Copper strike plating bath

Abstract

A copper strike plating bath comprising a copper cyanide compound and one or more of salts of inorganic acids and salts of organic acids. The copper cyanide compound is preferably sodium copper cyanide, potassium copper cyanide or a mixture thereof.

1 . A copper strike plating bath comprising a copper cyanide compound and one or more of salts of inorganic acids and salts of organic acids.  
   
   
       2 . The copper strike plating bath according to  claim 1  wherein the copper cyanide compound is sodium copper cyanide, potassium copper cyanide or a mixture thereof.  
   
   
       3 . The copper strike plating bath according to  claim 1  wherein the salt of an inorganic acid is a phosphate, pyrophosphate, alkali hydroxide compound, borate or carbonate.  
   
   
       4 . The copper strike plating bath according to  claim 1  wherein the salt of an organic acid is a salt of formic acid, acetic acid, tartaric acid, citric acid, gluconic acid or L-glutamic acid.  
   
   
       5 . The copper strike plating bath according to  claim 1  that additionally contains at least one inorganic acid or organic acid.  
   
   
       6 . The copper strike plating bath according to  claim 5  wherein the inorganic acid is phosphoric acid, pyrophosphoric acid, boric acid or carbonic acid.  
   
   
       7 . The copper strike plating bath according to  claim 5  wherein the organic acid is formic acid, acetic acid, tartaric acid, citric acid, gluconic acid or L-glutamic acid.  
   
   
       8 . The copper strike plating bath according to  claim 1  that additionally contains one or more of Se, Tl and Te.  
   
   
       9 . The copper strike plating bath according to  claim 1  that additionally contains a surfactant.