Assignee
YANG WEN-KUN
13 granted patents·10 pending applications·405 citations·filing 2003–2012
Top patents by PatentIndex Score
23 records- 0198US7196408B2Fan out type wafer level package structure and method of the sameYANG WEN-KUN·Filed 2005·Granted Mar 27, 2007·84 cites·6 claims
- 0297US8237257B2Substrate structure with die embedded inside and dual build-up layers over both side surfaces and method of the sameYANG WEN-KUN·Filed 2008·Granted Aug 7, 2012·48 cites·17 claims
- 0397US7262081B2Fan out type wafer level package structure and method of the sameYANG WEN-KUN·Filed 2005·Granted Aug 28, 2007·55 cites·11 claims
- 0496US8350377B2Semiconductor device package structure and method for the sameYANG WEN-KUN·Filed 2010·Granted Jan 8, 2013·27 cites·17 claims
- 0596US8178963B2Wafer level package with die receiving through-hole and method of the sameYANG WEN-KUN·Filed 2007·Granted May 15, 2012·47 cites·8 claims
- 0696US8178964B2Semiconductor device package with die receiving through-hole and dual build-up layers over both side-surfaces for WLP and method of the sameYANG WEN-KUN·Filed 2007·Granted May 15, 2012·50 cites·12 claims
- 0793US8299488B2LED chipYANG WEN-KUN·Filed 2010·Granted Oct 30, 2012·9 cites·9 claims
- 0892US7459781B2Fan out type wafer level package structure and method of the sameYANG WEN-KUN·Filed 2003·Granted Dec 2, 2008·52 cites·18 claims
- 0989US8106504B2Stacking package structure with chip embedded inside and die having through silicon via and method of the sameYANG WEN-KUN·Filed 2009·Granted Jan 31, 2012·15 cites·20 claims
- 1088US8115297B2Substrate structure with die embedded inside and dual build-up layers over both side surfaces and method of the sameYANG WEN-KUN·Filed 2009·Granted Feb 14, 2012·12 cites·15 claims
- 1175US8236608B2Stacking package structure with chip embedded inside and die having through silicon via and method of the sameYANG WEN-KUN·Filed 2011·Granted Aug 7, 2012·3 cites·4 claims
- 1267US8232633B2Image sensor package with dual substrates and the method of the sameYANG WEN-KUN·Filed 2011·Granted Jul 31, 2012·2 cites·15 claims
- 1365US8304287B2Substrate structure with die embedded inside and dual build-up layers over both side surfaces and method of the sameYANG WEN-KUN·Filed 2011·Granted Nov 6, 2012·1 cites·5 claims
- 1451US2008224306A1Multi-chips package and method of forming the sameYANG WEN-KUN·Filed 2008·Application pending·0 cites
- 1550US2008261346A1Semiconductor image device package with die receiving through-hole and method of the sameYANG WEN-KUN·Filed 2008·Application pending·0 cites
- 1648US2013181227A1LED Package with Slanting Structure and Method of the SameYANG WEN KUN·Filed 2012·Application pending·0 cites
- 1742US2013181351A1Semiconductor Device Package with Slanting StructuresYANG WEN KUN·Filed 2012·Application pending·0 cites
- 1842US2008197478A1Semiconductor device package with die receiving through-hole and connecting through-hole and method of the sameYANG WEN-KUN·Filed 2007·Application pending·0 cites
- 1942US2005242427A1FCBGA package structureYANG WEN KUN·Filed 2004·Application pending·0 cites
- 2042US2005249945A1Manufacturing tool for wafer level package and method of placing diesYANG WEN KUN·Filed 2004·Application pending·0 cites
- 2141US2008174008A1Structure of Memory Card and the Method of the SameYANG WEN-KUN·Filed 2007·Application pending·0 cites
- 2240US2013056773A1Led package and method of the sameYANG WEN KUN·Filed 2011·Application pending·0 cites
- 2339US2012037935A1Substrate Structure of LED (light emitting diode) Packaging and Method of the sameYANG WEN-KUN·Filed 2010·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →