Inventor · disambiguated record
Cheng-Ta Ko
Also filed as: KO CHENG-TA
57 granted patents·28 pending applications·80 citations·filing 2005–2025
97Inventor score
Top patents by PatentIndex Score
85 records- 0195US11516910B1Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Nov 29, 2022·4 cites·10 claims
- 0294US12309943B2Circuit carrier and manufacturing method thereof and package structureUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted May 20, 2025·2 cites·17 claims
- 0392US8304666B2Structure of multiple coaxial leads within single via in substrate and manufacturing method thereofKO CHENG-TA·Filed 2009·Granted Nov 6, 2012·41 cites·21 claims
- 0489US11410971B2Chip package structureUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted Aug 9, 2022·2 cites·11 claims
- 0585US11943877B2Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Mar 26, 2024·1 cites·6 claims
- 0684US11460255B2Vapor chamber device and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted Oct 4, 2022·2 cites·10 claims
- 0782US9130080B2Encapsulation of backside illumination photosensitive deviceIND TECH RES INST·Filed 2013·Granted Sep 8, 2015·3 cites·7 claims
- 0881US10685922B2Package structure with structure reinforcing element and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Jun 16, 2020·2 cites·8 claims
- 0981US10458893B2Miniaturized particulate matter detector and manufacturing method of a filterIND TECH RES INST·Filed 2016·Granted Oct 29, 2019·2 cites·14 claims
- 1078US11445617B2Package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Sep 13, 2022·2 cites·13 claims
- 1178US2025227857A1Manufacturing method of circuit carrierUNIMICRON TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 1277US9373564B2Semiconductor device, manufacturing method and stacking structure thereofIND TECH RES INST·Filed 2015·Granted Jun 21, 2016·3 cites·11 claims
- 1377US8269112B2Flexible circuit structureLEE YUAN-CHANG·Filed 2008·Granted Sep 18, 2012·11 cites·14 claims
- 1475US12250776B2Substrate structure and cutting method thereofUNIMICRON TECHNOLOGY CORP·Filed 2023·Granted Mar 11, 2025·0 cites·13 claims
- 1575US2025393127A1Substrate structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 1672US8008573B2Integrated package structure having solar cell and thermoelectric element and method of fabricating the sameIND TECH RES INST·Filed 2007·Granted Aug 30, 2011·2 cites·14 claims
- 1771US10658282B2Package substrate structure and bonding method thereofUNIMICRON TECHNOLOGY CORP·Filed 2018·Granted May 19, 2020·1 cites·7 claims
- 1869US11410940B2Package structure with structure reinforcing element and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Aug 9, 2022·0 cites·6 claims
- 1969US10083901B2Method for manufacturing circuit redistribution structureUNIMICRON TECHNOLOGY CORP·Filed 2017·Granted Sep 25, 2018·1 cites·7 claims
- 2069US2025240887A1Circuit board and method of manufacturing the sameUNIMICRON TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 2168US12504591B2Co-packaged structure for optics and electricsUNIMICRON TECHNOLOGY CORP·Filed 2023·Granted Dec 23, 2025·0 cites·13 claims
- 2267US12414243B2Manufacturing method of package structureUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Sep 9, 2025·0 cites·10 claims
- 2367US12185479B2Flexible circuit board and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Dec 31, 2024·0 cites·17 claims
- 2467US11690180B2Manufacturing method of carrier structureUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Jun 27, 2023·0 cites·9 claims
- 2567US10957658B2Package structure with structure reinforcing element and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted Mar 23, 2021·0 cites·9 claims
- 2667US9887153B2Circuit redistribution structure unit and method for manufacturing circuit redistribution structureUNIMICRON TECHNOLOGY CORP·Filed 2016·Granted Feb 6, 2018·1 cites·3 claims
- 2766US11637047B2Manufacturing method of chip package structureUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Apr 25, 2023·0 cites·11 claims
- 2864US11991824B2Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted May 21, 2024·0 cites·3 claims
- 2964US2025168988A1Substrate structureUNIMICRON TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 3064US2023067112A1Vapor chamber structureUNIMICRON TECHNOLOGY CORP·Filed 2022·Application pending·0 cites
- 3163US10925172B1Carrier structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Feb 16, 2021·0 cites·8 claims
- 3263US2025240889A1Substrate structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 3362US11462452B2Chip package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Oct 4, 2022·0 cites·10 claims
- 3461US2025239511A1Substrate structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 3561US2025323232A1Package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 3661US2025149426A1Package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 3761US2024248264A1Package structureUNIMICRON TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 3859US11895780B2Manufacturing method of package structureUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Feb 6, 2024·0 cites·5 claims
- 3959US2025331101A1Collapse-free circuit structure with low capacitance effectUNIMICRON TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 4058US12243838B2Circuit substrate structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Mar 4, 2025·0 cites·15 claims
- 4157US11366381B2Mask structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Jun 21, 2022·0 cites·4 claims
- 4257US10854803B2Manufacturing method of light emitting device package structure with circuit redistribution structureUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted Dec 1, 2020·0 cites·3 claims
- 4357US10588214B2Stacked structure and method for manufacturing the sameUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Mar 10, 2020·0 cites·12 claims
- 4457US2024413067A1Electronic package module and method for fabrication of the sameUNIMICRON TECHNOLOGY CORP·Filed 2023·Application pending·0 cites
- 4557US2021247147A1Vapor chamber structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Application pending·0 cites
- 4656US12160953B2Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Dec 3, 2024·0 cites·19 claims
- 4756US2025331108A1Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 4855US11424216B2Electronic device bonding structure and fabrication method thereofUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted Aug 23, 2022·0 cites·8 claims
- 4954US12062742B2Package structure and manufacturing method of the sameUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Aug 13, 2024·0 cites·10 claims
- 5054US8048716B2Structure of embedded active components and manufacturing method thereofIND TECH RES INST·Filed 2009·Granted Nov 1, 2011·0 cites·19 claims
Showing the top 50 of 85 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →