Immersion cooling for integrated circuit devices

Abstract

A two-phase immersion cooling system for integrated circuit assembly may be formed utilizing a heat dissipation device thermally coupled to at least one integrated circuit device, wherein the heat dissipation device may include a surface enhancement structure and a boiling enhancement material layer, such as a micro-porous material, on the surface enhancement structure.

What is claimed is: 
     
         1 . An apparatus, comprising:
 a heat dissipation device including at least one surface area enhancement structure formed therein and/or thereon; and   at least one boiling enhancement material layer on at least a portion of the at least one surface area enhancement structure of the heat dissipation device.   
     
     
         2 . The apparatus of  claim 1 , wherein the heat dissipation device includes a first surface and an opposing second surface and wherein the at least one surface area enhancement structure comprises at least one projection extending from the second surface of the heat dissipation device. 
     
     
         3 . The apparatus of  claim 2 , wherein the at least one projection is defined by at least one sidewall and a top surface. 
     
     
         4 . The apparatus of  claim 3 , wherein the at least one boiling enhancement material layer contacts the at least one sidewall of the at least one projection without contacting the top surface of the at least one projection. 
     
     
         5 . The apparatus of  claim 4 , wherein the at least one boiling enhancement material layer contacts the second surface of the heat dissipation device. 
     
     
         6 . The apparatus of  claim 1 , wherein the heat dissipation device includes a first surface and an opposing second surface and wherein the at least one surface area enhancement structure comprises at least one opening extending into the heat dissipation device from the second surface thereof. 
     
     
         7 . The apparatus of  claim 6 , wherein the at least one opening is defined by at least one sidewall and a bottom surface, and wherein the at least one boiling enhancement material layer contacts the at least one sidewall and the bottom surface of the at least one opening. 
     
     
         8 . The apparatus of  claim 7 , wherein the at least one boiling enhancement material layer contacts with at least one sidewall and the bottom surface of the at least one opening without contacting the second surface of the heat dissipation device. 
     
     
         9 . The apparatus of  claim 6 , wherein the at least one surface area enhancement structure comprises at least one opening extending through the heat dissipation device from the first surface to the second surface thereof. 
     
     
         10 . An apparatus, comprising:
 an integrated circuit device having a first surface and an opposing second surface;   a heat dissipation device having a first surface and an opposing second surface, wherein the first surface of the heat dissipation device is thermally attached to the second surface of the integrated circuit device and wherein the heat dissipation device includes at least one surface area enhancement structure formed therein and/or thereon; and   at least one boiling enhancement material layer on at least a portion of the at least one surface area enhancement structure of the heat dissipation device.   
     
     
         11 . The apparatus of  claim 10 , wherein the at least one surface area enhancement structure comprises at least one projection extending from the second surface of the heat dissipation device. 
     
     
         12 . The apparatus of  claim 11 , wherein the at least one projection is defined by at least one sidewall and a top surface. 
     
     
         13 . The apparatus of  claim 12 , wherein the at least one boiling enhancement material layer contacts the at least one sidewall of the at least one projection without contacting the top surface of the at least one projection. 
     
     
         14 . The apparatus of  claim 13 , wherein the at least one boiling enhancement material layer contacts the second surface of the heat dissipation device. 
     
     
         15 . The apparatus of  claim 10 , wherein the at least one surface area enhancement structure comprises at least one opening extending into the heat dissipation device from the second surface thereof. 
     
     
         16 . The apparatus of  claim 15 , wherein the at least one opening is defined by at least one sidewall and a bottom surface, and wherein the at least one boiling enhancement material layer contacts the at least one sidewall and the bottom surface of the at least one opening. 
     
     
         17 . The apparatus of  claim 16 , wherein the at least one boiling enhancement material layer contacts with at least one sidewall and the bottom surface of the at least one opening without contacting the second surface of the heat dissipation device. 
     
     
         18 . The apparatus of  claim 15 , wherein the at least one surface area enhancement structure comprises at least one opening extending through the heat dissipation device from the first surface to the second surface thereof. 
     
     
         19 . A system, comprising:
 an electronic board; and   an integrated circuit package electrically attached to the electronic board, wherein the integrated circuit package comprises:
 an integrated circuit device having a first surface and an opposing second surface; 
 a heat dissipation device having a first surface and an opposing second surface, wherein the first surface of the heat dissipation device is thermally attached to the second surface of the integrated circuit device and wherein the heat dissipation device includes at least one surface area enhancement structure formed therein and/or thereon; and 
 at least one boiling enhancement material layer on at least a portion of the at least one surface area enhancement structure of the heat dissipation device. 
   
     
     
         20 . The system of  claim 19 , wherein the at least one surface area enhancement structure comprises at least one projection extending from the second surface of the heat dissipation device. 
     
     
         21 . The system of  claim 20 , wherein the at least one projection is defined by at least one sidewall and a top surface. 
     
     
         22 . The system of  claim 21 , wherein the at least one boiling enhancement material layer contacts the at least one sidewall of the at least one projection without contacting the top surface of the at least one projection. 
     
     
         23 . The system of  claim 19 , wherein the at least one surface area enhancement structure comprises at least one opening extending into the heat dissipation device from the second surface thereof. 
     
     
         24 . The system of  claim 23 , wherein the at least one opening is defined by at least one sidewall and a bottom surface, and wherein the at least one boiling enhancement material layer contacts the at least one sidewall and the bottom surface of the at least one opening. 
     
     
         25 . The system of  claim 23 , wherein the at least one surface area enhancement structure comprises at least one opening extending through the heat dissipation device from the first surface to the second surface thereof.