Polishing composition and polishing method using the same

Abstract

A polishing composition contains an abrasive such as colloidal silica, at least one kind of compound selected from imidazole and an imidazole derivative, and water. The polishing composition preferably further contains an alkali compound, a water-soluble polymer, or a chelating agent. The polishing composition is suitable for use in polishing an edge of an object such as a semiconductor substrate.

1 . A polishing composition for use in polishing an edge of an object, comprising: 
 an abrasive;    at least one kind of compound selected from imidazole and an imidazole derivative; and    water.    
     
     
         2 . The polishing composition according to  claim 1 , wherein the abrasive contains colloidal silica.  
     
     
         3 . The polishing composition according to  claim 1 , wherein the average particle size of the abrasive is 10 to 200 nm.  
     
     
         4 . The polishing composition according to  claim 1 , wherein the content of the at least one kind of compound selected from imidazole and an imidazole derivative in the polishing composition is 0.1 to 20.0% by mass.  
     
     
         5 . The polishing composition according to  claim 1 , further comprising an alkali compound.  
     
     
         6 . The polishing composition according to  claim 5 , wherein the alkali compound contains at least one kind of compound selected from tetramethylammonium hydroxide, potassium hydroxide, and sodium hydroxide.  
     
     
         7 . The polishing composition according to  claim 1 , further comprising a water-soluble polymer.  
     
     
         8 . The polishing composition according to  claim 7 , wherein the water-soluble polymer contains at least one kind of compound selected from hydroxyethyl cellulose, polyvinyl alcohol, polyethylene oxide, and polyethylene glycol.  
     
     
         9 . The polishing composition according to  claim 1 , further comprising a chelating agent.  
     
     
         10 . The polishing composition according to  claim 1 , further comprising an oxidizing agent, wherein the content of the oxidizing agent in the polishing composition is less than 1% by mass.  
     
     
         11 . The polishing composition according to  claim 1 , comprising no oxidizing agent.  
     
     
         12 . The polishing composition according to  claim 1 , wherein the object is a semiconductor substrate.  
     
     
         13 . A method comprising polishing an edge of an object using a polishing composition containing an abrasive, at least one kind of compound selected from imidazole and an imidazole derivative, and water.  
     
     
         14 . The method according to  claim 13 , wherein the object is a semiconductor substrate.  
     
     
         15 . A method for manufacturing a polished product, comprising: 
 preparing a polishing composition containing an abrasive, at least one kind of compound selected from imidazole and an imidazole derivative, and water; and    polishing an edge of a semi-finished product of the polished product using the prepared polishing composition.    
     
     
         16 . The method according to  claim 15 , wherein the polished product is a semiconductor substrate.