Multi-chip package

Abstract

A multi-chip package includes a substrate having first and second substrate pads, ball pads electrically connected to the first and second substrate pads, a first chip attached on the substrate and having first chip pads flip-chip bonded to the first substrate pads, and a second chip attached on the first chip and having second chip pads wire-bonded to the second substrate pads. The second chip may have overhang portions. Solder balls may be formed on the ball pads and act as external connection terminals. A support member may be interposed between the first chip and the second chip to support the overhang portions of the second chip.

1 . A multi-chip package comprising: 
 a substrate having first substrate pads and second substrate pads;    a first chip mounted on the substrate and having first chip pads to electrically connect to the first substrate pads;    a second chip mounted in relation to the first chip and having second chip pads to electrically connect to the second substrate pads, the second chip having overhang portions; and    a support member interposed between the first chip and the second chip to support the overhang portions of the second chip.    
     
     
         2 . The package of  claim 1  further comprising: 
 ball pads electrically connected to the first substrate pads and to the second substrate pads;and    solder balls formed on the ball pads.    
     
     
         3 . The package of  claim 1  wherein the support member includes a base plate and support portions formed at opposite edges of the base plate to extend from the base plate to the substrate.  
     
     
         4 . The package of  claim 3  wherein the support portions of the support member are conductive to electrically connect at a first end to the base plate and at a second end to third substrate pads of the substrate.  
     
     
         5 . The package of  claim 1  wherein the support member includes a conductive metal plate.  
     
     
         6 . The package of  claim 5  wherein the support member includes support portions formed at opposite edges of the metal plate to extend from the metal plate to the substrate.  
     
     
         7 . The package of  claim 6  wherein the support portions are conductive to electrically connect at a first end to the metal plate and at a second end to third substrate pads of the substrate.  
     
     
         8 . The package of  claim 1  wherein the support member includes an insulating base, upper and lower conductive layers formed on upper and lower surfaces of the insulating base, and conductive lines to electrically connect the upper conductive layer to the lower conductive layer.  
     
     
         9 . The package of  claim 8  wherein at least one of the upper and lower conductive layers is electrically connected to third substrate pads of the substrate.  
     
     
         10 . The package of  claim 8  wherein at least one of the upper and lower conductive layers is electrically connected to the second chip pads of the second chip.  
     
     
         11 . The package of  claim 1  wherein the first substrate pads are flip-chip bonded to the first chip pads.  
     
     
         12 . The package of  claim 11  wherein the support member includes a base plate and support portions formed at opposite edges of the base plate to extend from the base plate to the substrate.  
     
     
         13 . The package of  claim 12  wherein the base plate is conductive and the support portions are conductive to electrically connect at a first end thereof to the base plate and at a second end thereof to third substrate pads of the substrate.  
     
     
         14 . The package of  claim 1  further comprising first wires to electrically connect the second chip pads to the second substrate pads.  
     
     
         15 . The package of  claim 14  wherein the support member is conductive and the package further comprises second wires to electrically connect the support member to third substrate pads of the substrate.  
     
     
         16 . The package of  claim 1  wherein the support member is conductive, attached to the first chip using a first adhesive layer, attached to the second chip using a second adhesive layer; and at least one of the first adhesive layer and the second adhesive layer is conductive.  
     
     
         17 . The package of  claim 16  wherein the support member electrically couples to third substrate pads of the substrate.  
     
     
         18 . The package of  claim 16  wherein the support member includes a base plate and support portions formed at opposite edges of the base plate to extend from the base plate to the substrate.  
     
     
         19 . The package of  claim 18  wherein the base plate is conductive and the support portions are conductive to electrically connect at a first end thereof to the base plate and at a second end thereof to third substrate pads of the substrate.  
     
     
         20 . The package of  claim 16  wherein the support member is electrically connectable the second chip pads.  
     
     
         21 . A multi-chip package comprising: 
 a first integrated circuit having a first active surface presenting first pads thereon and a first back surface opposite the first active surface, the first integrated circuit having a first length along a first axis;    a second integrated circuit having a second active surface presenting second pads thereon and a second back surface opposite the second active surface, the second integrated circuit having a second length along a second axis;    a substrate including third pads, the first active surface being mounted on a first surface of the substrate; and    a planar support member having a third length along a third axis, the first back surface being mounted on a first surface of the support member, the second back surface being mounted on a second surface of the support member, the second pads being electrically connectable to the third pads of the substrate.    
     
     
         22 . The multi-chip package according to  claim 21  wherein the first axis, second axis, and third axis are in parallel relation and the second length is greater than the first length.  
     
     
         23 . The multi-chip package according to  claim 22  wherein the third length is greater than the first length.  
     
     
         24 . The multi-chip package according to  claim 21  wherein the first axis, second axis, and third axis are in parallel relation and the second length is greater than the first length and the second length is substantially equal to the third length.  
     
     
         25 . The multi-chip package according to  claim 21  wherein the first axis, second axis, and third axis are in parallel relation, the second length is greater than the first length and the third length is greater than the second length.  
     
     
         26 . The multi-chip package according to  claim 21  wherein the support member includes a conductive portion electrically connectable to act as a shield.  
     
     
         27 . The multi-chip package according to  claim 26  wherein the shield is a ground plane.  
     
     
         28 . The multi-chip package wherein an upper integrated circuit chip overhangs a lower integrated circuit chip, the multi-chip package comprising; 
 a support member interposable between the first integrated circuit chip and the second integrated circuit chip to support overhang portions of said upper integrated circuit chip.    
     
     
         29 . The multi-chip package according to  claim 28  wherein the support member is formed to resist a force directed into the upper chip during a wire bonding process.  
     
     
         30 . The multi-chip package according to  claim 28  wherein the support member is conductive and electrically connectable to establish the support member as an electromagnetic shield.  
     
     
         31 . The multi-chip package according to  claim 30  wherein the support member is electrically connectable to the upper chip.