Multi lead frame power package

Abstract

According to an embodiment of the invention, a system, operable to facilitate dissipation of thermal energy, includes a mold compound, a die, a first lead frame, and a second lead frame. The die is disposed within the mold compound, and in operation generates thermal energy. The first lead frame is disposed at least partially within the mold compound and is operable to facilitate transmission of a signal. The second lead frame is disposed at least partially within the compound, at least partially separated from the first lead frame, and is operable to facilitate a dissipation of thermal energy.

1 . A system for facilitating dissipation of thermal energy, the system comprising: 
 a mold compound;    a die disposed within the mold compound, the die in operation generating thermal energy; and    a first lead frame disposed at least partially within the mold compound, wherein 
 a wing of the first lead frame is external of the mold compound, and  
 the wing is operable to receive thermal energy dissipated from the die through the first lead frame.  
   
   
   
       2 . The system of  claim 1 , further comprising: 
 a thermal dissipation system, wherein    the wing is thermally coupled to the thermal dissipation system, and    the thermal dissipation system is operable to receive thermal energy dissipated to the wing.    
   
   
       3 . The system of  claim 2 , wherein the thermal dissipation system is a heat sink.  
   
   
       4 . The system of  claim 1 , further comprising: 
 a second lead frame disposed at least partially within the mold compound, wherein    the second lead frame is at least partially separated from the first lead frame, and    the second lead frame is operable to facilitate a dissipation of thermal energy.    
   
   
       5 . The system of  claim 4 , wherein at least one of the first lead frame and the second lead frame is positioned above the die and at least one of the first lead frame and the second lead frame is positioned below the die.  
   
   
       6 . The system of  claim 1 , further comprising: 
 a second lead frame disposed at least partially within the mold compound, wherein    the second lead frame is at least partially separated from the first lead frame, and    the second lead frame is operable to facilitate transmission of a signal.    
   
   
       7 . The system of  claim 6 , wherein at least one of the first lead frame and the second lead frame is positioned above the die and at least one of the first lead frame and the second lead frame is positioned below the die.  
   
   
       8 . The system of  claim 6 , wherein the first lead frame and the second lead frame are positioned below the die.  
   
   
       9 . A system, operable to facilitate dissipation of thermal energy, the system comprising: 
 a mold compound;    a die disposed within the mold compound, the die in operation generating thermal energy;    a first lead frame disposed at least partially within the mold compound, wherein the first lead frame is operable to facilitate transmission of a signal; and    a second lead frame disposed at least partially within the mold compound, wherein 
 the second lead frame is at least partially separated from the first lead frame, and  
 the second lead frame is operable to facilitate a dissipation of thermal energy.  
   
   
   
       10 . The system of  claim 9 , wherein at least one of the first lead frame and the second lead frame is positioned above the die and at least one of the first lead frame and the second lead frame is positioned below the die.  
   
   
       11 . The system of  claim 10 , wherein the second lead frame is disposed above the die and extends beyond the surface of the mold compound.  
   
   
       12 . The system of  claim 9 , wherein the first and the second lead frame are disposed below the die.  
   
   
       13 . The system of  claim 9 , further comprising: 
 a thermal dissipation system, wherein the second lead frame is thermally coupled to the thermal dissipation system.    
   
   
       14 . The system of  claim 9 , further comprising: 
 a third lead frame disposed at least partially within the mold compound, wherein    the third lead frame is at least partially separated from the first lead frame and the second lead frame, and    the third lead frame is operable to facilitate a dissipation of thermal energy.    
   
   
       15 . The system of  claim 14 , wherein at least one of the second and third lead frame is positioned above the die and at least one of the second and third lead frame is positioned below the die.  
   
   
       16 . The system of  claim 15 , further comprising: 
 a thermal dissipation system, wherein the second lead frame and the third lead frame are thermally coupled to the thermal dissipation system.    
   
   
       17 . A method of facilitating dissipation of thermal energy away from a die in an integrated circuit package with a mold compound, the method comprising: 
 thermally coupling a first lead frame to the die, wherein the first lead frame and the die are at least partially disposed in the mold compound, and the die generates thermal energy;    extending a wing of the first lead frame external of the mold compound; and    transferring at least a portion of the thermal energy through the first lead frame from the die to the wing.    
   
   
       18 . The method of  claim 17 , further comprising: 
 thermally coupling the wing to another object, wherein the at least a portion of the thermal energy transferred through the first lead frame from the die to the wing is further transferred to the other object.    
   
   
       19 . The method of  claim 18 , wherein the other object is a heat sink.  
   
   
       20 . The method of  claim 17 , further comprising: 
 thermally coupling a second lead frame to the die, wherein at least a portion of the thermal energy is transferred through the second lead frame.