Assignee
LANGE BERNHARD P
DE·2 granted patents·4 pending applications·8 citations·filing 2005–2010
Top patents by PatentIndex Score
6 records- 0178USRE46466EMethod for fabricating low resistance, low inductance interconnections in high current semiconductor devicesLANGE BERNHARD P·Filed 2010·Granted Jul 4, 2017·4 cites·30 claims
- 0271US8232144B2Non-pull back pad package with an additional solder standoffLANGE BERNHARD P·Filed 2009·Granted Jul 31, 2012·4 cites·8 claims
- 0347US2006211175A1Heatsink apparatus and thermally-conductive intermediate material for dissipating heat in semiconductor packagesLANGE BERNHARD P·Filed 2006·Application pending·0 cites
- 0446US2006038202A1Heatsink apparatus and thermally-conductive intermediate material for dissipating heat in semiconductor packagesLANGE BERNHARD P·Filed 2005·Application pending·0 cites
- 0539US2006166381A1Mold cavity identification markings for IC packagesLANGE BERNHARD P·Filed 2005·Application pending·0 cites
- 0638US2006197199A1Leadframe, coining tool, and methodLANGE BERNHARD P·Filed 2005·Application pending·0 cites
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