Inventor · disambiguated record
Heribert Weber
Also filed as: WEBER HERIBERT
86 granted patents·27 pending applications·524 citations·filing 1988–2024
99Inventor score
Top patents by PatentIndex Score
113 records- 0191US5905203AMicromechanical acceleration sensorTELEFUNKEN MICROELECTRON·Filed 1996·Granted May 18, 1999·134 cites·6 claims
- 0286US7479232B2Method for producing a semiconductor component and a semiconductor component produced according to the methodBOSCH GMBH ROBERT·Filed 2005·Granted Jan 20, 2009·8 cites·29 claims
- 0385US6803637B2Micromechanical component with different doping types so that one type is anodized into porous siliconBOSCH GMBH ROBERT·Filed 2001·Granted Oct 12, 2004·37 cites·17 claims
- 0482US8779536B2Hybrid integrated pressure sensor componentWEBER HERIBERT·Filed 2013·Granted Jul 15, 2014·4 cites·11 claims
- 0581US8123963B2Method for producing a semiconductor component and a semiconductor component produced according to the methodBENZEL HUBERT·Filed 2008·Granted Feb 28, 2012·5 cites·23 claims
- 0681US7037438B2Method for production of a semiconductor component and a semiconductor component produced by said methodBOSCH GMBH ROBERT·Filed 2001·Granted May 2, 2006·18 cites·24 claims
- 0780US9518877B2Micromechanical component for a capacitive sensor device, and manufacturing method for a micromechanical component for a capacitive sensor deviceBOSCH GMBH ROBERT·Filed 2014·Granted Dec 13, 2016·5 cites·16 claims
- 0879US11998928B2Roller groups for grinding devices, grinding devices, and methodsBUEHLER AG·Filed 2022·Granted Jun 4, 2024·0 cites·10 claims
- 0979US11933689B2MEMS capacitive sensor including improved contact separationBOSCH GMBH ROBERT·Filed 2020·Granted Mar 19, 2024·1 cites·15 claims
- 1079US7148077B2Micromechanical structural element having a diaphragm and method for producing such a structural elementBOSCH GMBH ROBERT·Filed 2004·Granted Dec 12, 2006·27 cites·14 claims
- 1178US11925940B2Roller groups for grinding devices, grinding devices, and methodsBUEHLER AG·Filed 2022·Granted Mar 12, 2024·0 cites·11 claims
- 1278US9035432B2Component having through-hole plating, and method for its productionREINMUTH JOCHEN·Filed 2013·Granted May 19, 2015·5 cites·16 claims
- 1378US8748998B2Sensor moduleFREY JENS·Filed 2011·Granted Jun 10, 2014·4 cites·8 claims
- 1474US11912563B2Micromechanical component and method for manufacturing a micromechanical componentBOSCH GMBH ROBERT·Filed 2019·Granted Feb 27, 2024·1 cites·10 claims
- 1573US9567212B2Micromechanical componentBOSCH GMBH ROBERT·Filed 2013·Granted Feb 14, 2017·2 cites·12 claims
- 1672US8823116B2Hybrid integrated component and method for the manufacture thereofWEBER HERIBERT·Filed 2013·Granted Sep 2, 2014·3 cites·13 claims
- 1772US7193290B2Semiconductor component and a method for producing the sameBOSCH GMBH ROBERT·Filed 2002·Granted Mar 20, 2007·10 cites·17 claims
- 1872US7045382B2Method for producing micromechanic sensors and sensors produced by said methodBOSCH GMBH ROBERT·Filed 2002·Granted May 16, 2006·17 cites·9 claims
- 1972US6523403B1Mass flow sensorBOSCH GMBH ROBERT·Filed 2000·Granted Feb 25, 2003·18 cites·12 claims
- 2071US6906392B2Micromechanical componentPARAGON AG·Filed 2002·Granted Jun 14, 2005·17 cites·16 claims
- 2171US6820481B1Mass flow sensor having an improved membrane stabilityBOSCH GMBH ROBERT·Filed 2000·Granted Nov 23, 2004·16 cites·17 claims
- 2269US11976996B2Micromechanical component for a capacitive pressure sensor deviceBOSCH GMBH ROBERT·Filed 2019·Granted May 7, 2024·1 cites·5 claims
- 2369US7300854B2Method for producing a semiconductor component having a movable mass in particular, and semiconductor component produced according to this methodBOSCH GMBH ROBERT·Filed 2001·Granted Nov 27, 2007·14 cites·23 claims
- 2468US9791663B2Magnetically drivable micromirrorPINTER STEFAN·Filed 2011·Granted Oct 17, 2017·2 cites·7 claims
- 2568US6336360B1Device for measuring the mass of a medium flowing in a lineBOSCH GMBH ROBERT·Filed 1999·Granted Jan 8, 2002·31 cites·14 claims
- 2667US9365417B2Method for manufacturing a micromechanical componentBOSCH GMBH ROBERT·Filed 2014·Granted Jun 14, 2016·1 cites·9 claims
- 2767US7705413B2Micromechanical component and method for producing a micromechanical componentBOSCH GMBH ROBERT·Filed 2008·Granted Apr 27, 2010·3 cites·10 claims
- 2866US8558327B2Micromechanical component and corresponding production methodKNESE KATHRIN·Filed 2008·Granted Oct 15, 2013·6 cites·9 claims
- 2965US8485041B2Sensor system, method for operating a sensor system, and method for manufacturing a sensor systemAHLES MARCUS·Filed 2009·Granted Jul 16, 2013·6 cites·15 claims
- 3063US8679975B2Method for forming trenches in a semiconductor componentREINMUTH JOCHEN·Filed 2011·Granted Mar 25, 2014·1 cites·25 claims
- 3163US8207585B2Method for producing a micromechanical component and mircomechanical componentSCHLOSSER ROMAN·Filed 2007·Granted Jun 26, 2012·5 cites·11 claims
- 3263US6565765B1Method for manufacturing a sensor having a membraneBOSCH GMBH ROBERT·Filed 2000·Granted May 20, 2003·11 cites·9 claims
- 3362US7160750B2Method of producing a semiconductor sensor componentBOSCH GMBH ROBERT·Filed 2002·Granted Jan 9, 2007·10 cites·18 claims
- 3462US6840111B2Micromechanical component and pressure sensor having a component of this typeBOSCH GMBH ROBERT·Filed 2002·Granted Jan 11, 2005·10 cites·17 claims
- 3562US6832523B2Micromechanical component and manufacturing methodBOSCH GMBH ROBERT·Filed 2001·Granted Dec 21, 2004·10 cites·29 claims
- 3661US9123716B2Method for bonding two silicon substrates, and a correspondeing system of two silicon substratesGONSKA JULIAN·Filed 2012·Granted Sep 1, 2015·1 cites·14 claims
- 3760US12163851B2Micromechanical component for a sensor device having a capacitor sealing structureBOSCH GMBH ROBERT·Filed 2022·Granted Dec 10, 2024·0 cites·20 claims
- 3860US11266993B2Roller groups for grinding devices, grinding devices, and methodsBUEHLER AG·Filed 2019·Granted Mar 8, 2022·0 cites·16 claims
- 3960US7863072B2Micromechanical diaphragm sensor having a double diaphragmBOSCH GMBH ROBERT·Filed 2005·Granted Jan 4, 2011·1 cites·16 claims
- 4060US2011011566A1Arrangement for recooling cooling waterGEA Energietchnik GmbH·Filed 2009·Application pending·0 cites
- 4159US6240777B1Sensor having a membraneBOSCH GMBH ROBERT·Filed 1998·Granted Jun 5, 2001·24 cites·20 claims
- 4258US8847336B2Micromechanical component having an inclined structure and corresponding manufacturing methodPIRK TJALF·Filed 2008·Granted Sep 30, 2014·2 cites·15 claims
- 4358USRE44995EMethod for producing a semiconductor component and a semiconductor component produced according to the methodBOSCH GMBH ROBERT·Filed 2013·Granted Jul 8, 2014·0 cites·23 claims
- 4458US2025388456A1Micromechanical pressure sensor having at least two membranes for determining a pressure value, and corresponding methodBOSCH GMBH ROBERT·Filed 2023·Application pending·0 cites
- 4557US8181522B2Capacitive acceleration sensor having a movable mass and a spring elementSCHEUERER ROLAND·Filed 2008·Granted May 22, 2012·3 cites·12 claims
- 4657US2024359975A1Method for producing a particle protection element, in particular a particle filter, for a membrane of a pressure sensor, particle protection element, method for producing a pressure sensor, and pressure sensorBOSCH GMBH ROBERT·Filed 2024·Application pending·0 cites
- 4756US2024290839A1Method for forming a layer structure surrounding at least one recess, and device with a layer structureBOSCH GMBH ROBERT·Filed 2023·Application pending·0 cites
- 4855US7833405B2Micromechanical component and corresponding production methodBOSCH GMBH ROBERT·Filed 2001·Granted Nov 16, 2010·7 cites·10 claims
- 4955US7834452B2Device made of single-crystal siliconBOSCH GMBH ROBERT·Filed 2008·Granted Nov 16, 2010·0 cites·4 claims
- 5055US7453254B2Microstructured chemical sensorPARAGON AG·Filed 2004·Granted Nov 18, 2008·2 cites·10 claims
Showing the top 50 of 113 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →