Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device

Abstract

A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.

1 - 19 . (canceled)  
     
     
         20 . A polishing apparatus for polishing a workpiece comprising: 
 a plurality of first polishing units each for polishing a workpiece;    one second polishing unit for polishing a workpiece, wherein said first polishing units require more time to process the workpiece than said second polishing unit; and    at least one washing unit for washing the workpiece polished by one of said first polishing units and said second polishing unit.    
     
     
         21 . A polishing apparatus according to  claim 20 , wherein the workpiece is washed and dried in said washing unit and then removed from said washing unit in clean and dry condition.  
     
     
         22 . A polishing apparatus according to  claim 20 , further comprising a robot for transferring the workpiece in said polishing apparatus.  
     
     
         23 . A polishing apparatus according to  claim 22 , wherein said robot transfers both the workpiece to be polished and the clean and dry workpiece which has been polished and then washed.