Structure of embedded active components and manufacturing method thereof

Abstract

A structure of embedded active components and the manufacturing method thereof are provided. The manufacturing steps involve providing a molding plate, and setting several active components on the molding plate as first. A dielectric layer covers the molding plate to cap the active components. An electric circuit is formed on the dielectric layer, in contact with the active components. Finally, the structure with embedded active components is released from the molding plate.

1 . A method of making a structure of embedded active components, comprising the steps of: 
 providing a molding plate;    disposing with alignment a plurality of active components on the molding plate;    covering a dielectric layer on the molding plate to cap the active components;    forming an electrical circuit on the dielectric layer to be in electrical communications with the active components; and    releasing the dielectric layer embedded with the active components from the molding plate.    
     
     
         2 . The method of  claim 1 , wherein the dielectric layer is a polymer layer.  
     
     
         3 . The method of  claim 2 , wherein the polymer layer is selected from the group consisting of Ajinomoto build-up film (ABF) and resin coated copper foil (RCC).  
     
     
         4 . The method of  claim 2  further comprising the step of embedding the active components into the polymer layer by embossing.  
     
     
         5 . The method of  claim 2 , wherein the step of covering a dielectric layer on the molding plate contains the steps of: 
 covering a polymer solution on the active components; and    curing the polymer solution.    
     
     
         6 . The method of  claim 5 , wherein the step of covering a polymer solution on the active components is implemented using a method selected from spraying, spin-coating, and printing.  
     
     
         7 . The method of  claim 1 , wherein the step of forming an electrical circuit on the dielectric layer includes: 
 forming a plurality of conductive holes connecting to the active components on the dielectric layer; and    forming an electrical circuit passing through the conductive holes.    
     
     
         8 . The method of  claim 7 , wherein the conductive holes are formed by a method selected from laser drilling, exposure and developing, and etching.  
     
     
         9 . The method of  claim 7 , wherein the step of forming an electrical circuit passing through the conductive holes includes the steps of: 
 depositing a metal layer on the dielectric layer; and    employing photolithography to transfer a required pattern to the metal layer to form the electrical circuit.    
     
     
         10 . The method of  claim 7  further comprising the step of desmearing the conductive holes.  
     
     
         11 . The method of  claim 1 , wherein the material of the molding plate if Teflon.  
     
     
         12 . The method of  claim 1 , wherein the molding plate contains a mold-separating layer.  
     
     
         13 . The method of  claim 12 , wherein the mold-separating layer is a metal mold-separating layer.  
     
     
         14 . The method of  claim 1  further comprising the step of implanting soldering balls at contact points of the electrical circuit.  
     
     
         15 . A structure of embedded active components, comprising: 
 a dielectric layer;    a plurality of active components embedded in the dielectric layer; and    an electrical circuit installed on the dielectric layer and in electrical communications with the active components.    
     
     
         16 . The structure of embedded active components as in  claim 13 , wherein the dielectric layer is a polymer layer.  
     
     
         17 . The structure of embedded active components as in  claim 13 , wherein the dielectric layer has a plurality of conductive holes for the electrical circuit to connect to the active components.  
     
     
         18 . The structure of embedded active components as in  claim 13  further comprising a plurality of soldering balls installed at contact points of the electrical circuit.