Inventor · disambiguated record
Steven G. Thummel
Also filed as: THUMMEL STEVEN G
19 granted patents·2 pending applications·1,679 citations·filing 1997–2006
97Inventor score
Technology areasH10W
Top patents by PatentIndex Score
21 records- 0199US6326244B1Method of making a cavity ball grid array apparatusMICRON TECHNOLOGY INC·Filed 2000·Granted Dec 4, 2001·376 cites·92 claims
- 0299US6084297ACavity ball grid array apparatusMICRON TECHNOLOGY INC·Filed 1998·Granted Jul 4, 2000·319 cites·53 claims
- 0396US6332766B1Apparatus for encasing array packagesMICRON TECHNOLOGY INC·Filed 1999·Granted Dec 25, 2001·135 cites·21 claims
- 0496US6117382AMethod for encasing array packagesMICRON TECHNOLOGY INC·Filed 1998·Granted Sep 12, 2000·151 cites·17 claims
- 0595US5893726ASemiconductor package with pre-fabricated cover and method of fabricationMICRON TECHNOLOGY INC·Filed 1997·Granted Apr 13, 1999·174 cites·23 claims
- 0694US6989121B2Method for encasing plastic array packagesMICRON TECHNOLOGY INC·Filed 2003·Granted Jan 24, 2006·60 cites·15 claims
- 0794US6247629B1Wire bond monitoring system for layered packagesMICRON TECHNOLOGY INC·Filed 1999·Granted Jun 19, 2001·144 cites·9 claims
- 0892US6577004B1Solder ball landpad design to improve laminate performanceMICRON TECHNOLOGY INC·Filed 2000·Granted Jun 10, 2003·75 cites·46 claims
- 0992US6057597ASemiconductor package with pre-fabricated coverMICRON TECHNOLOGY INC·Filed 1998·Granted May 2, 2000·107 cites·27 claims
- 1086US6287503B1Method for encasing array packagesMICRON TECHNOLOGY INC·Filed 2000·Granted Sep 11, 2001·28 cites·17 claims
- 1182US6982486B2Cavity ball grid array apparatus having improved inductance characteristics and method of fabricating the sameMICRON TECHNOLOGY INC·Filed 2004·Granted Jan 3, 2006·20 cites·28 claims
- 1281US7268013B2Method of fabricating a semiconductor die package having improved inductance characteristicsMICRON TECHNOLOGY INC·Filed 2005·Granted Sep 11, 2007·6 cites·12 claims
- 1380US6626656B2Apparatus for encasing array packagesMICRON TECHNOLOGY INC·Filed 2001·Granted Sep 30, 2003·18 cites·12 claims
- 1477US6740971B2Cavity ball grid array apparatus having improved inductance characteristicsMICRON TECHNOLOGY INC·Filed 2001·Granted May 25, 2004·16 cites·55 claims
- 1568US6085962AWire bond monitoring system for layered packagesMICRON TECHNOLOGY INC·Filed 1997·Granted Jul 11, 2000·29 cites·9 claims
- 1667US6616880B2Method for encasing array packagesMICRON TECHNOLOGY INC·Filed 2001·Granted Sep 9, 2003·8 cites·16 claims
- 1766US6914326B2Solder ball landpad design to improve laminate performanceMICRON TECHNOLOGY INC·Filed 2003·Granted Jul 5, 2005·11 cites·24 claims
- 1852US2007007517A1Cavity ball grid array apparatus having improved inductance characteristicsBROOKS JERRY M·Filed 2006·Application pending·0 cites
- 1951US6893244B2Apparatus for encasing array packagesMICRON TECHNOLOGY INC·Filed 2003·Granted May 17, 2005·2 cites·5 claims
- 2050US2006119001A1Method for encasing plastic array packagesTHUMMEL STEVEN G·Filed 2006·Application pending·0 cites
- 2139US7951646B2Solder ball landpad design to improve laminate performanceROUND ROCK RES LLC·Filed 2003·Granted May 31, 2011·0 cites·21 claims
Join the waitlist — get patent alerts
Get an alert when Steven G. Thummel files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →