Soft thin laminated substrate

Abstract

A soft thin laminated substrate including a plastic substrate, an alloy copper layer overlaid on the plastic substrate and a copper foil overlaid on the alloy copper layer. The alloy copper layer is an alloy of copper metal and at least one of nickel, chromium, manganese, molybdenum, iron and phosphorus. The alloy copper layer serves as a tie-coating of the copper foil, whereby the copper foil can tightly attach to the alloy copper layer to associate with the plastic substrate and form the soft thin laminated substrate.

1 . A polymeric substrate comprising: a plastic substrate; an alloy copper layer overlaid on the plastic substrate, the alloy copper layer being disposed on the plastic substrate by way of vacuum physical coating, the alloy copper layer having a thickness within 10˜10000 angstroms, the alloy copper layer being an alloy containing copper metal ranging from 0.1 to 99.95 weight % in said alloy and at least one of manganese, molybdenum, and phosphorus; and a copper foil overlaid on the alloy copper layer by vacuum physical coating.  
     
     
         2 . The polymeric substrate as claimed in  claim 1 , wherein the copper foil is composed of copper metal ranging from 10 to 99.95 weight % and at least one of materials from the group of materials consisting of nickel, chromium, manganese, molybdenum, and phosphorus.  
     
     
         3 . The polymeric substrate as claimed in  claim 1 , wherein the plastic substrate is made of a material from the group of materials consisting of PI, PET, PC and PMMA.