US2007230116A1PendingUtilityA1

Integrated circuit coolant microchannel with compliant cover

47
Individually held — no corporate assignee on recordPriority: Mar 1, 2005Filed: Jun 11, 2007Published: Oct 4, 2007
Est. expiryMar 1, 2025(expired)· nominal 20-yr term from priority
Inventors:Alan M. MyersJe-Young ChangRavi PrasherIoan SauciucGregory M. ChryslerPatrick D. BoydChia-Pin Chiu
H10W 40/47F28F 3/12
47
PatentIndex Score
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Claims

Abstract

An apparatus includes a microchannel structure having microchannels formed therein. The microchannels are to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. The apparatus also includes a cover positioned on the microchannel structure to define a respective upper wall of each of the microchannels. The cover presents a compliant surface to the microchannels.

Claims

exact text as granted — not AI-modified
1 . An apparatus comprising: 
 a microchannel structure having microchannels formed therein, said microchannels to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant; and    a cover positioned on the microchannel structure to define a respective upper wall of each of said microchannels, said cover presenting a compliant surface to said microchannels.    
   
   
       2 .- 5 . (canceled)  
   
   
       6 . The apparatus of  claim 1 , wherein said cover includes a flexible pad secured to said cover.  
   
   
       7 . The apparatus of  claim 6 , wherein said flexible pad is formed of rubber.  
   
   
       8 .- 22 . (canceled)  
   
   
       23 . An apparatus comprising: 
 an integrated circuit (IC); and    a microchannel assembly thermally coupled to the IC and having microchannels formed therein, each microchannel defined by a respective plurality of walls, at least one of said walls which defines said each microchannel being formed of a compliant material.    
   
   
       24 . (canceled)  
   
   
       25 . The apparatus of  claim 23 , wherein a respective upper wall of each of the microchannels is formed by a rubber pad.  
   
   
       26 . A system comprising: 
 a microprocessor integrated circuit die;    a microchannel structure thermally coupled to the microprocessor integrated circuit die, the microchannel structure having microchannels formed therein, said microchannels to transport a coolant;    a cover positioned on the microchannel structure to define a respective upper wall of each of said microchannels, said cover presenting a compliant surface to said microchannels; and    a chipset in communication with the microprocessor integrated circuit die.    
   
   
       27 . (canceled)  
   
   
       28 . The system of  claim 26 , wherein said cover includes a rubber pad secured to a lower surface of said cover.  
   
   
       29 .- 30 . (canceled)  
   
   
       31 . The apparatus of  claim 6 , wherein the cover includes a recess in which the flexible pad is located.  
   
   
       32 . The apparatus of  claim 6 , wherein the pad is formed of polydimethylsiloxane elastomer.  
   
   
       33 . The apparatus of  claim 25 , wherein the rubber pad is located in a recess in a cover.  
   
   
       34 . The system of  claim 28 , wherein the cover includes a recess in which the rubber pad is located.

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