Inventor · disambiguated record
Tai Wai Pun
Also filed as: PUN TAI W · PUN TAI WAI · PUN TAI WAI DAVID
4 granted patents·1 pending application·303 citations·filing 2001–2012
78Inventor score
Top patents by PatentIndex Score
5 records- 0194US6734552B2Enhanced thermal dissipation integrated circuit packageASAT LTD·Filed 2001·Granted May 11, 2004·241 cites·24 claims
- 0287US7015072B2Method of manufacturing an enhanced thermal dissipation integrated circuit packageASAT LTD·Filed 2004·Granted Mar 21, 2006·54 cites·18 claims
- 0379US8430579B2Camera module with molded tape flip chip imager mount and method of manufactureTAM SAMUEL WAISING·Filed 2011·Granted Apr 30, 2013·8 cites·57 claims
- 0438US2006223237A1Method of manufacturing enhanced thermal dissipation integrated circuit packageCOMBS EDWARD G·Filed 2006·Application pending·0 cites
- 0537US9178093B2Solar cell module on molded lead-frame and method of manufactureTAM SAMUEL WAISING·Filed 2012·Granted Nov 3, 2015·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →