Die-to-die connection method and assemblies and packages including dice so connected

Abstract

A method for assembling semiconductor dice includes orienting at least one second semiconductor die with the active surface thereof facing the active surface of a first semiconductor die. A structure on an active surface of one of the semiconductor dice may interact with a peripheral edge or other feature of another of the semiconductor dice to facilitate alignment of corresponding bond pads of the semiconductor dice. Corresponding bond pads of the first and at least one second semiconductor dice are connected. For example, conductive structures may be formed or placed between the corresponding bond pads. Bond pads of the first semiconductor die that are laterally beyond an outer periphery of each second semiconductor die may be electrically connected to corresponding contacts.

1 . A method for interconnecting at least two semiconductor dice, comprising: 
 orienting a first semiconductor die and at least one second semiconductor die with active surfaces thereof facing each other with an alignment structure that is disposed on the active surface of the first semiconductor die and that interacts with a peripheral edge of the at least one second semiconductor die;    electrically connecting at least some bond pads of the first semiconductor die and corresponding bond pads of the at least one second semiconductor die.    
   
   
       2 . The method of  claim 1 , wherein orienting comprises orienting the at least one second semiconductor die over at least some bond pads of the first semiconductor die.  
   
   
       3 . The method of  claim 1 , wherein orienting includes orienting the first semiconductor die and the at least one second semiconductor die so that other bond pads of the first semiconductor die are exposed beyond a peripheral edge of the second semiconductor die.  
   
   
       4 . The method of  claim 1 , wherein orienting the first semiconductor die and the at least one second semiconductor die includes orienting a logic device with another semiconductor device.  
   
   
       5 . The method of  claim 4 , wherein orienting the logic device with another semiconductor device includes orienting a logic device with at least one memory device.  
   
   
       6 . The method of  claim 1 , wherein electrically connecting comprises providing conductive structures between aligned bond pads of the first semiconductor die and the at least one second semiconductor die.  
   
   
       7 . The method of  claim 1 , further comprising: 
 orienting the first semiconductor die and a carrier with the active surface thereof facing the carrier; and    electrically connecting other bond pads of the first semiconductor die and corresponding contacts of the carrier.    
   
   
       8 . The method of  claim 7 , wherein orienting the first semiconductor die and the carrier comprises orienting the first semiconductor die with the active surface thereof facing a carrier substrate with the plurality of contacts comprising contact pads.  
   
   
       9 . The method of  claim 8 , wherein orienting the first semiconductor die and the carrier comprises orienting the first semiconductor die with a carrier that includes at least one recess in a surface thereof.  
   
   
       10 . The method of  claim 9 , wherein orienting the first semiconductor die and the carrier includes at least partially disposing the at least the at least one second semiconductor die in the at least one recess.  
   
   
       11 . The method of  claim 9 , wherein: 
 providing the carrier comprises providing a carrier including a recess with a ledge therein and contacts exposed at the ledge; and    orienting the first semiconductor die and the carrier comprises orienting the first semiconductor die within the recess with the active surface of the first semiconductor die facing the carrier and the ledge.    
   
   
       12 . The method of  claim 11 , further comprising: 
 positioning a cover over the recess and the first and at least one second semiconductor dice therein.    
   
   
       13 . The method of  claim 7 , wherein orienting the first semiconductor die and the carrier comprises orienting the first semiconductor die with leads that correspond to each of the other bond pads.  
   
   
       14 . The method of  claim 7 , wherein electrically connecting the other bond pads of the first semiconductor die to the corresponding contacts of the carrier comprises disposing conductive elements between the other bond pads and the corresponding contacts.  
   
   
       15 . The method of  claim 7 , wherein orienting the first semiconductor die and the carrier comprises orienting a first semiconductor die with a first member of a conductive element secured to each other bond pad thereof and a carrier with a second member of the conductive element secured to each corresponding contact thereof.  
   
   
       16 . The method of  claim 15 , further comprising: 
 aligning at least the first and second members of the conductive element.    
   
   
       17 . The method of  claim 16 , further comprising: 
 securing at least the first and second members of the conductive element to each other.    
   
   
       18 . The method of  claim 17 , wherein securing comprises providing a conductive mating structure between the first and second members of the conductive element.  
   
   
       19 . The method of  claim 7 , further comprising: 
 disposing a quantity of encapsulant material over at least the active surface of the first semiconductor die.    
   
   
       20 . The method of  claim 19 , wherein disposing the quantity of encapsulant material comprises introducing underfill material between the first semiconductor die and the carrier.  
   
   
       21 . The method of  claim 19 , wherein disposing the quantity of encapsulant material comprises substantially covering the first semiconductor die.