Method of embedding semiconductor element in carrier and embedded structure thereof

Abstract

A method of embedding a semiconductor element in a carrier and an embedded structure thereof are proposed. First, a carrier having a hole is provided and an auxiliary material is attached to a side of the carrier. A semiconductor element is placed in the hole of the carrier. Then, a medium material and glue are applied in order in the hole to firmly position the semiconductor element in the hole of the carrier via the glue. Finally, the auxiliary material and the medium material are removed to form a structure with the semiconductor element being embedded in the carrier, thereby eliminating the drawbacks encountered in packing the semiconductor element in the prior art.

1 - 23 . (canceled)  
     
     
         24 . An embedded structure with a semiconductor element embedded in a carrier, comprising: 
 a carrier having at least one hole;    at least one semiconductor element mounted in the hole; and    glue formed in a gap between the semiconductor element and the hole, wherein a surface of the glue, which is located at the same side as an active surface of the semiconductor element, is lower in height than the active surface of the semiconductor element and a surface of the carrier located at the same side as the active surface of the semiconductor element, and the glue fixes the semiconductor element in position in the hole.    
     
     
         25 . The embedded structure of  claim 24 , wherein the semiconductor element is a semiconductor chip.  
     
     
         26 . The embedded structure of  claim 24 , wherein the carrier is one selected from the group consisting of an insulating board, metal board, and circuit board.  
     
     
         27 . The embedded structure of  claim 24 , wherein the glue is one selected from the group consisting of a thermosetting adhesive, ABF, and PP.