Markings for use with semiconductor device components

Abstract

A marking for a semiconductor device component includes a plurality of adjacent, mutually adhered regions. The marking is configured to contrast visually with a semiconductor device component, and may include features that are configured to protrude from the semiconductor device component recessed features to provide desired indicia. Materials that contrast visually with one another may also be used to form the marking.

1 . A marking for a semiconductor device component, comprising a plurality of adjacent, mutually adhered regions, at least one of which is directly secured to or directly securable to a surface of the semiconductor device component to provide at least one visible indicium thereon.  
   
   
       2 . The marking of  claim 1 , configured to be secured to at least one of a bare semiconductor device and an at least partially packaged semiconductor device.  
   
   
       3 . The marking of  claim 1 , configured to be secured to at least one of a lead frame and a carrier substrate.  
   
   
       4 . The marking of claim I, wherein at least one of the plurality of adjacent, mutually adhered regions is configured to protrude from.a surface of the semiconductor device component to provide at least a part of the at least one visible indicium.  
   
   
       5 . The marking of  claim 4 , including an outer periphery defined by at least one region of the plurality of adjacent, mutually adhered regions.  
   
   
       6 . The marking of  claim 5 , including an inner periphery defined by at least one region of the plurality of adjacent, mutually adhered regions.  
   
   
       7 . The marking of  claim 1 , comprising at least one recessed area forming at least a part of the at least one visible indicium.  
   
   
       8 . The marking of  claim 7 , further including another material disposed in the at least one recessed area.  
   
   
       9 . The marking of  claim 8 , wherein the another material contrasts visually with a material of the plurality of adjacent, mutually adhered regions.  
   
   
       10 . The marking of  claim 7 , wherein an outer periphery of the marking comprises at least one inner lateral edge defined by at least one of the plurality of adjacent, mutually adhered regions.  
   
   
       11 . The marking of  claim 10 , wherein an inner periphery of the marking comprises at least one outer lateral edge of at least one isolated region defined by at least one of the plurality of adjacent, mutually adhered regions.  
   
   
       12 . The marking of  claim 1 , wherein the plurality of adjacent, mutually adhered regions comprises a plurality of at least partially superimposed, contiguous, mutually adhered layers.  
   
   
       13 . The marking of  claim 12 , wherein at least a lowermost layer of the plurality of at least partially superimposed, contiguous, mutually adhered layers secures each portion of overlying layers of the plurality of at least partially superimposed, contiguous, mutually adhered layers in position relative to other portions of the overlying layers.  
   
   
       14 . The marking of  claim 1 , wherein a material of the plurality of adjacent, mutually adhered regions contrasts visually with a surface of the semiconductor device component.  
   
   
       15 . The marking of  claim 1 , wherein a material of the plurality of adjacent, mutually adhered regions comprises a photopolymer.  
   
   
       16 . The marking of  claim 1 , further comprising a layer of adhesive to secure the marking to the semiconductor device component.  
   
   
       17 . The marking of  claim 1 , comprising at least one identifying indicium.