Method of manufacturing enhanced thermal dissipation integrated circuit package

Abstract

The present invention relates to an integrated circuit package having a thermally conductive element thermally coupled to a semiconductor die and a heat sink, and a method of manufacturing said integrated circuit package. The thermally conductive element is integrated into the package to enhance thermal dissipation characteristics of the package.

1 . A method of manufacturing an integrated circuit package, comprising: 
 installing a carrier onto an upper surface of a substrate, wherein said carrier defines a cavity;    attaching a semiconductor die to said upper surface of said substrate within said cavity of said carrier;    aligning an assembly over said semiconductor die, wherein said assembly comprises a heat sink and a thermally conductive element;    resting said assembly on said carrier such that said thermally conductive element does not directly contact said semiconductor die; and    encapsulating said cavity to form a prepackage such that a portion of said heat sink is exposed to the surroundings of said package.    
   
   
       2 . The method of  claim 1 , wherein said assembly is rested on said carrier such that said thermally conductive element and said semiconductor die are separated by a distance of about five (5) mils or less.  
   
   
       3 . The method of  claim 1 , wherein said attaching said semiconductor die to said upper surface of said substrate is by a direct chip attachment.  
   
   
       4 . The method of  claim 1 , further comprising singulating said prepackage to form said package, wherein a top portion and a side portion of said heat sink are exposed to the surroundings of said package.  
   
   
       5 . A method of manufacturing an integrated circuit package, comprising: 
 installing a carrier onto a substrate;    attaching a semiconductor die to said substrate;    aligning an assembly over said semiconductor die, wherein said assembly comprises a heat sink and a thermally conductive element;    resting said assembly on said carrier such that said thermally conductive element does not directly contact said semiconductor die; and    encapsulating said thermally conductive element and said heat sink such that a portion of said heat sink is exposed to the surroundings of said package.