US2006168802A1PendingUtilityA1

Wireless identification device, RFID device with push-on/push-off switch, and method of manufacturing wireless identification device

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Assignee: TUTTLE MARK EPriority: Oct 3, 1997Filed: Jan 17, 2006Published: Aug 3, 2006
Est. expiryOct 3, 2017(expired)· nominal 20-yr term from priority
Inventors:Mark E. Tuttle
G06K 19/0716G06K 19/0723G06K 19/07345G06K 19/07749H01H 2231/05H01Q 7/00H01Q 9/16H01Q 21/28Y10T29/49117Y10T29/49018Y10T29/49004Y10T29/49016
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Claims

Abstract

A wireless identification device including a housing; circuitry in the housing configured to provide a signal to identify the device in response to an interrogation signal; and a selectively actuated switch supported by the housing and controlling whether the circuitry identifies the device. A method of manufacturing a wireless identification device, the method comprising configuring circuitry to provide a signal to identify the device in response to an interrogation signal; coupling the circuitry to a push-on/push-off switch supported by the housing and controlling whether the circuitry provides the signal to identify the device; and encasing the circuitry in a housing such that the switch is actuable from outside the housing by touching a portion of the housing.

Claims

exact text as granted — not AI-modified
1 . A method of manufacturing a wireless identification device, the method comprising: 
 supporting circuitry on a film substrate to provide a signal to identify the device in response to an interrogation signal;    coupling the circuitry to a power supply;    causing the circuitry to stop providing the signal to identify the device in response to receiving an off signal; and    flowing an encapsulant over the circuitry to define a housing including the encapsulant and the substrate.    
     
     
         2 . A method of manufacturing a wireless identification device in accordance with  claim 1  wherein the circuitry includes a backscatter transmitter.  
     
     
         3 . A method of manufacturing a wireless identification device in accordance with  claim 1 , wherein the circuitry is configured to provide a backscatter signal to identify the device in response to the interrogation signal.  
     
     
         4 . A method of manufacturing a wireless identification device in accordance with  claim 1 , wherein the substrate is a polyester substrate.  
     
     
         5 . A method of manufacturing a radio frequency identification device, the method comprising: 
 supporting circuitry on a film substrate, the circuitry being configured to provide an RF backscatter signal to identify the device in response to an RF interrogation signal from an interrogator, the circuitry being configured to, in response to an off signal, stop providing the RF signal to identify the device in response to RF interrogation;    coupling the circuitry to a power supply; and    flowing an encapsulant over the circuitry to define a housing including the encapsulant and the substrate.    
     
     
         6 . A method of manufacturing a radio frequency identification device in accordance with  claim 5  wherein the circuitry includes volatile memory.  
     
     
         7 . A method of manufacturing a radio frequency identification device in accordance with  claim 5  wherein the power supply comprises a coil configured to receive power from an interrogator by magnetic coupling.  
     
     
         8 . A method of manufacturing a radio frequency identification device in accordance with  claim 5  wherein the substrate is a polyester film substrate.  
     
     
         9 . A method of manufacturing a radio frequency identification device in accordance with  claim 5  wherein the circuitry includes an integrated circuit including a transmitter and a receiver.  
     
     
         10 . A method of manufacturing a radio frequency identification device in accordance with  claim 9  wherein the circuitry includes printed thick film formed over the substrate.  
     
     
         11 . A method of manufacturing a radio frequency identification device in accordance with  claim 5  wherein the circuitry includes printed thick film formed over the substrate.  
     
     
         12 . A method of manufacturing a radio frequency identification device in accordance with  claim 5  wherein the circuitry is configured to provide the signal to identify the device to the interrogator by magnetic coupling.  
     
     
         13 . A wireless identification device comprising: 
 a film substrate;    circuitry supported on the film substrate, the circuitry being configured to provide an wireless signal to identify the device in response to a wireless interrogation signal from an interrogator, the circuitry being further configured to, in response to an off signal, stop providing the wireless signal to identify the device in response to wireless interrogation;    a power supply coupled to the circuitry; and    an encapsulant over the circuitry and defining, with the film substrate, a housing.    
     
     
         14 . A wireless identification device in accordance with  claim 13  wherein the circuitry includes volatile memory.  
     
     
         15 . A wireless identification device in accordance with  claim 13  wherein the circuitry is configured to provide the signal to identify the device to the interrogator by magnetic coupling.  
     
     
         16 . A wireless identification device in accordance with  claim 13  wherein the circuitry includes a coil configured to receive power from an interrogator by magnetic coupling.  
     
     
         17 . A wireless identification device in accordance with  claim 13  wherein the substrate is a polyester film substrate.  
     
     
         18 . A wireless identification device in accordance with  claim 13  wherein the circuitry includes an integrated circuit including a transmitter and a receiver.  
     
     
         19 . A wireless identification device in accordance with  claim 18  wherein the circuitry includes printed thick film formed over the substrate.  
     
     
         20 . A wireless identification device in accordance with  claim 13  wherein the circuitry includes printed thick film formed over the substrate.  
     
     
         21 . A method of using a wireless identification device including a film substrate; circuitry supported on the film substrate, the circuitry being configured to provide an wireless signal to identify the device in response to a wireless interrogation signal from an interrogator, the circuitry being further configured to, in response to an off signal, stop providing the wireless signal to identify the device in response to wireless interrogation; a power supply coupled to the circuitry; and an encapsulant over the circuitry and defining, with the film substrate, a housing, the method comprising: 
 receiving, at the device, a signal indicative of a desire by a user that the circuitry cease identifying the device to an interrogator; and    in response to the cease identifying signal, the circuitry ceasing to provide the wireless signal to identify the device responsive to wireless interrogation.    
     
     
         22 . A method in accordance with  claim 21  wherein the substrate is a polyester substrate.  
     
     
         23 . A method in accordance with  claim 21  wherein the circuitry includes volatile memory.  
     
     
         24 . A method in accordance with  claim 21  wherein the circuitry is configured to provide the signal to identify the device to the interrogator by magnetic coupling.  
     
     
         25 . A method in accordance with  claim 21  wherein the circuitry includes a coil configured to receive power from an interrogator by magnetic coupling.  
     
     
         26 . A method in accordance with  claim 21  wherein the circuitry includes an integrated circuit including a transmitter and a receiver.  
     
     
         27 . A method in accordance with  claim 26  wherein the circuitry includes printed thick film formed over the substrate.  
     
     
         28 . A method in accordance with  claim 21  wherein the circuitry includes printed thick film formed over the substrate.  
     
     
         29 . A wireless identification device comprising: 
 means defining a flexible substrate;    circuitry supported on the film substrate, the circuitry including means for providing an wireless signal to identify the device in response to a wireless interrogation signal from an interrogator, the circuitry being further configured to, in response to an off signal, stop providing the wireless signal to identify the device in response to wireless interrogation;    means for supplying power supply to the circuitry; and    means, including an encapsulant over the circuitry, defining a housing with the film substrate.    
     
     
         30 . A wireless identification device in accordance with  claim 29  wherein the means defining a flexible substrate comprises polyester.  
     
     
         31 . A wireless identification device in accordance with  claim 29  wherein the circuitry includes volatile memory.  
     
     
         32 . A wireless identification device in accordance with  claim 29  wherein the circuitry is configured to provide the signal to identify the device to the interrogator by magnetic coupling.  
     
     
         33 . A wireless identification device in accordance with  claim 29  wherein the circuitry includes a coil configured to receive power from an interrogator by magnetic coupling.  
     
     
         34 . A wireless identification device in accordance with  claim 29  wherein the means defining a flexible substrate comprises a polyester film.  
     
     
         35 . A wireless identification device in accordance with  claim 29  wherein the circuitry includes an integrated circuit including a transmitter and a receiver.  
     
     
         36 . A wireless identification device in accordance with  claim 29  wherein the circuitry includes printed thick film formed over the substrate means.  
     
     
         37 . A wireless identification device in accordance with  claim 35  wherein the circuitry includes printed thick film formed over the substrate.

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