Method and micromechanical component

Abstract

A manufacturing method and a micromechanical component are provided in which porous silicon is used as sacrificial layer and a functional layer is exposed by etching off the sacrificial layer.

1 - 9 . (canceled)  
   
   
       10 . A method for producing a micromechanical component using a sacrificial layer, comprising: 
 producing a patterned porous region in a silicon substrate;    producing a functional layer above the porous region; and    subsequently exposing the functional layer, the porous region being used at least partially as the sacrificial layer.    
   
   
       11 . The method as recited in  claim 10 , wherein the porous region is produced first and then the functional layer.  
   
   
       12 . The method as recited in  claim 10 , wherein: 
 the step of producing the porous region includes producing a doped first region in the substrate in which no pores will form, and subsequently producing the porous region.    
   
   
       13 . The method as recited in  claim 10 , further comprising: 
 patterning the functional layer; and    producing additional layers above the porous region, the additional layers cooperating with the functional layer and being provided in patterned form.    
   
   
       14 . The method as recited in  claim 10 , further comprising: 
 etching off in a dry-chemical manner the porous region below the functional layer.    
   
   
       15 . The method as recited in  claim 10 , wherein: 
 the porous region includes a first porous partial region and a second porous partial region,    the second porous partial region has a higher porosity than the first porous partial region,    a cavity is formed in the second porous partial region by a thermal treatment, and    a cover layer remains in the first porous partial region.    
   
   
       16 . The method as recited in  claim 15 , further comprising: 
 in order to expose the functional layer, etching off at least the cover layer at least partially.    
   
   
       17 . The method as recited in  claim 10 , wherein: 
 the functional layer is produced first and the porous region below the functional layer is produced subsequently.    
   
   
       18 . A micromechanical component, comprising: 
 a silicon substrate; and    a functional layer arranged above the porous region, the functional layer having been exposed through a removal of a patterned porous region serving as a sacrificial layer and above which the functional layer was produced.