Apparatus for probing multiple integrated circuit devices

Abstract

The present probing apparatus includes a platform with a rectangular opening, two slides positioned at two sides of the opening in a parallel manner, at least one non-circular beam and at least one tunable stage positioned on the non-circular beam. The non-circular beam is preferably a rectangular beam with two ends positioned on the two slides through two first sliding bases, respectively. The tunable stage comprises a carrier for loading a probe card, a first driving module for adjusting a relative position along x-axis between the probe card and the device under test (DUT), a second driving module for adjusting a relative position along y-axis between the probe card and the DUT, a third driving module for adjusting a relative position along z-axis between the probe card and the DUT, and an angular adjusting module for adjusting an angle between the probe card and the DUT.

1 . An apparatus for probing multiple integrated circuit devices, comprising: 
 a platform with an opening;    two slides positioned at two sides of the opening;    at least one non-circular beam with two ends positioned on the two slides; and    at least one tunable stage positioned on the non-circular beam, comprising: 
 a carrier for loading a probe card; and  
 an angular adjusting module for adjusting an angle between the probe card and an integrated circuit device under test by rotating the carrier.  
   
   
   
       2 . The apparatus for probing multiple integrated circuit devices of  claim 1 , wherein the angular adjusting module comprises: 
 a worm gear positioned on the carrier; and    a worm shaft for rotating the worm gear.    
   
   
       3 . The apparatus for probing multiple integrated circuit devices of  claim 2 , wherein the worm shaft is substantially perpendicular to a rotation shaft of the worm gear.  
   
   
       4 . The apparatus for probing multiple integrated circuit devices of  claim 1 , wherein the angular adjusting module comprises: 
 a first gear positioned on the carrier;    a second gear connected to the first gear; and    a rotary member connected to the second gear for rotating the second gear so as to rotate the first gear.    
   
   
       5 . The apparatus for probing multiple integrated circuit devices of  claim 4 , wherein an acute angle is formed between a rotation shaft of the first gear and that of the second gear.  
   
   
       6 . The apparatus for probing multiple integrated circuit devices of  claim 1 , wherein the tunable stage comprises: 
 a first driving module for adjusting a relative position along x-axis between the probe card and the device under test;    a second driving module for adjusting a relative position along y-axis between the probe card and the device under test; and    a third driving module for adjusting a relative position along z-axis between the probe card and the device under test.    
   
   
       7 . The apparatus for probing multiple integrated circuit devices of  claim 1 , wherein the non-circular beam is connected to the slide through a first sliding base.  
   
   
       8 . The apparatus for probing multiple integrated circuit devices of  claim 1 , wherein the tunable stage is connected to the non-circular beam through a second sliding base.  
   
   
       9 . The apparatus for probing multiple integrated circuit devices of  claim 1 , wherein the opening of the platform is rectangular.  
   
   
       10 . The apparatus for probing multiple integrated circuit devices of  claim 1 , wherein the non-circular beam is a rectangular beam.  
   
   
       11 . An apparatus for probing multiple integrated circuit devices, comprising: 
 a platform with an opening;    two slides positioned at two sides of the opening;    at least one non-circular beam with two ends positioned on the two slides; and    at least one tunable stage positioned on the non-circular beam, comprising: 
 a first driving module for adjusting a relative position along x-axis between the probe card and an integrated circuit device under test;  
 a second driving module for adjusting a relative position along y-axis between the probe card and the device under test; and  
 a third driving module for adjusting a relative position along z-axis between the probe card and the device under test.  
   
   
   
       12 . The apparatus for probing multiple integrated circuit devices of  claim 11 , wherein the non-circular beam is connected to the slide through a first sliding base.  
   
   
       13 . The apparatus for probing multiple integrated circuit devices of  claim 11 , wherein the tunable stage is connected to the non-circular beam through a second sliding base.  
   
   
       14 . The apparatus for probing multiple integrated circuit devices of  claim 11 , wherein the opening of the platform is rectangular.  
   
   
       15 . The apparatus for probing multiple integrated circuit devices of  claim 11 , wherein the non-circular beam is a rectangular beam.