from an electronic device package on a laminate plateCAESAR INTERNATIONAL INC·Filed 1998·Granted Aug 1, 2000·9 cites·2 claims
- 1333US6236567B1Electronic device package with enhanced heat dissipation effectCAESAR TECHNOLOGY INC·Filed 1999·Granted May 22, 2001·4 cites·9 claims
- 1429US6068129AIndicating adhesion status between substrate and encapsulant of a packaged electronic deviceCAESAR TECHNOLOGY INC·Filed 1998·Granted May 30, 2000·1 cites·23 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →