Assignee
KWON HEUNG-KYU
KR·12 granted patents·5 pending applications·130 citations·filing 2005–2015
Top patents by PatentIndex Score
17 records- 0198US8508954B2Systems employing a stacked semiconductor packageKWON HEUNG-KYU·Filed 2010·Granted Aug 13, 2013·60 cites·7 claims
- 0294US8604614B2Semiconductor packages having warpage compensationKWON HEUNG-KYU·Filed 2011·Granted Dec 10, 2013·19 cites·17 claims
- 0392US8546954B2Stacked semiconductor package having electrical connections or varying heights between substrates, and semiconductor device including the stacked semiconductor packageKWON HEUNG-KYU·Filed 2011·Granted Oct 1, 2013·13 cites·33 claims
- 0491US9839127B2System of package (SoP) module and mobile computing device having the SoPKWON HEUNG KYU·Filed 2015·Granted Dec 5, 2017·9 cites·11 claims
- 0586US9811122B2Package on packages and mobile computing devices having the sameKWON HEUNG KYU·Filed 2015·Granted Nov 7, 2017·5 cites·16 claims
- 0684US9665122B2Semiconductor device having markings and package on package including the sameKWON HEUNG KYU·Filed 2015·Granted May 30, 2017·6 cites·20 claims
- 0784US9042115B2Stacked semiconductor packagesKWON HEUNG-KYU·Filed 2013·Granted May 26, 2015·4 cites·17 claims
- 0882US8680667B2Semiconductor devices, package substrates, semiconductor packages, package stack structures, and electronic systems having functionally asymmetric conductive elementsKWON HEUNG-KYU·Filed 2012·Granted Mar 25, 2014·5 cites·31 claims
- 0981US8618671B2Semiconductor packages having passive elements mounted thereontoKWON HEUNG-KYU·Filed 2010·Granted Dec 31, 2013·6 cites·11 claims
- 1074US8698301B2Semiconductor packages including a plurality of upper semiconductor devices on a lower semiconductor deviceKWON HEUNG-KYU·Filed 2012·Granted Apr 15, 2014·3 cites·13 claims
- 1154US8963308B2Semiconductor packages including a plurality of upper semiconductor devices on a lower semiconductor deviceKWON HEUNG-KYU·Filed 2014·Granted Feb 24, 2015·0 cites·15 claims
- 1254US2015228627A1Stacked semiconductor packages, methods for fabricating the same, and /or systems employing the sameKWON HEUNG-KYU·Filed 2015·Application pending·0 cites
- 1353US2009317947A1Semiconductor package with heat sink, stack package using the same and manufacturing method thereofKWON HEUNG-KYU·Filed 2009·Application pending·0 cites
- 1447US2012280404A1Stack packages having fastening element and halogen-free inter-package connectorKWON HEUNG-KYU·Filed 2012·Application pending·0 cites
- 1544US10056321B2Semiconductor package and method for routing the packageKWON HEUNG KYU·Filed 2013·Granted Aug 21, 2018·0 cites·23 claims
- 1641US2013009308A1Semiconductor stack package apparatusKWON HEUNG-KYU·Filed 2012·Application pending·0 cites
- 1737US2006102992A1Multi-chip packageKWON HEUNG-KYU·Filed 2005·Application pending·0 cites
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