Multi Lead Frame Power Package

Abstract

According to an embodiment of the invention, a system, operable to facilitate dissipation of thermal energy, includes a mold compound, a die, a first lead frame, and a second lead frame. The die is disposed within the mold compound, and in operation generates thermal energy. The first lead frame is disposed at least partially within the mold compound and is operable to facilitate transmission of a signal. The second lead frame is disposed at least partially within the compound, at least partially separated from the first lead frame, and is operable to facilitate a dissipation of thermal energy.

1 . A manufacture, comprising: 
 a packaged integrated circuit including a die encapsulated in a mold compound;    a first lead frame including a first pad and leads;    a surface of the die attached to the first pad and electrically connected to the leads; and    a second lead frame including a second pad attached to the first pad.    
   
   
       2 . The manufacture of  claim 1 , in which 
 the first lead frame and the second lead frame are disposed at least partially within the mold compound; and    the second lead frame further comprises wings exposed from the mold compound.    
   
   
       3 . The manufacture of  claim 2 , further comprising a heat sink exposed from the mold compound and thermally coupled to the wings.  
   
   
       4 . The manufacture of  claim 1 , in which the electrical connection comprises wire-bond.  
   
   
       5 . A process comprising: 
 providing a die;    providing a first lead frame including a first pad and leads;    providing a second lead frame including a second pad and wings;    attaching a surface of the die to the first pad;    electrically connecting the die to the leads;    attaching the second pad to the first pad;    encapsulating the die in a molding compound, thereby    encapsulating at least partially the first lead frame and at least partially the second lead frame in the mold compound and exposing the wings from the mold compound.    
   
   
       6 . The process of  claim 5 , further comprising thermally coupling the wing to a heat sink exposed from the mold compound, wherein thermal energy transferred through the first lead frame from the die to the wing is further transferred to the heat sink.  
   
   
       7 . The process of  claim 5 , in which electrically connecting includes wire-bonding.