US2006205117A1PendingUtilityA1

Solder masks used in encapsulation, assemblies including the solar mask, and methods

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Individually held — no corporate assignee on recordPriority: Jul 22, 2002Filed: May 15, 2006Published: Sep 14, 2006
Est. expiryJul 22, 2022(expired)· nominal 20-yr term from priority
Inventors:Ford B. GriggWilliam Reeder
H10W 90/754H10W 90/734H10W 72/951H10W 72/865H10W 72/551H10W 72/075H10W 72/073H10W 90/701H10W 76/47H10W 70/635H10W 70/68B33Y 80/00
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Claims

Abstract

A carrier (e.g., a carrier substrate, such as a circuit board, etc.) may be modified to include a solder mask on a surface thereof. The solder mask, which may extend to or beyond an edge of the carrier, includes an opening that exposes at least one contact area of the carrier. The opening of the solder mask is configured and positioned such that a conductive element (e.g., a bond wire), at least a portion of which extends laterally, that may protrude from the contact area will be at least partially laterally surrounded by the solder mask. A retention element may be secured to the solder mask, over the conductive element and a portion of the opening of the solder mask, with a portion of the opening remaining exposed beyond the retention element to facilitate the introduction of encapsulant material into the opening and around the conductive element. Assemblies that include these features and assembly methods are also disclosed.

Claims

exact text as granted — not AI-modified
1 . A method for preparing a semiconductor device assembly for at least partial packaging, comprising: 
 disposing a solder mask over a carrier, at least partially laterally around an extent of at least one at least partially laterally extending intermediate conductive element that protrudes beyond a plane within which a surface of the carrier is located; and    securing a retention element to the solder mask, over the at least one at least partially laterally extending intermediate conductive element, with an opening remaining so that encapsulant material may be introduced at least partially onto the at least one at least partially laterally extending intermediate conductive element.    
     
     
         2 . The method of  claim 1 , wherein disposing comprises disposing the solder mask such that the at least one at least partially laterally extending intermediate conductive element is located within at least one at least partially laterally confined opening through the solder mask.  
     
     
         3 . The method of  claim 1 , further comprising: 
 securing at least one semiconductor device to the carrier and electrically connecting at least one bond pad of the at least one semiconductor device and a corresponding contact of the carrier with the at least one at least partially laterally extending intermediate conductive element.    
     
     
         4 . The method of  claim 3 , wherein electrically connecting comprises disposing the at least one at least partially extending intermediate conductive element through a plane that extends through the carrier.  
     
     
         5 . The method of  claim 1 , wherein disposing comprises positioning a preformed solder mask on a surface of the carrier.  
     
     
         6 . The method of  claim 5 , wherein disposing further includes securing the preformed solder mask to the surface.  
     
     
         7 . The method of  claim 1 , wherein disposing comprises forming the solder mask on a surface of the carrier.  
     
     
         8 . The method of  claim 7 , wherein forming comprises forming the solder mask from a photoimageable material.  
     
     
         9 . The method of  claim 8 , wherein forming comprises forming the solder mask from a photoresist.  
     
     
         10 . The method of  claim 7 , wherein forming comprises forming the solder mask by consolidating unconsolidated material in accordance with a program.  
     
     
         11 . The method of  claim 1 , wherein disposing comprises disposing a solder mask having a thickness that exceeds a height the at least one at least partially laterally extending intermediate conductive element protrudes beyond the plane within which the surface of the carrier is located.  
     
     
         12 . The method of  claim 1 , further comprising: 
 positioning at least one aperture of the solder mask over at least one contact of the carrier.    
     
     
         13 . The method of  claim 12 , further comprising: 
 disposing conductive material within the at least one aperture.    
     
     
         14 . A method for protecting intermediate conductive elements of a semiconductor device assembly, comprising: 
 disposing a solder mask over a carrier, at least partially laterally around an extent of at least one at least partially laterally extending intermediate conductive element that protrudes beyond a plane within which a surface of the carrier is located;    securing a retention element to the solder mask, over the at least one at least partially laterally extending intermediate conductive element, with at least one opening in flow communication with the at least one at least laterally extending intermediate conductive element remaining; and    introducing encapsulant into the at least one opening, beneath the retention element, and into onto at least a portion of the at least one at least laterally extending intermediate conductive element.    
     
     
         15 . The method of  claim 14 , further comprising: 
 removing the retention element following the act of introducing.    
     
     
         16 . The method of  claim 14 , further comprising: 
 removing the solder mask following the act of introducing.    
     
     
         17 . The method of  claim 14 , wherein disposing comprises disposing the solder mask such that the at least one at least partially laterally extending intermediate conductive element is located within at least one at least partially laterally confined opening through the solder mask.  
     
     
         18 . The method of  claim 14  further comprising: 
 securing at least one semiconductor device to the carrier and electrically connecting at least one bond pad of the at least one semiconductor device and a corresponding contact of the carrier with the at least one at least partially laterally extending intermediate conductive element.    
     
     
         19 . The method of  claim 18 , wherein electrically connecting comprises disposing the at least one at least partially extending intermediate conductive element through a plane that extends through the carrier.  
     
     
         20 . The method of  claim 14 , wherein disposing comprises positioning a preformed solder mask on a surface of the carrier.  
     
     
         21 . The method of  claim 20 , wherein disposing further includes securing the preformed solder mask to the surface.  
     
     
         22 . The method of  claim 14 , wherein disposing comprises forming the solder mask on a surface of the carrier.  
     
     
         23 . The method of  claim 22 , wherein forming comprises forming the solder mask from a photoimageable material.  
     
     
         24 . The method of  claim 23 , wherein forming comprises forming the solder mask from a photoresist.  
     
     
         25 . The method of  claim 22 , wherein forming comprises forming the solder mask by consolidating unconsolidated material in accordance with a program.  
     
     
         26 . The method of  claim 14 , wherein disposing comprises disposing a solder mask having a thickness that exceeds a height the at least one at least partially laterally extending intermediate conductive element protrudes beyond the plane within which the surface of the carrier is located.  
     
     
         27 . The method of  claim 14 , further comprising: 
 positioning at least one aperture of the solder mask over at least one contact of the carrier.    
     
     
         28 . The method of  claim 27 , further comprising: 
 disposing conductive material within the at least one aperture.    
     
     
         29 . A method for modifying a carrier, comprising: 
 providing a carrier including at least one contact area on a surface thereof; and    disposing a solder mask including an opening on the surface of the carrier, with an edge of the solder mask extending to an edge of the carrier and the at least one contact area of the carrier exposed through the opening.    
     
     
         30 . The method of  claim 29 , wherein disposing includes positioning a preformed solder mask on the surface of the carrier.  
     
     
         31 . The method of  claim 30 , wherein disposing further includes securing the preformed solder mask to the surface of the carrier.  
     
     
         32 . The method of  claim 29 , wherein disposing comprises forming the solder mask on the surface of the carrier.  
     
     
         33 . The method of  claim 32 , wherein forming comprises forming the solder mask from a photoimageable material.  
     
     
         34 . The method of  claim 33 , wherein forming comprises forming the solder mask from a photoresist.  
     
     
         35 . The method of  claim 32 , wherein forming comprises forming the solder mask by consolidating unconsolidated material in accordance with a program.  
     
     
         36 . The method of  claim 29 , wherein disposing comprises locating at least one aperture of the solder mask at least partially over a contact exposed at the surface of the carrier.  
     
     
         37 . A semiconductor device assembly, comprising: 
 a carrier including a substantially planar structure and at least one first contact exposed at a first surface of the substantially planar structure; and    a solder mask positioned on the first surface, extending to an outer peripheral edge of the first surface, and comprising at least one opening for laterally surrounding at least a portion of at least one intermediate conductive element, at least a portion of which extends laterally, protruding beyond a plane in which the first surface of the carrier is located, the at least one first contact area of the carrier being exposed through the at least one opening.    
     
     
         38 . The semiconductor device assembly of  claim 37 , wherein at least one opening is formed through the substantially planar structure of the carrier.  
     
     
         39 . The semiconductor device assembly of  claim 38 , wherein the first contact is exposed at a location proximate to the at least one opening of the carrier.  
     
     
         40 . The semiconductor device assembly of  claim 39 , wherein the at least one opening of the carrier is at least partially exposed through the at least one opening of the solder mask.  
     
     
         41 . The semiconductor device assembly of  claim 40 , further comprising: 
 at least one semiconductor device secured to a second surface of the carrier opposite the first surface thereof, at least one bond pad of the at least one semiconductor device exposed through said the at least one opening of the solder mask and the at least one opening of the carrier.    
     
     
         42 . The semiconductor device assembly of  claim 41 , further comprising: 
 at least one intermediate conductive element extending between the at least one bond pad and the at least one first contact area.    
     
     
         43 . The semiconductor device assembly of  claim 42 , wherein a thickness of the solder mask exceeds a distance the at least one intermediate conductive element protrudes beyond the plane in which the first surface of the carrier is located.  
     
     
         44 . The semiconductor device assembly of  claim 42 , further comprising: 
 encapsulant material within the at least one opening of the substantially planar structure of the carrier and the at least one opening of the solder mask.    
     
     
         45 . The semiconductor device assembly of  claim 44 , wherein a surface of the encapsulant material is substantially level with an outer surface of the solder mask.  
     
     
         46 . The semiconductor device assembly of  claim 37 , wherein the carrier includes at least one second contact area on the first surface thereof.  
     
     
         47 . The semiconductor device assembly of  claim 46 , wherein the at least one second contact area is at least partially exposed through an aperture of the solder mask.  
     
     
         48 . The semiconductor device assembly of  claim 47 , further comprising: 
 at least one discrete conductive element protruding from the at least one second contact and extending beyond a surface of the solder mask.    
     
     
         49 . The semiconductor device assembly of  claim 37 , wherein the solder mask comprises a material with a coefficient of thermal expansion substantially the same as a material of the carrier.  
     
     
         50 . The semiconductor device assembly of  claim 37 , wherein the solder mask comprises an insulative material.  
     
     
         51 . The semiconductor device assembly of  claim 37 , wherein the solder mask comprises a cured photoimageable material.  
     
     
         52 . The semiconductor device assembly of  claim 37 , wherein the solder mask includes a plurality of adjacent, mutually adhered regions.  
     
     
         53 . The semiconductor device assembly of  claim 37 , further comprising: 
 a retaining element over a portion of the opening of the solder mask.

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