US2006131003A1PendingUtilityA1

Apparatus and associated method for microelectronic cooling

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Assignee: CHANG JE-YOUNGPriority: Dec 20, 2004Filed: Dec 20, 2004Published: Jun 22, 2006
Est. expiryDec 20, 2024(expired)· nominal 20-yr term from priority
Inventors:Je-Young ChangRavi PrasherPaul J. GwinIoan Sauciuc
F28F 2260/02F28F 3/12F28D 15/0266
42
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Claims

Abstract

An apparatus and associated method to provide liquid cooling to a microelectronic device are generally described. In this regard, according to one example embodiment, a cooling solution including Potassium Formate in combination with inhibitors is processed through a cooling system to remove heat from a microelectronic device.

Claims

exact text as granted — not AI-modified
1 . A cooling system comprising: 
 a microchannel heat exchanger; and    a coolant comprising Potassium Formate in combination with one or more inhibitor(s) selectively processed through the microchannel heat exchanger.    
   
   
       2 . A system according to  claim 1 , wherein the microchannel heat exchanger is integrated onto a microelectronic device.  
   
   
       3 . A system according to  claim 1 , wherein the microchannel heat exchanger is thermally coupled to a microelectronic device.  
   
   
       4 . A system according to  claim 3 , wherein the microelectronic device is an integrated circuit die.  
   
   
       5 . A system according to  claim 1 , wherein the microchannel heat exchanger is used in a single-phase liquid cooling system.  
   
   
       6 . A system according to  claim 1 , wherein the Potassium Formate comprises 30-50% of the coolant solution.  
   
   
       7 . A system according to  claim 1 , further comprising: 
 a heat removal system; and    a pump to move the coolant through the microchannel heat exchanger and the heat removal system.    
   
   
       8 . A system according to  claim 7 , wherein the pump is an electro-osmotic pump.  
   
   
       9 . A system according to  claim 7 , wherein the heat removal system comprises: 
 fins to increase the surface area of a material in contact with the coolant; and    a fan, to move air over the fins.    
   
   
       10 . A system according to  claim 1 , wherein the inhibitor(s) comprise one or more of corrosion inhibitor(s) and/or biocide(s).  
   
   
       11 . A cooling system comprising: 
 a microchannel heat exchanger integrated onto a microelectronic device; and    a coolant comprising Potassium Formate in combination with one or more inhibitor(s) selectively processed through the microchannel heat exchanger.    
   
   
       12 . A system according to  claim 11 , wherein the microelectronic device is an integrated circuit die.  
   
   
       13 . A system according to  claim 1   1 , wherein the microchannel heat exchanger is used in a single-phase liquid cooling system.  
   
   
       14 . A system according to  claim 11 , wherein the Potassium Formate comprises 30-50% of the coolant solution.  
   
   
       15 . A system according to  claim 11 , further comprising: 
 a heat removal system; and    a pump to move the coolant through the microchannel heat exchanger and the heat removal system.    
   
   
       16 . A system according to  claim 15 , wherein the heat removal system comprises: 
 fins to increase the surface area of a material in contact with the coolant; and    a fan, to move air over the fins.    
   
   
       17 . A cooling system comprising: 
 a microchannel heat exchanger thermally coupled to a microelectronic device; and    a coolant comprising Potassium Formate in combination with one or more inhibitor(s) selectively processed through the microchannel heat exchanger.    
   
   
       18 . A system according to  claim 17 , wherein the microelectronic device is an integrated circuit die.  
   
   
       19 . A system according to  claim 17 , further comprising: 
 a heat removal system; and    a pump to move the coolant through the microchannel heat exchanger and the heat removal system.    
   
   
       20 . A cooling method comprising: 
 generating heat in a microelectronic device; and    selectively processing a coolant comprising Potassium Formate and one or more inhibitor(s) through a microchannel heat exchanger to remove heat from the microelectronic device.    
   
   
       21 . A cooling method according to  claim 20 , wherein the microelectronic device is an integrated circuit die.  
   
   
       22 . A cooling method according to  claim 20 , wherein the selective processing comprises: 
 pumping the coolant through the microchannel heat exchanger and a heat removal system.    
   
   
       23 . A cooling method according to  claim 20 , further comprising: 
 removing heat from the coolant via a heat removal system.    
   
   
       24 . A system comprising: 
 a microchannel heat exchanger thermally coupled to a microelectronic device;    a cooling solution including Potassium Formate in combination with one or more inhibitor(s) selectively processed through the microchannel heat exchanger; and    another device electrically coupled to the microelectronic device.    
   
   
       25 . A system according to  claim 24 , wherein the microelectronic device is an integrated circuit die.  
   
   
       26 . A system according to  claim 24 , wherein the microchannel heat exchanger is used in a single-phase liquid cooling system.

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