Inventor · disambiguated record
Hiromi Yajima
Also filed as: YAJIMA HIROMI
28 granted patents·3 pending applications·1,030 citations·filing 1993–2024
98Inventor score
Top patents by PatentIndex Score
31 records- 0193US6036582APolishing apparatusEBARA CORP·Filed 1998·Granted Mar 14, 2000·61 cites·20 claims
- 0292US5885138AMethod and apparatus for dry-in, dry-out polishing and washing of a semiconductor deviceEBARA CORP·Filed 1996·Granted Mar 23, 1999·75 cites·124 claims
- 0392US5679059APolishing aparatus and methodEBARA CORP·Filed 1995·Granted Oct 21, 1997·110 cites·83 claims
- 0489US5445996AMethod for planarizing a semiconductor device having a amorphous layerTOSHIBA KK·Filed 1993·Granted Aug 29, 1995·87 cites·1 claims
- 0588US5616063APolishing apparatusTOKYO SHIBAURA ELECTRIC CO·Filed 1994·Granted Apr 1, 1997·123 cites·16 claims
- 0687US5597341ASemiconductor planarizing apparatusTOSHIBA KK·Filed 1995·Granted Jan 28, 1997·60 cites·14 claims
- 0785US6439971B2Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor deviceTOSHIBA KK·Filed 2001·Granted Aug 27, 2002·20 cites·52 claims
- 0882US5704827APolishing apparatus including cloth cartridge connected to turntableEBARA CORP·Filed 1995·Granted Jan 6, 1998·67 cites·20 claims
- 0981US6443808B2Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor deviceTOSHIBA KK·Filed 2001·Granted Sep 3, 2002·14 cites·64 claims
- 1081US6425806B2Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor deviceTOSHIBA KK·Filed 2001·Granted Jul 30, 2002·14 cites·112 claims
- 1181US5914275APolishing apparatus and method for planarizing layer on a semiconductor waferTOSHIBA KK·Filed 1997·Granted Jun 22, 1999·43 cites·24 claims
- 1281US5860847APolishing apparatusEBARA CORP·Filed 1996·Granted Jan 19, 1999·63 cites·15 claims
- 1379US6547638B2Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor deviceEBARA CORP·Filed 2001·Granted Apr 15, 2003·12 cites·41 claims
- 1479US5948205APolishing apparatus and method for planarizing layer on a semiconductor waferTOSHIBA KK·Filed 1997·Granted Sep 7, 1999·41 cites·17 claims
- 1579US5827110APolishing facilityTOSHIBA KK·Filed 1995·Granted Oct 27, 1998·64 cites·21 claims
- 1679US5695601AMethod for planarizing a semiconductor body by CMP method and an apparatus for manufacturing a semiconductor device using the methodTOSHIBA KK·Filed 1995·Granted Dec 9, 1997·60 cites·10 claims
- 1778US7065725B2Semiconductor manufacturing apparatus, management apparatus therefor, component management apparatus therefor, and semiconductor wafer storage vessel transport apparatusTOSHIBA KK·Filed 2003·Granted Jun 20, 2006·14 cites·5 claims
- 1878US6997782B2Polishing apparatus and a method of polishing and cleaning and drying a waferTOSHIBA KK·Filed 2002·Granted Feb 14, 2006·16 cites·20 claims
- 1970US7198552B2Polishing apparatusTOSHIBA KK·Filed 2005·Granted Apr 3, 2007·2 cites·18 claims
- 2067US6500051B1Polishing apparatus and methodEBARA CORP·Filed 1997·Granted Dec 31, 2002·25 cites·57 claims
- 2165US6413154B1Polishing apparatusEBARA CORP·Filed 1999·Granted Jul 2, 2002·25 cites·19 claims
- 2264US7478347B2Semiconductor manufacturing apparatus, management apparatus therefor, component management apparatus therefor, and semiconductor wafer storage vessel transport apparatusTOSHIBA KK·Filed 2006·Granted Jan 13, 2009·3 cites·2 claims
- 2361US6273802B1Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor deviceTOSHIBA KK·Filed 1999·Granted Aug 14, 2001·14 cites·35 claims
- 2457US7708618B2Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor deviceEBARA CORP·Filed 2007·Granted May 4, 2010·0 cites·6 claims
- 2555US6966821B2Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor deviceEBARA CORP·Filed 2003·Granted Nov 22, 2005·2 cites·6 claims
- 2654US2024388699A1Encoding system, point cloud encoding device, encoding method, and storage mediumCANON KK·Filed 2024·Application pending·0 cites
- 2753US2025131548A1Information processing device, control method, program, and storage mediumPIONEER CORP·Filed 2022·Application pending·0 cites
- 2852US6595220B2Apparatus for conveying a workpieceEBARA CORP·Filed 2001·Granted Jul 22, 2003·3 cites·13 claims
- 2951US2006009130A1Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor deviceOKUMURA KATSUYA·Filed 2005·Application pending·0 cites
- 3046US6221171B1Method and apparatus for conveying a workpieceEBARA CORP·Filed 1997·Granted Apr 24, 2001·11 cites·13 claims
- 3131US6227954B1Polishing apparatusEBARA CORP·Filed 1997·Granted May 8, 2001·1 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →