Inventor · disambiguated record
Je-Young Chang
Also filed as: CHANG JE-YOUNG · CHANG JE-YOUNG G
46 granted patents·23 pending applications·364 citations·filing 2001–2024
97Inventor score
Top patents by PatentIndex Score
69 records- 0196US10228735B2Methods of direct cooling of packaged devices and structures formed therebyINTEL CORP·Filed 2017·Granted Mar 12, 2019·18 cites·25 claims
- 0296US7592697B2Microelectronic package and method of cooling sameINTEL CORP·Filed 2007·Granted Sep 22, 2009·64 cites·7 claims
- 0396US7259965B2Integrated circuit coolant microchannel assembly with targeted channel configurationINTEL CORP·Filed 2005·Granted Aug 21, 2007·40 cites·14 claims
- 0492US12238892B2Immersion cooling for integrated circuit devicesINTEL CORP·Filed 2020·Granted Feb 25, 2025·3 cites·15 claims
- 0591US11721607B2Integrated circuit assemblies having metal foam structuresINTEL CORP·Filed 2020·Granted Aug 8, 2023·3 cites·20 claims
- 0690US6621698B2Computer assembly providing cooling for more than one electronic componentINTEL CORP·Filed 2001·Granted Sep 16, 2003·64 cites·13 claims
- 0787US11935808B2IC die and heat spreaders with solderable thermal interface structures for multi-chip assemblies including solder array thermal interconnectsINTEL CORP·Filed 2020·Granted Mar 19, 2024·2 cites·22 claims
- 0887US7283360B2Enhanced flow channel for component cooling in computer systemsINTEL CORP·Filed 2006·Granted Oct 16, 2007·14 cites·9 claims
- 0987US7104313B2Apparatus for using fluid laden with nanoparticles for application in electronic coolingINTEL CORP·Filed 2003·Granted Sep 12, 2006·45 cites·10 claims
- 1086US9686888B2Heat dissipation lid having direct liquid contact conduitsINTEL CORP·Filed 2015·Granted Jun 20, 2017·5 cites·8 claims
- 1183US11456232B2Thermal assemblies for multi-chip packagesINTEL CORP·Filed 2018·Granted Sep 27, 2022·4 cites·22 claims
- 1283US7243705B2Integrated circuit coolant microchannel with compliant coverINTEL CORP·Filed 2005·Granted Jul 17, 2007·10 cites·2 claims
- 1381US11676883B2Thermoelectric coolers combined with phase-change material in integrated circuit packagesINTEL CORP·Filed 2019·Granted Jun 13, 2023·2 cites·23 claims
- 1481US10727160B2Thermal management componentINTEL CORP·Filed 2017·Granted Jul 28, 2020·3 cites·18 claims
- 1581US7131487B2Use of adjusted evaporator section area of heat pipe that is sized to match the surface area of an integrated heat spreader used in CPU packages in mobile computersINTEL CORP·Filed 2001·Granted Nov 7, 2006·26 cites·13 claims
- 1680US11574851B2Coupled cooling fins in ultra-small systemsINTEL CORP·Filed 2019·Granted Feb 7, 2023·3 cites·23 claims
- 1779US7471515B2Integrated circuit coolant microchannel assembly with manifold member that facilitates coolant line attachmentINTEL CORP·Filed 2007·Granted Dec 30, 2008·7 cites·5 claims
- 1878US12191220B2Hybrid interposer of glass and silicon to reduce thermal crosstalkINTEL CORP·Filed 2019·Granted Jan 7, 2025·2 cites·14 claims
- 1978US10468331B2Heat management systemINTEL CORP·Filed 2018·Granted Nov 5, 2019·3 cites·25 claims
- 2077US7123479B2Enhanced flow channel for component cooling in computer systemsINTEL CORP·Filed 2003·Granted Oct 17, 2006·21 cites·19 claims
- 2176US12283535B2IC die and heat spreaders with solderable thermal interface structures for multi-chip assemblies including solder array thermal interconnectsINTEL CORP·Filed 2023·Granted Apr 22, 2025·0 cites·14 claims
- 2274US9477275B2Thermal management solution for circuit productsCHOUDHURY ARNAB·Filed 2013·Granted Oct 25, 2016·5 cites·17 claims
- 2374US7317615B2Integrated circuit coolant microchannel assembly with manifold member that facilitates coolant line attachmentINTEL CORP·Filed 2005·Granted Jan 8, 2008·5 cites·7 claims
- 2470US11081450B2Radiation shield around a component on a substrateINTEL CORP·Filed 2019·Granted Aug 3, 2021·1 cites·20 claims
- 2568US11804418B2Direct liquid micro jet (DLMJ) structures for addressing thermal performance at limited flow rate conditionsINTEL CORP·Filed 2019·Granted Oct 31, 2023·1 cites·20 claims
- 2668US7309453B2Coolant capable of enhancing corrosion inhibition, system containing same, and method of manufacturing sameINTEL CORP·Filed 2006·Granted Dec 18, 2007·5 cites·35 claims
- 2761US2025008637A1Isolation and protection of computing components from liquid immersion cooling fluidsCARTE CASEY JAMESEN·Filed 2024·Application pending·0 cites
- 2860US11495518B2Multi-surface heat sink suitable for multi-chip packagesINTEL CORP·Filed 2019·Granted Nov 8, 2022·1 cites·16 claims
- 2958US2024008226A1Method and apparatus for real time, in-situ immersion coolant characterization and filtration system control in response theretoINTEL CORP·Filed 2023·Application pending·0 cites
- 3057US8673626B2Biosensor for analyzing quantitatively analyte with a predetermined size and larger than, and manufacturing method thereofCHANG JE-YOUNG·Filed 2008·Granted Mar 18, 2014·1 cites·13 claims
- 3157US2024032248A1Immersion cooling system with multiple cooling liquidsINTEL CORP·Filed 2023·Application pending·0 cites
- 3256US2019094925A1Methods of direct cooling of packaged devices and structures formed therebyINTEL CORP·Filed 2018·Application pending·0 cites
- 3354US11984377B2IC die and heat spreaders with solderable thermal interface structures for assemblies including solder array thermal interconnectsINTEL CORP·Filed 2020·Granted May 14, 2024·0 cites·25 claims
- 3453US6867977B2Method and apparatus for protecting thermal interfacesINTEL CORP·Filed 2003·Granted Mar 15, 2005·5 cites·25 claims
- 3553US2024213111A1Configurable micro heat pipe (mhp) and microchannel for improved cooling of glass core substrateINTEL CORP·Filed 2022·Application pending·0 cites
- 3652US2023253288A1Immersion cooling for integrated circuit devicesINTEL CORP·Filed 2022·Application pending·0 cites
- 3751US11901262B2Cooling solution including microchannel arrays and methods of forming the sameINTEL CORP·Filed 2019·Granted Feb 13, 2024·0 cites·16 claims
- 3851US11854932B2Package wrap-around heat spreaderINTEL CORP·Filed 2019·Granted Dec 26, 2023·0 cites·26 claims
- 3951US11832419B2Full package vapor chamber with IHSINTEL CORP·Filed 2019·Granted Nov 28, 2023·0 cites·26 claims
- 4051US11670561B23D buildup of thermally conductive layers to resolve die height differencesINTEL CORP·Filed 2019·Granted Jun 6, 2023·0 cites·25 claims
- 4151US10600699B2Apparatus for inspection of a package assembly with a thermal solutionINTEL CORP·Filed 2017·Granted Mar 24, 2020·0 cites·17 claims
- 4251US2023125822A1Immersion cooling for integrated circuit devicesINTEL CORP·Filed 2021·Application pending·0 cites
- 4350US12048123B2Heat dissipation device having shielding/containment extensionsINTEL CORP·Filed 2020·Granted Jul 23, 2024·0 cites·18 claims
- 4450US11923267B2IC die with solderable thermal interface structures for assemblies including solder array thermal interconnectsINTEL CORP·Filed 2020·Granted Mar 5, 2024·0 cites·16 claims
- 4549US11378346B2Two-phase metallic alloys to facilitate thermal energy storage of a system on chipINTEL CORP·Filed 2018·Granted Jul 5, 2022·0 cites·19 claims
- 4648US11469185B2Standoff members for semiconductor packageINTEL CORP·Filed 2017·Granted Oct 11, 2022·0 cites·25 claims
- 4748US2024260228A1Immersion cooling systems, apparatus, and related methodsINTEL CORP·Filed 2022·Application pending·0 cites
- 4847US11322456B2Die back side structures for warpage controlINTEL CORP·Filed 2017·Granted May 3, 2022·0 cites·20 claims
- 4947US2007230116A1Integrated circuit coolant microchannel with compliant coverMYERS ALAN M·Filed 2007·Application pending·0 cites
- 5046US12046536B2Integrated heat spreader with enhanced vapor chamber for multichip packagesINTEL CORP·Filed 2019·Granted Jul 23, 2024·0 cites·16 claims
Showing the top 50 of 69 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →