Method for encasing plastic array packages

Abstract

The upper and lower mold plates of a transfer molding machine are configured for one-side encapsulation of a pair of substrate mounted electronic devices having an opposite conductor-grid-array and/or bare heat sink/dissipater. A buffer member, optionally with cut-outs or apertures, may be placed between the two back-to-back substrates for protecting the grid-arrays and enabling encapsulation of devices with varying thicknesses without adjustment of the molding machine. Alternately, the upper and lower plates are configured for one-side encasement using covers of a pair of substrate mounted electronic devices having an opposite conductor-grid-array and/or bare heat sink/dissipater.

1 . A method of forming at least a portion of a package of a plurality of electronic devices within a mold cavity comprising: 
 placing a first substrate having a first side, a second side, and at least one electronic component on the first side of the first substrate and a second substrate having a first side, second side, and at least one electronic component on the first side of the second substrate into a mold cavity formed by upper and lower mold plates;    moving the upper and lower mold plates toward each other to form the mold cavity causing portions of the upper mold plate to engage portions of the first surface of the first substrate and portions of the lower mold plate to engage portions of the first surface of the second substrate;    injecting a first material into the mold cavity portion of the upper mating mold plate and a second material into the mold cavity portion of the lower mating mold plate to encapsulate the at least one electronic component on the first side of the first substrate and the at least one electronic component on the first side of the second substrate; and    removing the first substrate and the second substrate from the upper and lower mating mold plates.    
   
   
       2 . The method of  claim 1 , wherein the injecting the second material into the mold cavity portion of the lower mating mold plate comprises injecting a material substantially identical to the first material.  
   
   
       3 . The method of  claim 1 , wherein the injecting the second material into the mold cavity portion of the lower mating mold plate comprises injection of a material substantially different from the first material.  
   
   
       4 . The method of  claim 1 , wherein the first material and the second material are injected substantially simultaneously.  
   
   
       5 . The method of  claim 1 , wherein the first material and the second material are injected at different times.  
   
   
       6 . The method of  claim 1 , further comprising cleaning the second side of each of the first substrate and the second substrate.  
   
   
       7 . The method of  claim 1 , further comprising curing the plurality of electronic devices at an elevated curing temperature.  
   
   
       8 . An encapsulation method for a plurality of electronic devices within a mold cavity of an encapsulation apparatus, the encapsulation apparatus having upper and lower mating mold plates, each of the upper and lower mating mold plates having a mold cavity portion, each mold cavity portion of the upper and lower mating mold plates having a feed runner leading thereto from a material supply and having a vent runner connected thereto for venting each mold cavity portion, each mold cavity portions together comprising the mold cavity of the encapsulation apparatus, the method comprising: 
 inserting placing a first substrate having a first side, a second side, and at least one electronic component located on the first side of the first substrate and a second substrate having a first side, a second side, and at least one electronic component located on the first side of the second substrate, the second side of the first substrate and the second side of the second substrate placed in a back-to-back orientation in the mold cavity;    abutting portions of the upper and lower mating mold plates to form the mold cavity, portions of the upper mating mold plate engaging portions of the first side of the first substrate and portions of the lower mating mold plate engaging portions of the first side of the second substrate and causing the second side of the first substrate and the second side of the second substrate to have portions thereof in engagement; and    injecting a first material into the mold cavity portion of the upper mating mold plate and a second material into the mold cavity portion of the lower mating mold plate to separately encapsulate the first side of each of the first and second substrates, the second material comprising one of the first material and a similar material for removing the plurality of electronic devices from the mold cavity.    
   
   
       9 . The method of  claim 8 , wherein the injecting the second material into the mold cavity portion of the lower mating mold plate comprises injecting a material substantially identical to the first material.  
   
   
       10 . The method of  claim 8 , wherein injecting the second material into the mold cavity portion of the lower mating mold plate comprises injecting a material substantially different from the first material.  
   
   
       11 . The method of  claim 8 , wherein the first material and the second material are injected substantially simultaneously.  
   
   
       12 . The method of  claim 8 , wherein the first material and the second material are injected at different times.  
   
   
       13 . The method of  claim 8 , further comprising cleaning the second side of each of the first substrate and the second substrate.  
   
   
       14 . The method of  claim 8 , further comprising subjecting the plurality of electronic devices to a curing temperature.  
   
   
       15 . The method of  claim 8 , wherein the second side of each of the first substrate and the second substrate includes solder bumps thereon.