Rotational thermophoretic drying

Abstract

A method that includes rotating a wafer, heating the wafer, applying a first liquid through one or more nozzles to a center of a topside of the wafer that is cooler than the heated wafer, and translating the one or more nozzles to an outer diameter edge of the wafer.

1 - 18 . (canceled)  
   
   
       19 . An apparatus for drying a wafer comprising: 
 a wafer holding chuck, said chuck being capable of rotation;    a means of heating a wafer on said chuck;    a means of providing a cooled fluid;    a means of dispensing the cooled fluid onto the heated wafer, wherein said means of dispensing comprises one or more nozzles;    a means of creating a moving thermal gradient across the wafer, comprising: 
 translating one or more nozzles across the wafer to the outer edge of the wafer, as the cooled fluid is dispensed onto the heated wafer.  
   
   
   
       20 . The apparatus of  claim 19 , wherein said means of heating comprises a means of applying a heated fluid to the back side of the wafer on the chuck by means of a through hole in a platter.  
   
   
       21 . The apparatus of  claim 20 , wherein said platter and said chuck are positioned a distance from each other, thereby creating a gap between the platter and the chuck through which the heated fluid can flow.  
   
   
       22 . The apparatus of  claim 19 , wherein one nozzle does not translate, while at least one nozzle translates.