Semiconductor device and a method of manufacturing the same

Abstract

It is intended to improve the production yield of QFN (Quad Flat Non-leaded package) and attain a multi-pin structure. After a resin sealing member for sealing a semiconductor chip is formed by molding, a peripheral portion of the resin sealing member and a lead frame are both cut along a cutting line which is positioned inside (on a central side of the resin sealing member) of a line (molding line) extending along an outer edge of the resin sealing member, whereby the whole surface (upper and lower surfaces and both side faces) of each of leads exposed to side faces (cut faces) of the resin sealing member is covered with resin, thus preventing the occurrence of metallic burrs on the cut faces of the leads.

1 - 15 . (canceled)  
     
     
         16 . A method of manufacturing a semiconductor device comprising the step of: 
 (a) providing a lead frame formed with a plurality of patterns including a die pad and a plurality of leads arranged around the die pad;    (b) mounting a plurality of semiconductor chips over the plurality of die pads respectively;    (c) electrically connecting the plurality of semiconductor chips and the plurality of leads through a plurality of wires respectively;    (d) after the step (c), sandwiching the lead frame between an upper molding die and a lower molding die, and injecting resin into a plurality of cavities to form a plurality of resin sealing members, the plurality of cavities being formed between the upper molding die and the lower molding die, and corresponding to the plurality of patterns respectively; and    (e) after the step (d), cutting the lead frame and the plurality of resin sealing members with a dicer to divide the plurality of resin sealing members into individual pieces,    wherein in the plurality of resin sealing members formed in the step (d), adjacent resin sealing members connect to each other.    
     
     
         17 . A method of manufacturing a semiconductor device according to  claim 16 , wherein the lead frame has a terminal formed on each of the plurality of leads, and a contact portion formed in a point contacting with the upper molding die, the contact portion being formed with substantially the same thickness as the terminal, and 
 wherein the step (e) includes cutting between the terminal and the contact portion with the dicer to divide the plurality of resin sealing members into individual pieces.    
     
     
         18 . A method of manufacturing a semiconductor device according to  claim 17 , wherein a member for constituting the lead frame is subjected to half-etching at portions other than parts corresponding to the terminal and the contact portion.  
     
     
         19 . A method of manufacturing a semiconductor device according to  claim 16 , wherein in the step (d) includes sandwiching the lead frame at positions disposed to be between adjacent resin sealing members.  
     
     
         20 . A method of manufacturing a semiconductor device according to  claim 16 , wherein a plurality of gate portions are formed at one side of the upper molding die outside the plurality of cavities, and a plurality of dummy cavities and a plurality of air vents are formed at another side opposite to the one side of the upper molding die.  
     
     
         21 . A method of manufacturing a semiconductor device according to  claim 16 , wherein the dicer has two dicing blades and cuts to-be-cut faces of adjacent resin sealing members simultaneously.  
     
     
         22 . A method of manufacturing a semiconductor device according to  claim 16 , wherein the dicer has one dicing blade, the dicing blade having a width equal to a spacing between to-be-cut faces of adjacent resin sealing members.  
     
     
         23 . A method of manufacturing a semiconductor device according to  claim 16 , 
 wherein the lead frame has a plurality of suspension leads, a projection formed on each of the plurality of suspension leads, and a contact portion formed in the point contacting with the upper molding die, with one end portion of each of the plurality of suspension leads connecting to the die pad, and the contact portion being formed with a same thickness as the projection, and    wherein the step (e) includes cutting between the projection and the contact portion with the dicer to divide the plurality of resin sealing members into individual pieces.    
     
     
         24 . A method of manufacturing a semiconductor device according to  claim 23 , wherein a member for constituting the lead frame is subjected to half-etching at portions other than parts corresponding to the projection and the contact portion.