Methods for minimizing defects when transferring a semiconductor useful layer

Abstract

A method for minimizing defects when transferring a useful layer from a donor wafer to a receptor wafer is described. The method includes providing a donor wafer having a surface below which a zone of weakness is present to define a useful layer to be transferred, molecularly bonding at a bonding interface the surface of the useful layer of the donor wafer to a surface of the receptor wafer to form a structure, heating the structure at a first temperature that is substantially higher than ambient temperature for a first time period sufficient to liberate water molecules from the bonding interface, with the heating being insufficient to cause detachment of the useful layer at the zone of weakness, and detaching the useful layer from the donor wafer.

1 . A method for minimizing defects when transferring a useful layer from a donor wafer to a receptor wafer, comprising: 
 providing a donor wafer having a surface below which a zone of weakness is present to define a useful layer to be transferred;    molecularly bonding at a bonding interface the surface of the useful layer of the donor wafer to a surface of the receptor wafer to form a structure;    heating the structure at a first temperature that is substantially higher than ambient temperature for a first time period sufficient to liberate water molecules from the bonding interface, with the heating being insufficient to cause detachment of the useful payer at the zone of weakness; and    detaching the useful layer from the donor wafer.    
   
   
       2 . The method of  claim 1 , wherein the first temperature is in the range of about 200° C. to about 400° C.  
   
   
       3 . The method of  claim 2 , wherein the first temperature is about 350° C.  
   
   
       4 . The method of  claim 1 , wherein the first time period is in the range of about 10 minutes to about 360 minutes.  
   
   
       5 . The method of  claim 4 , wherein the first time period is in the range from about 30 minutes to about 120 minutes.  
   
   
       6 . The method of  claim 1 , which further comprises annealing the structure at a second temperature that is substantially higher than the first temperature for a second time period to reinforce the bond at the interface prior to detaching.  
   
   
       7 . The method of  claim 6 , wherein the first temperature is no greater than about 400° C. and the second temperature is no greater than about 500° C.  
   
   
       8 . The method of  claim 6 , wherein the annealing comprises increasing the temperature in a substantially progressive manner between the first and second temperatures.  
   
   
       9 . The method of  claim 8 , wherein the temperature increases continuously over time at a rate of no less than about 0.5° C./minute.  
   
   
       10 . The method of  claim 1 , which further comprises, prior to bonding the useful layer to the receptor wafer, forming the zone of weakness in the donor wafer by atomic species implantation.  
   
   
       11 . The method of  claim 1 , which further comprises, prior to bonding the useful layer to the receptor wafer, forming the zone of weakness in the donor wafer by providing a porous layer in the donor wafer.  
   
   
       12 . The method of  claim 1 , which further comprises, prior to bonding the useful layer to the receptor wafer, forming a layer of bonding material on at least one of the surfaces of the useful layer or the receptor wafer.  
   
   
       13 . The method of  claim 12 , wherein the bonding material is at least one of an electrical insulator or SiO 2 .  
   
   
       14 . The method of  claim 1 , which further comprises, prior to bonding the useful layer to the receptor wafer, forming a layer of bonding material on each of the useful layer surface and the receptor wafer surface.  
   
   
       15 . The method of  claim 14 , wherein the bonding material is at least one of an electrical insulator or SiO 2 .  
   
   
       16 . The method of  claim 1 , which further comprises, prior to bonding the useful layer to the receptor wafer, cleaning at least one of the useful layer surface of the donor wafer or the receptor wafer surface.  
   
   
       17 . The method of  claim 16 , wherein cleaning comprises at least one of chemical treatment, rinsing, or scrubbing.  
   
   
       18 . The method of  claim 1 , which further comprises recycling a remainder portion of the donor wafer after detaching the useful layer.  
   
   
       19 . The method of  claim 1 , wherein the transferring of the useful layer from the donor wafer to the receptor wafer forms an SOI structure.