Inventor · disambiguated record
Fujio Ito
Also filed as: ITO FUJIO
39 granted patents·17 pending applications·625 citations·filing 1996–2016
98Inventor score
Top patents by PatentIndex Score
56 records- 0196US6291273B1Plastic molded type semiconductor device and fabrication process thereofHITACHI LTD·Filed 1996·Granted Sep 18, 2001·208 cites·18 claims
- 0290US6456321B1Surveillance camera apparatus, remote surveillance apparatus and remote surveillance system having the surveillance camera apparatus and the remote surveillance apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Sep 24, 2002·154 cites·12 claims
- 0387US7466024B2Multi-chip semiconductor device packageRENESAS TECH CORP·Filed 2006·Granted Dec 16, 2008·11 cites·2 claims
- 0484US9155212B2Electronic component, mounting member, electronic apparatus, and their manufacturing methodsCANON KK·Filed 2013·Granted Oct 6, 2015·7 cites·20 claims
- 0583US7998795B2Method of manufacturing a semiconductor device including plural semiconductor chipsRENESAS ELECTRONICS CORP·Filed 2010·Granted Aug 16, 2011·5 cites·1 claims
- 0682US9978675B2Package, electronic component, and electronic apparatusCANON KK·Filed 2016·Granted May 22, 2018·5 cites·20 claims
- 0782US6809405B2Semiconductor device and method of manufacturing the sameRENESAS TECH CORP·Filed 2002·Granted Oct 26, 2004·30 cites·10 claims
- 0881US7772044B2Method of manufacturing a semiconductor device including plural semiconductor chipsRENESAS TECH CORP·Filed 2008·Granted Aug 10, 2010·7 cites·6 claims
- 0979US6767209B1Interdental brush and production method thereforSUNSTAR INC·Filed 1999·Granted Jul 27, 2004·42 cites·17 claims
- 1078US9220172B2Electronic component, electronic module, their manufacturing methods, mounting member, and electronic apparatusCANON KK·Filed 2013·Granted Dec 22, 2015·5 cites·20 claims
- 1178US7339259B2Semiconductor deviceRENESAS TECH CORP·Filed 2007·Granted Mar 4, 2008·7 cites·3 claims
- 1275US7507606B2Semiconductor device and method of manufacturing the sameRENESAS TECH CORP·Filed 2006·Granted Mar 24, 2009·6 cites·10 claims
- 1374US7176487B2Semiconductor integrated circuitRENESAS TECH CORP·Filed 2005·Granted Feb 13, 2007·6 cites·6 claims
- 1468US9585287B2Electronic component, electronic apparatus, and method for manufacturing the electronic componentCANON KK·Filed 2014·Granted Feb 28, 2017·2 cites·20 claims
- 1566US9171874B2Solid-state imaging device including an imaging element and a cover member having a quartz plateSUZUKI TAKANORI·Filed 2011·Granted Oct 27, 2015·1 cites·30 claims
- 1666US7208817B2Semiconductor deviceRENESAS TECH CORP·Filed 2004·Granted Apr 24, 2007·11 cites·6 claims
- 1765US7247576B2Method of manufacturing a semiconductor deviceHITACHI ULSI SYS CO LTD·Filed 2005·Granted Jul 24, 2007·2 cites·4 claims
- 1865US6558980B2Plastic molded type semiconductor device and fabrication process thereofFiled 2001·Granted May 6, 2003·11 cites·8 claims
- 1965US6396142B1Semiconductor deviceHITACHI LTD·Filed 1999·Granted May 28, 2002·21 cites·23 claims
- 2063US6780679B2Semiconductor device and method of manufacturing the sameRENESAS TECH CORP·Filed 2002·Granted Aug 24, 2004·11 cites·6 claims
- 2161US7199469B2Semiconductor device having stacked semiconductor chips sealed with a resin seal memberHITACHI HOKKAI SEMICONDUCTOR·Filed 2001·Granted Apr 3, 2007·12 cites·4 claims
- 2259US7160759B2Semiconductor device and method of manufacturing the sameHITACHI ULSI SYS CO LTD·Filed 2004·Granted Jan 9, 2007·8 cites·19 claims
- 2358US7335529B2Manufacturing method of a semiconductor device utilizing a flexible adhesive tapeRENESAS TECH CORP·Filed 2003·Granted Feb 26, 2008·8 cites·17 claims
- 2458US6989334B2Manufacturing method of a semiconductor deviceHITACHI ULSI SYS CO LTD·Filed 2003·Granted Jan 24, 2006·6 cites·8 claims
- 2557US7482699B2Semiconductor deviceRENESAS TECH CORP·Filed 2003·Granted Jan 27, 2009·6 cites·12 claims
- 2657US6943456B2Plastic molded type semiconductor device and fabrication process thereofHITACHI LTD·Filed 2004·Granted Sep 13, 2005·6 cites·7 claims
- 2757US6803258B2Semiconductor deviceRENESAS TECH CORP·Filed 2002·Granted Oct 12, 2004·5 cites·8 claims
- 2856US7758317B2Method of analyzing vaporization pattern of solvent and solvent vacuum vaporization deviceASTELLAS PHARMA INC·Filed 2004·Granted Jul 20, 2010·2 cites·8 claims
- 2953US7413930B2Lead frame and method of manufacturing the lead frameRENESAS TECH CORP·Filed 2003·Granted Aug 19, 2008·4 cites·2 claims
- 3053US7019388B2Semiconductor deviceRENESAS E JP SEMICONDUCTOR INC·Filed 2003·Granted Mar 28, 2006·7 cites·7 claims
- 3153US6893898B2Semiconductor device and a method of manufacturing the sameHITACHI ULSI SYS CO LTD·Filed 2003·Granted May 17, 2005·5 cites·16 claims
- 3252US7678706B2Method of manufacturing a semiconductor deviceRENESAS TECH CORP·Filed 2007·Granted Mar 16, 2010·0 cites·7 claims
- 3352US2009108422A1Semiconductor deviceRENESAS TECH CORP·Filed 2008·Application pending·0 cites
- 3451US7989267B2Manufacturing method of semiconductor device and manufacturing method of lead frameRENESAS ELECTRONICS CORP·Filed 2008·Granted Aug 2, 2011·0 cites·2 claims
- 3551US2008311703A1Lead frame and a method of manufacturing the sameITO FUJIO·Filed 2008·Application pending·0 cites
- 3649US6673655B2Method of making semiconductor device having improved heat radiation plate arrangementHITACHI LTD·Filed 2002·Granted Jan 6, 2004·2 cites·7 claims
- 3748US2005230793A1Semiconductor deviceITO FUJIO·Filed 2005·Application pending·0 cites
- 3847US7374973B2Manufacturing method of semiconductor device and manufacturing method of lead frameRENESAS TECH CORP·Filed 2005·Granted May 20, 2008·0 cites·16 claims
- 3947US6692989B2Plastic molded type semiconductor device and fabrication process thereofRENESAS TECH CORP·Filed 2003·Granted Feb 17, 2004·2 cites·8 claims
- 4046US2005189627A1Method of surface mounting a semiconductor deviceFiled 2005·Application pending·0 cites
- 4144US2005189629A1Method of manufacturing a semiconductor deviceFiled 2005·Application pending·0 cites
- 4243US9253922B2Electronic component and electronic apparatusCANON KK·Filed 2013·Granted Feb 2, 2016·0 cites·21 claims
- 4341US2006125064A1Semiconductor device and a method of manufacturing the sameRENESAS E JP SEMICONDUCTOR INC·Filed 2006·Application pending·0 cites
- 4441US2007077732A1Semiconductor device and a manufacturing method of the sameRENESAS TECH CORP·Filed 2006·Application pending·0 cites
- 4541US2006199302A1Semiconductor device and a manufacturing method of the sameITO FUJIO·Filed 2006·Application pending·0 cites
- 4641US2007120237A1Semiconductor integrated circuitSAKAMOTO NORIAKI·Filed 2007·Application pending·0 cites
- 4741US2004126932A1Semiconductor deviceFiled 2003·Application pending·0 cites
- 4840US2002192871A1Semiconductor deviceFiled 2002·Application pending·0 cites
- 4939US2004262752A1Semiconductor deviceFiled 2004·Application pending·0 cites
- 5039US2005263863A1Semiconductor device and a method of manufacturing the sameSASAKI TOSHIO·Filed 2005·Application pending·0 cites
Showing the top 50 of 56 patent records by PatentIndex Score.
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