Inventor · disambiguated record
Anthony L. Coyle
Also filed as: COYLE ANTHONY · COYLE ANTHONY L · COYLE ANTHONY LOUIS
26 granted patents·14 pending applications·857 citations·filing 1997–2013
97Inventor score
Files withTEXAS INSTRUMENTS INC29LANGE BERNHARD P2COYLE ANTHONY L1HAGA CHRIS EDWARD1HOLLOWAY JEFFERY GAIL1
Top patents by PatentIndex Score
40 records- 0198US6541832B2Plastic package for micromechanical devicesTEXAS INSTRUMENTS INC·Filed 2001·Granted Apr 1, 2003·203 cites·12 claims
- 0297US7335536B2Method for fabricating low resistance, low inductance interconnections in high current semiconductor devicesTEXAS INSTRUMENTS INC·Filed 2005·Granted Feb 26, 2008·49 cites·14 claims
- 0396US6518089B2Flip chip semiconductor device in a molded chip scale package (CSP) and method of assemblyTEXAS INSTRUMENTS INC·Filed 2001·Granted Feb 11, 2003·114 cites·18 claims
- 0496US6489178B2Method of fabricating a molded package for micromechanical devicesTEXAS INSTRUMENTS INC·Filed 2001·Granted Dec 3, 2002·111 cites·13 claims
- 0595US7608484B2Non-pull back pad package with an additional solder standoffTEXAS INSTRUMENTS INC·Filed 2006·Granted Oct 27, 2009·41 cites·13 claims
- 0692US6858910B2Method of fabricating a molded package for micromechanical devicesTEXAS INSTRUMENTS INC·Filed 2002·Granted Feb 22, 2005·59 cites·16 claims
- 0791US6696757B2Contact structure for reliable metallic interconnectionTEXAS INSTRUMENTS INC·Filed 2002·Granted Feb 24, 2004·46 cites·14 claims
- 0889US7026710B2Molded package for micromechanical devices and method of fabricationTEXAS INSTRUMENTS INC·Filed 2001·Granted Apr 11, 2006·53 cites·9 claims
- 0987US7863098B2Flip chip package with advanced electrical and thermal properties for high current designsTEXAS INSTRUMENTS INC·Filed 2008·Granted Jan 4, 2011·13 cites·6 claims
- 1087US6049129AChip size integrated circuit packageTEXAS INSTRUMENTS INC·Filed 1997·Granted Apr 11, 2000·108 cites·36 claims
- 1181US7476976B2Flip chip package with advanced electrical and thermal properties for high current designsTEXAS INSTRUMENTS INC·Filed 2006·Granted Jan 13, 2009·9 cites·12 claims
- 1278USRE46466EMethod for fabricating low resistance, low inductance interconnections in high current semiconductor devicesLANGE BERNHARD P·Filed 2010·Granted Jul 4, 2017·4 cites·30 claims
- 1371US8232144B2Non-pull back pad package with an additional solder standoffLANGE BERNHARD P·Filed 2009·Granted Jul 31, 2012·4 cites·8 claims
- 1467US8053876B2Multi lead frame power packageTEXAS INSTRUMENTS INC·Filed 2009·Granted Nov 8, 2011·2 cites·7 claims
- 1566US8039956B2High current semiconductor device system having low resistance and inductanceTEXAS INSTRUMENTS INC·Filed 2005·Granted Oct 18, 2011·3 cites·12 claims
- 1663US6753616B2Flip chip semiconductor device in a molded chip scale packageTEXAS INSTRUMENTS INC·Filed 2002·Granted Jun 22, 2004·9 cites·16 claims
- 1761US7256482B2Integrated circuit chip packaging assemblyTEXAS INSTRUMENTS INC·Filed 2004·Granted Aug 14, 2007·8 cites·8 claims
- 1861US6586676B2Plastic chip-scale package having integrated passive componentsTEXAS INSTRUMENTS INC·Filed 2001·Granted Jul 1, 2003·9 cites·15 claims
- 1958US8053285B2Thermally enhanced single inline package (SIP)TEXAS INSTRUMENTS INC·Filed 2009·Granted Nov 8, 2011·1 cites·13 claims
- 2058US7612437B2Thermally enhanced single inline package (SIP)TEXAS INSTRUMENTS INC·Filed 2007·Granted Nov 3, 2009·1 cites·12 claims
- 2156USRE48420EMethod for fabricating low resistance, low inductance interconnections in high current semiconductor devicesTEXAS INSTRUMENTS INC·Filed 2013·Granted Feb 2, 2021·0 cites·34 claims
- 2256USRE46618EMethod for fabricating low resistance, low inductance interconnections in high current semiconductor devicesTEXAS INSTRUMENTS INC·Filed 2013·Granted Nov 28, 2017·0 cites·30 claims
- 2354US7084494B2Semiconductor package having integrated metal parts for thermal enhancementTEXAS INSTRUMENTS INC·Filed 2004·Granted Aug 1, 2006·5 cites·16 claims
- 2454US6916689B2Plastic chip-scale package having integrated passive componentsTEXAS INSTRUMENTS INC·Filed 2003·Granted Jul 12, 2005·5 cites·15 claims
- 2551US7488623B2Integrated circuit chip packaging assemblyTEXAS INSTRUMENTS INC·Filed 2007·Granted Feb 10, 2009·0 cites·4 claims
- 2651US2008020517A1Multi Lead Frame Power PackageTEXAS INSTRUMENTS INC·Filed 2007·Application pending·0 cites
- 2747US2006131734A1Multi lead frame power packageTEXAS INSTRUMENTS INC·Filed 2005·Application pending·0 cites
- 2846US2006226521A1Semiconductor Package Having Integrated Metal Parts for Thermal EnhancementCOYLE ANTHONY L·Filed 2006·Application pending·0 cites
- 2944US8154117B2High power integrated circuit device having bump padsWIKTOR STEFAN W·Filed 2008·Granted Apr 10, 2012·0 cites·19 claims
- 3043US2004150105A1Contact structure for reliable metallic interconnectionFiled 2004·Application pending·0 cites
- 3143US2008135990A1Stress-improved flip-chip semiconductor device having half-etched leadframeTEXAS INSTRUMENTS INC·Filed 2006·Application pending·0 cites
- 3243US2008157299A1Microelectronic Assembly Using Chip-On-Lead (COL) and Cantilever LeadsHOLLOWAY JEFFERY GAIL·Filed 2006·Application pending·0 cites
- 3341US2008079124A1Interdigitated leadfingersHAGA CHRIS EDWARD·Filed 2007·Application pending·0 cites
- 3441US2010171201A1Chip on lead with small power pad designWYANT M TODD·Filed 2009·Application pending·0 cites
- 3540US2007296056A1Integrated Circuits Having Controlled InductancesTEXAS INSTRUMENTS INC·Filed 2006·Application pending·0 cites
- 3638US2007090533A1Closed loop thermally enhanced flip chip BGATEXAS INSTRUMENTS INC·Filed 2005·Application pending·0 cites
- 3738US2005110137A1Plastic dual-in-line packaging (PDIP) having enhanced heat dissipationTEXAS INSTRUMENTS INC·Filed 2003·Application pending·0 cites
- 3837US2005151268A1Wafer-level assembly method for chip-size devices having flipped chipsFiled 2004·Application pending·0 cites
- 3935US2002084521A1Flip-chip on film assembly for ball grid array packagesFiled 2001·Application pending·0 cites
- 4033US2003090558A1Package for printhead chipFiled 2002·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Anthony L. Coyle files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →